Posts Tagged ‘automotive’

ARM Unveils Cortex A17 Processor, First Used in Mediatek MT6595 and Rockchip RK3288 SoCs

February 11th, 2014 15 comments

Finally all these ARM Cortex A17 marketing materials for Rockchip RK3288 were not some typos, but Rockchip marketing team may just have not received the memo reading “Confidential”, as ARM has now officially announced Cortex A17 processor based on ARMv7-A architecture, with support for big.LITTLE with Cortex A7, and that can be coupled with Mali-T720 mid-range GPU and Mali-V500 VPU.

ARM_Cortex_A17After Cortex A15, and Cortex A12, you may wonder “Why? But Why did ARM had to launch yet another new core?”. Here’s the company answer to that question:

The Cortex-A17 processor offers 60% performance uplift over the Cortex-A9 processor, the current leader in mid-range mobile market, and betters the best efficiency enabling optimized solutions to address existing and new products. The Cortex-A17 processor is based on the popular ARMv7-A architecture, today’s most successful architecture in the mobile market. With over 1M apps supporting the ARMv7-A architecture, the Cortex-A17 processor is primed to bring the high-end performance levels of 2014 to next generation mid-range devices in 2015, with further increased efficiency for enabling a better user experience.

The Cortex-A17 processor is scalable up to 4 cores, each offering a full out-of-order pipeline delivering peak performance of today’s premium performance levels. A fully integrated, low-latency L2 cache controller, accelerator interfaces to target specific use cases, and high-throughput AMBA 4 ACE Coherent Bus Interface enable the Cortex-A17 processor to be tailored for the right task. Its modern design is best complemented with the latest advanced IP like ARM Mali-T720 GPU, ARM Mali-DP500 DPU, and ARM Mali-V500 VPU and CoreLink CCI-400, but is also fully backwards compatible to existing AMBA3 and AMBA4 AXI based systems based on ARM Mali-450 GPU and CoreLink NIC-400 to ease integration and time-to-market.

The Cortex-A17 processor, in combination with its high-efficiency counterpart Cortex-A7 processor, provides an ideal solution for mobile devices in 2015 and beyond, bringing the heterogeneous processing benefits of big.LITTLE Global Task Switching (GTS) to the mid-range market. Coupled with CoreLink System IP components like the CoreLink CCI-400 interconnect, Cortex-A17 and Cortex-A7 processors are the foundation for upcoming devices that are more efficient and higher performance than any solution in this class before.

I’m not quite satisfied by that answer… No comparison with Cortex A12 or A15. I’m guessing they’ve probably made some power consumption improvements compared to Cortex A15 which dissipates a lot of heat. Looking at the different cores specifications on ARM website do not find meaningful differences. Nevertheless, Cortex A17 will be used in SoC used in mobile devices (smartphones and tablets), smart TVs, over-the-top devices, automotive infotainment, and other consumer oriented markets, and seems to be used as a Cortex A9 replacement.

The first SoC officially announced with Cortex A17 is Mediatek MT6595 (which somehow will become MTK6595 on many sites) an Octacore mobile SoC with 4x Cortex A17, 4x Cortex A7 in big.LITTLE configuration fully supporting Heterogeneous Multi-Processing (HMP) with Imagination PowerVR Series6 GPU, H.265 UHD decoding and encoding support, and an LTE modem. Mediatek MT6595 will be commercially available in H1 2014, with devices expected in H2 2014. The other SoC with Cortex A17 and probably Mali-720 GPU should be Rockchip RK3288, following the unintended leak at CES 2014…

You can find a bit more details on ARM Cortex A17 page.

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AllGo Embedded Systems Android IVI System Boots in 4 Seconds

January 19th, 2014 No comments

We’ve already seen several sub-second boot times for embedded Linux systems with platforms such as Beagleboard (TI OMAP 3530) and an AllWinner A10 based device, but I had never seen fast boot optimization for Android before, or I just forgot… Typically Android boots within 20 to 40 seconds on most devices, but AllGo Embedded Systems has optimized Android Jelly Bean boot time for their IVI (In-Vehicle Infotainment) platform running a media player called RACE.

Charbax interviewed then at CES 2014, where they demoed the 4 seconds (actually 4.2 seconds) boot on Texas Instruments OMAP5 from reset and power, as you can see in the video below. (The video starts at 2:20 to show the demo directly).

Beside Texas Instrument OMAP5, the solution is also available for Freescale i.MX6. 0xlab did some boot time optimizations for Android dropping the boot time from 30 seconds to 15 seconds. AllGo Embedded Systems did further optimizations, and since the system is embedded they probably did remove some unused components to further boost the boot time.

The company has an Android fast boot page, but with a few more details.

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NVidia Announces Tegra K1 32-bit & 64-bit SoCs with a 192 Core Kepler GPU

January 6th, 2014 5 comments

Nvidia announced their newest mobile SoC at CES 2014, but instead of calling it Tegra 5, they went for Tegra K1, as it’s the first to feature a 192 cores GPU based on Kepler architecture, the same as used in PC graphics card. There will be several version of the chip one based on four Cortex A15 cores, one featuring a dual core Nvidia Denver CPU based on ARMv8 64-bit architecture, and Tegra K1 VCM for the automotive market.Tegra_K1

The company showcased the power of their new processor with an Unreal Engine 4 demo and the same face demo showed last year on an Nvidia GPU card, and Tegra K1 easily outperform older generations games console such as Xbox 360 and PlayStation 3, at and the same time consume just about 5 Watts of power, versus 100 Watts for Microsoft and Sony consoles. The GPU in the Tegra K1 also supports DX11.1.

They also showed a tablet powered by the dual core 64-bit ARM version running Android, and said Tegra K1 is about three times as powerful as Apple A7 64-bit processor, without taking into next-gen graphics capabilities of their SoC.

Nvidia CEO completed the press event by showing off Tegra K1 VCM (Visual Computing Module) that aims to bring supercomputer performance (374 GFLOPS) into your car. They first demo advanced driver assistance, as would be used in an autonomous car, including technologies like pedestrian detection, blind-spot monitoring, land departure warning, collision avoidance, traffic-sign recognition, and adaptive cruise control, and more, and then a dashboard display part of what they call Project Mercury, with realistic rendering, and customizable dimensions, materials, sheen, and reflectivity.

Finally, he confessed Nvidia was responsible for that:

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Mentor Embedded ARM Hypervisor Automotive Demo on Freescale i.MX6 Board

December 19th, 2013 No comments

Virtual machines are usually run on server or desktop PC to run several operating systems simultaneous. About 2 years ago, I wrote about an embedded hypervisor running Linux and Android on the Pandaboard develompent board, with the goal of separating home and enterprise operating systems in mobile devices so that enterprise data is safe. Since then, virtualization extensions are now part of ARM Cortex A15 / A7, and as well as the new Cortex A53 / A57 ARMv8 64-bit cores, but in my mind at least, those where mostly designed to address the server market. It turns out hypervisors are also useful in the automotive field, where for example, the dashboard and In-vehicle infotainment (IVI) systems runs in two separate virtual machines controlling two different displays from one processor.

Mentor Embedded showcased such automotive system at ARM Techcon 2013, where they showed a Freescale i.MX6 quad core board, which looks like Freescale SABRE Lite development board, running their embedded hypervisor with two virtual machines controlling the two displays (dashboard and IVI), and they showed how they could reboot the virtual machine controlling the IVI system without affecting the dashboard display.

So I had a look into Mentor Embedded hypervisor to find out a few details.
According to Wikipedia, there are two types of hypervisors:

  • Type 1 (aka native, or bare metal) – Such hypervisor run directly on the host’s hardware, and have lower footprint, and better performance. Citrix XenServer and VMware ESX/ESXi are example of type 1 hypervisors.
  • Type 2 (hosted) – Hypervisors that run on top of an operating-system environment such as Virtualbox or VMWare Workstation.

Kernel-based Virtual Machine (KVM) is somewhat between the two types, as it requires an OS (Linux or FreeBSD), but gives direct access to the hardware via kernel modules.

Mentor Embedded hypervisor is a small footprint Type 1 (bare metal) hypervisor, supports ARM TrustZone, and several operating systems including a Yocto based embedded Linux distribution, Android, the company’s  GENIVI compliant Automotive Technology Platform, and Nucleus RTOS.

Mentor_Embedded_HypervisorAccording to the company, the key benefits of their hypervisor for developers are as follows:

  • Reduce test and debug times by consolidating multiple functions on a single multi-core compute platform
  • Take advantage of symmetric and asymmetric multiprocessing, or combinations of both (AMP/SMP)
  • Build secure, high-performance embedded systems at the highest privilege level in a system
  • Use the ARM TrustZone secure system architecture and deliver both normal and secure operations, such as secure boot and secure PIN access, within a single embedded application
  • Partition devices and memory to prevent unauthorized access to sensitive resources

I was hoping to get some numbers about data and code footprint, some estimation of the performance hit due the hypervisor, and currently supported ARM platforms, but I could not find any of that. Mentor Embedded hypervisor seems to be mainly focused on automotive applications.

If you want to find out more about applications currently using ARM hypervisors such as servers, automotive applications, and Android, you can check Xen ARM hypervisor page with links to some relevant presentations from Xen Project Developer Summit 2013.

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MEN Mikro Elektronik BL50W is an Embedded PC For Wireless Applications with up to 9 Antennas

August 19th, 2013 No comments

MEN Mikro Elektronik Gmbh, a German company specialized in industrial embedded boards and systems, has recently unveils BL50W, an embedded PC powered by AMD G-Series APU targeting wireless applications for transportation: trains, buses, construction and agricultural machines or airplanes. The rugged device provides nine antenna slots, with support for up to 8 SIM cards and a GPS interface.


BL50W Specifications:

  • Processor – AMD G-Series single or dual core APU from AMD T24L to AMD T56N (13 Processor options). The standard version comes with AMG G-series T48N Dual Core processor @ 1.4 GHz with AMD Radeon HD 6310 GPU
  • System Memory – 2GB DDR3 SDRAM (4GB optional)
  • Storage – SD card slot, mSATA slot (Up to 3Gb/s), and SATA 3.0 (Up to 6Gb/s)
  • Graphics – Radeon HD 6310 GPU by default with dual independent display support, dual DisplayPorts, and  2560×1600 maximum resolution.
  • Video – Dedicated hardware (UVD 3) for H.264, VC-1 and MPEG2 decoding, HD HQV and SD HQV support (noise removal, detail enhancement, color enhancement, cadence detection, sharpness, and advanced de-interlacing ), and super up-conversion for SD to HD resolutions
  • Front I/O:
    • 2x DisplayPort 1.1a interfaces with AUX channels and hot plug detection
    • 1x HD audio  – HD audio codec, Audio stereo in and out, SPDIF out
    • 2x Gigabit Ethernet via M12 connectors
    • 2x USB 2.0
    • 7x general purpose inputs
    • 2x relay outputs
    • 2x photo couplers (shutters)
    • 1x odometer input
    • 1x IBIS slave interface up to 19.2 kBaud
    • GPS/GLONASS interface (A-GPS, DGPS)
    • Serial – RS232, RS422/485, 2x SA-Adapter slots for legacy serial I/O
    • 1x SA-Adapter slot for CAN
    • 14x status LEDs – 4x for Ethernet link and activity status, 2x for general board status, and 8x user LEDs
  • 4x PCI Express Mini Card slots for functions such as Wi-Fi, WIMAX, GSM/GPRS, UMTS with 2 SIM card slots for each PCI Express Mini Card
  • Real-Time Clock – Buffered by Gold Cap for up to 12h (Upgradeable to 72h)
  • Supply voltage – 24V and 36V nominal input voltage according to EN50155, 24V nominal input voltage according to e1 (automotive), and 10 to 50.4 V input voltage range. Optionally Input voltages of 48V, 72V and 110V are also supported.
  • Temperature Range – -40°C to 70°C (screened), with up to 85°C for 10 minutes according to class Tx (EN 50155). Fanless operation.
  • Dimensions – Height 60mm x Width 400mm x Length 240mm

BL50W supports InsydeH2O UEFI Framework, as well as  Windows 7, Windows Embedded Standard 7, Windows XP Embedded and Linux operating systems.

Further information, including Windows and Linux drivers, and a product brief, is available on MEN Mikro Electronik BL50W page.

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ARM TechCon 2013 Schedule – ARM Servers, Internet of Things, Multicore, Hardware and Software Optimization and More

August 1st, 2013 No comments

ARM_Techcon_2013ARM Technology Conference (TechCon) 2013 will take place on October 29 – 31, 2013, in Santa Clara, and the detailed schedule for the event has just been made available. In the previous years, the conference was divided into  Chip Designs day (1 day), and the other 2 days were reserved for Software & System Design, but this year it does not appear to be the case. Whether you’ll be able to attend the event or not, it’s worth having a look at what will be discussed there in order to have a better understanding of what will be the key ARM developments in the near future in terms of hardware and software.

There will be around 90 sessions categorized into 15 tracks:

  • Accelerating Hardware Development – This track explores the resources, tools, and techniques that designers can employ to quickly bring hardware to market. Topics include multicore design, ARM IP, chip buses, analog integration, simulation, FPGA prototyping, design synthesis, debugging and certification.
  • Accelerating Software Development – Topics include open-source software, RTOSes, Android, Java, libraries, CMSIS, software development tools, development boards, hardware simulation, debug tools, optimization and analysis tools, test tools and certification.
  • Accelerating System Hardware Development – This track explores the tools and techniques for getting system hardware development rapidly launched and landed. Topics include single board computers (SBCs), development boards, RF modules, analog front ends, FPGAs, ESL tools, hardware simulation and novel techniques for rapidly assembling a functional design.
  • Applying New Technologies to New Opportunities – This track explores new chip design technologies and new applications and their impact on one another. Topics include 14nm and beyond, graphics and multimedia, servers and enterprise-class processing, gateways, high speed interfaces, ultra-low power, energy harvesting, machine vision, advanced networking, medical instrumentation, automotive systems and voice recognition.
  • Building a Foundation for Safety and Security – This track explores the chip-level and software foundations for system safety and security, including things such as as multi-core and redundant architectures, TrustZone system security technology, trusted execution environments, encryption, tamper detection and hardware/software security partitioning, as well as the hardware elements for safety-related systems such as healthcare and vision processing in advanced driver assist in automobiles.
  • Creating the Next Gen Mobile Platform – This track explores the kinds of features and system requirements mobile devices will need to provide, and the techniques and resources needed to bring those designs to market. Topics include multicore design, multimedia and graphics, GPU computing, haptics, networking, security, high speed and wireless interfaces, GUI design and development, operating systems and power management.
  • Empowering System Security – This track explores the requirements, tools, and techniques for providing security in system designs at both software and hardware levels. Topics include encryption, trusted execution environments (TEE), TrustZone system security architecture, biometrics, tamper detection, remote management, application whitelisting and blacklisting, software certificates, network attack vulnerabilities and key protection.
  • Enhancing the User Experience – This track explores the tools and techniques for enhancing a consumer’s experience of your device, from high-end through resource constrained. Topics include touchscreens, haptics, multimedia, gesture recognition, GPU computing, accelerometers, sensor fusion, voice recognition, voice synthesis and GUI design and development tools.
  • Kickstarting ARM Embedded Development – This track provides you with the information and insights needed to ease your path and begin development. Topics include ARM architectures, new device releases, development kits, development tools, software IP, libraries, 8- to 32-bit migration, code reuse, CMSIS and more.
  • Marrying Software and Hardware in Multicore Design – This track explores the interaction between hardware design and software structure as well as the techniques for ensuring an optimal working relationship between the two. Topics include big.LITTLE processing, graphics processing, redundant computing, distributed computing operating systems, software partitioning, multi-core debugging and software optimization.
  • Maximizing Chip Energy Efficiency – This track explores the processes, structures, and approaches that will help keep device power minimized without sacrificing performance. Topics include semiconductor processes, clocking and power management, big.LITTLE and other multicore architectures, sleep modes, smart peripherals, dynamic clocking, analog integration, RF integration and other design techniques for reducing device power requirements.
  • Next-Generation Networking – Rise of Software Defined Networking – This track explores advanced and high-performance networking architectures, approaches, and implementations, including such topics as software defined networking (SDN), network function virtualization (NFV), high speed interfaces, wireless, security and carrier-class platforms.
  • Optimizing System Software Blocks – This track explores options in system software and the tools and techniques for optimizing software performance and resource requirements. Topics include Android, Linux, OSes, RTOSes, GUI design, libraries, drivers, development tools, debugging tools, certification and software test tools.
  • Stacking Up for High Performance Design – This track explores multicore architecture and design, looking at criteria such as core selection and integration, clock and power management, and shared memory architectures as well as other approaches to increasing the processor resources available on chip in the light of their performance and power implications. Topics include such things as hardware accelerators, graphics processors, big.LITTLE processing, clocking and power management, high-speed interfaces and SoC design.
  • Taming the IoT Frontier – This track seeks to explore a wide range of techniques and technologies that will help system developers quickly stake their claim in the IoT frontier. Topics include RF modules, sensors, networking, gateways, WiFi, Bluetooth, Zigbee, battery-powered design, energy harvesting, analog interfaces, cloud services, and security.

I’ve used the schedule builder to select some of the tracks that I find interesting during this 3-day event:

Tuesday – 29th of October

This class discusses multicore from a more traditional embedded viewpoint.

According to Cisco, the Internet of Things (IoT) is expected to connect more than one trillion objects by 2020. Through extreme interconnectivity, devices and objects are morphing into connected experiences that will have a profound impact on everything from cities to healthcare to households. This live demonstration shows how anyone can build, connect, operate, and capitalize on the IoT opportunity. The combination of ARM mbed and the LogMeIn Xively platform accelerates time to market, as developers can rapidly progress from prototyping to volume deployment. Attendees will leave with an action plan for deploying their own IoT-enabled products.

Multicore ARM platforms are becoming the norm in embedded applications and smartphones. However, most developers do not understand the underlying hardware architecture and what that means to their software-development approach. This presentation leads attendees through the issues, such as process migration and caching control, that can increase application performance an order of magnitude or more. We discuss techniques to avoid multicore race conditions, common scheduling issues, and how to bind user threads and integrated services routers to specific processor cores in Linux and Android to guarantee the maximum performance and temporal correctness of applications and kernel code.

This session introduces both a development environment for people who are starting to use BeagleBone or BeagleBone-like ARM boards and the whole ecosystem behind OpenEmbedded. It goes through such tools and techniques as generating images, generating package feeds, customizing images, and adding your own software to images.  Developers can generate their own SDKs and use them outside of the Angstrom Linux distribution that’s shipped with BeagleBone so they can write applications. The loop is closed by showing how applications are knotted into Angstrom to become part of images. Angstrom also maintains feeds for BeagleBone, which means application developers can utilize it without rebuilding the platform software.

  • 15:30 – 16:20 – Server Solutions from ARM by Ian Forsyth, Senior Product Marketing Manager, High Performance Application Processors, ARM, and Aniket Saha  |  Product Manager, ARM

The server landscape is rapidly shifting, with workload profiles bifurcating into compute-intensive and scale-intensive. ARM designed its latest Cortex-A50 line of 64-bit processors for the needs of this evolving server workload in the enterprise data center. ARM servers can deliver high performance at a higher efficiency than similar technology based on x86-class processors. This paper details ARM-based server solutions and ecosystem developments.

Wednesday – 30th of October

SmartMesh IP is the latest generation of low-power wireless mesh solutions by the Dust Networks Product group at Linear Technology. It combines the ease of use of IPv6 and 6LoWPAN with the wired-like reliability of IEEE802.15.4e Time Synchronized Channel Hopping. It runs on the custom-built Eterna chip, which combines an ARM Cortex-M3 MCU, with an ultra low-power IEEE802.15.4 wireless radio. This gives a SmartMesh IP mote years of battery life. This session starts by discussing the challenges of building a reliable low-power wireless solution and how these were overcome in the development of SmartMesh IP. We then highlight how customers are integrating these networks, either by driving the mote with an external micro-controller over a serial port or by developing custom firmware directly on the SmartMesh IP device. Through a number of hands-on demonstrations, we present the ecosystem available to simplify integration.

GPU computing on the ARM Mali-T600 series of GPUs offers a host of benefits: it accelerates data-parallel computation while reducing system work load; reduces platform energy consumption while increasing system throughput; and enhances your system’s value by consolidating functionality while reducing programmer effort. In this talk, we show how ARM Mali-T600 processors deliver such benefits on shipping devices. By analyzing ecosystem partners’ use cases, we highlight trends in GPU computing: computational photography, computer vision, and image processing.

The Internet of Things (IoT) is a huge opportunity, as well as a huge design problem. Your key to success is to avoid trying to do everything yourself. We explore the barriers to growth and the practical steps to breaking them down, with insights from early companies in the field as well as ARM’s own engineers. Among the several key points: Today, online products are delivered vertically integrated: one vendor delivers devices, gateway, cloud services, analytics, and user-experience aspects. Increasingly, commercial necessity is forcing providers to think open and embrace a horizontal ecosystem. Different link layers such as ZigBee and WirelessHART are here for a while, but between them and the application is a layer of great commonality from application to application, ripe for standardization. The talk includes practical tips for designing devices and services for the IoT that take advantage of interoperability, lower cost, and better user experience, including easy pairing, pub-sub, and preparing for IPv6 in an IPv4 world.

As industry projections for entry-level smartphones soar, it is ever more important to achieve the required performance within ever tighter power, cost, and timescale constraints. This presentation describes how to build an extremely efficient processing subsystem, based on the very latest, lowest-power ARM Cortex-A class processors, Mali graphics and video processors, and CoreLink PD-System IP. Key factors explored are power management, cost/benefit of GPU coherency, optimal sharing of memory bandwidth, and minimizing area and IP costs.

Now that the RTX full-featured real-time operating system is under a BSD license, it really is free. RTX, part of the CMSIS-RTOS standard, has found applications in thousands of products. Created and maintained by Keil, it includes all source code. RTX is not crippled or limited in any way. Ports are provided for Keil MDK, GCC, and IAR.

This seminar looks at the overall features of RTX and shows how easy it is to implement in any project. Included are a live demonstration of the two kernel-awareness windows that are part of Keil MDK and CMSIS-RTOS and a discussion of implementation details.

Thursday – 31st of October

Understanding the compilation process is crucial to generating the tightest code from your source code. Compiler technology has not yet run it course, and new cutting-edge optimizations have made enormous savings in execution and code size. This talk surveys a few of my favorite optimizations: some are old but highly effective, others are virtually unknown outside the close community of compiler developers. All of them, in my opinion, are fascinating.

The mbed online environment (SDK,  online tools, active community of developers, and a large selection of reusable code) has been widely adopted by developers as the rapid prototyping environment of choice for ARM-powered microcontrollers. These tools combined with mbed-enabled hardware are great for prototyping designs, but what about taking those next steps to production? This session presents options for starting with mbed as a prototyping environment and moving to full production with the use of Freescale development hardware, the open-source mbed SDK and HDK, and the rich ARM ecosystem of hardware and software tools.

You can make your C code better uickly, cheaply, and easily. Simple techniques can yield surprising improvements in system performance, code size, and power consumption. This session looks at how software applications can make most efficient use of the underlying architecture to deliver significant improvements in performance, code size, and power consumption. All you need is a little inside knowledge about the ARM architecture. You will learn tricks that you can use the day you get back to your office.

ARM processors are increasingly used in automotive applications such as In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), powertrain, chassis and body control. Moreover, there are emerging opportunities in Vehicle-to-Vehicle and Vehicle-to-Infrastructure (V2V, V2I) applications which further extend the scope and sophistication of computation systems in vehicles of the future.  These developments are driving the next generation of automobile electronics and ARM is enabling use of its technology throughout the automotive industry.  This presentation will introduce the technology behind some of these applications in more detail and describe where and how ARM processors are used in automotive electronics and associated infrastructure applications. Today’s automotive designs are challenged by the cost and complexity of so much advanced hardware and software.  However, ARM technology will deliver solutions to these challenges, such as processors capable of enabling.

In the embedded developer space, we are hearing more about open-source low-cost development platforms such as mbed, Arduino, Raspberry Pi, and BeagleBoard that provide powerful enablers to quickly develop proof-of-concepts demos. As these products move from proof of concept to product development, continued use of open source has obligations. These obligations and risks apply to the developer and the end-users.

This year’s topics are very much a continuation of last year’s, with sessions dealing with ARM servers, the Internet of things, software and power optimization, multicore handling, etc…

If you would like to attend ARM TechCon 2013, you can register online. An alternative is to pay on-site (Regular), but it will cost you, or your company.

  Super Early
Ends August 2
Early Bird
Ends September 6
Ends October 25
All Access Pass $799
$999 $1,199 $1,399
2-Day Pass $699
$799 $899 $999
1-Day Pass $399
$499 $599 $799
Expo Pass $0 $0 $0 $0

The best discount ends tomorrow (2nd of August 2013). Professional working for academia or/and the government can get discount by contacting Linda Kuehn at [email protected].

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Tizen Developer Conference 2013 Presentation Slides, Audio Recording and Videos Are Now Available

July 28th, 2013 No comments

The Tizen Developer Conference took place in San Fransisco, on May 22-24, 2013. We’e already seen a few Tizen demos from the conference, but slides and media files (mostly audio, but also some videos) are now available for keynotes and technical presentations.


As this was just the second Tizen conference, there were still many sessions dealing with overall structure of the operating system, and explaining how to get started either with native or web development, such as:

Tizen enters a mobile world dominated by Android and iOS, so several sessions targeted app developers used to work with either operating systems in order to show them how to port their existing apps to Tizen:

Of course, they were also sessions, probably a bit more technical, focused on development of specific features:

And many more, as media files and slides are available for nearly 60 sessions and keynotes.

There’s also a 2-hour developer’s lab (Devlab) session entitled “Creating a Tizen Application: Start to Finish” divided into four parts:

  • Tizen Contest Announcement overview with Brian Warner and Distribution of Tizen USB Drives with Wesley Osaze
  • Tizen Native API Overview with Hod Greeley
  • Tizen Web API Overview with Bob Spencer
  • Live Code Session Overview with Stewart Christie

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Renesas RZ/A1 Cortex A9 Processors Feature Up to 10 MB On-chip RAM

July 6th, 2013 3 comments

Renesas Electronics has recently introduced the RZ/A1 group of ARM Cortex-A9 microprocessors (MPUs) for automotive, consumer and industrial applications requiring user interfaces with displays with a resolution up to 1280×768 (WXGA). The RZ/A1 series will come in three product groups: RZ/A1H, RZ/A1M and RZ/A1L with respectively 10MB, 5MB and 3MB on-chip RAM. These Renesas SoCs are an upgrade to SH7260 Series.


Key Features (Included in A1H and A1M, but not always in A1L):

  • Core – ARM Cortex A9 @ up to 400 MHz (with Jazelle and NEON)
  • GPU – OpenVG-compliant Renesas graphics processor (2D graphics)
  • Cache – 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache, and a 128-Kbyte L2 cache.
  • Built-in memory –  Up to 10-Mbyte large-capacity RAM (128 Kbytes are shared by the data-retention RAM) for A1H, 5MB for A1M, and 3MB for A1L
  • External memory
    • Up to 66.67 MHz bus
    • Direct connection to SRAM, byte select SRAM, SDRAM, and burst ROM (clock synchronous/clock asynchronous) using bus state controller. Address/data multiplexer I/O (MPX) interface supported.
    • Address space: 64 MB × 6.
    • Data bus width: external 8/16/32 bits
  • Graphics Functions:
    • OpenVG1.1 2D graphics accelerator
    • Video display controller (Up to 2 channels of video input and 2 channels of panel output,

    of which 1 channel supports LVDS)

    • Video decoder × 2 channels (analog composite direct input is possible)
    • Distortion correction engine × 2 channels (requires nondisclosure agreement)
    • Distortion correction engine for display (requires nondisclosure agreement)
    • Display out compare unit
    • JPEG codec unit
    • Capture engine unit (CMOS camera interface)
    • Pixel format converter × 2 channels
  • Audio functions
    • SCUX (with built-in asynchronous sampling rate conversion, digital volume & mute, and mixer function)
    • Serial sound interface × 6 channels (× 4 channels for A1L)
    • Renesas SPDIF interface
    • Sound generator × 4 channels
    • CD-ROM decoder
  • Timer functions
    • Multifunction 16-bit timer (MTU2) × 5 channels
    • 32-bit OS timer × 2 channels
    • Motor control PWM timer × 8 channels
    • Watchdog timer
    • Real-time clock
  • Interfaces:
    • USB 2.0 host/function module × 2 channels (host or functon selectable)
    • NAND flash interface
    • SD host interface × 2 channels (must obtain SD card license)
    • MMC host interface
    • Ethernet controller (10 Mbps/100 Mbps transfer, IEEE802.3 PHY interface MII)
    • Ethernet AVB (IEEE802.1 Audio/Video Bridging) controller (requires nondisclosure agreement)
    • SPI multi I/O bus controller × 2 channels (up to 2 serial flash memory connectable to 1 channel, direct execution from CPU supported)
    • Serial communication interface with 16-stage FIFO (SCIF) × 8 channels (asynchronous and clock synchronous serial communication possible) Serial communication interface with 16-stage FIFO
    • Serial communication interface × 2 channels (smart card interface, IrDA 1.0)
    • Renesas serial peripheral interface × 5 channels (× 3 channels for A1L)
    • I2C bus interface × 4 channels
    • Media Local Bus (MediaLB Ver2.0)
    • Controller area network (CAN) × 5 channels (× 2 channels for A1L)
    • Local interconnect network interface (LIN) × 2 channels (x 1 channel for A1L)
  • System analog functions
    • Clock pulse generator (CPG): built-in PLL, maximum 32 times multiplication, built-in SSCG circuit
    • Direct memory access controller × 16 channels
    • Interrupt controller (with ARM Generic Interrupt Controller [PL390])
    • A/D converter (12-bit resolution) × 8 channels
    • Debugging interface
    • CoreSight architecture
    • JTAG standard pin layout


  • Optional function – Encryption engine (requires nondisclosure agreement)
Renesas RZ/A1 Series Block Diagrams (Differences between RZ/A1H & M and RZ/A1L are shown in red)

Renesas RZ/A1 Series Block Diagrams (Differences between RZ/A1H & M and RZ/A1L are shown in red)

Thanks to the integrated on-chip RAM from 3MB to 10MB it’s possible to develop applications without external memory, lowering the BoM cost, EMI, and static power consumption.

Renesas has partnered with several partners including IAR systems, Green Hills Software, ARM, Express Logic, Micrium, and Altia to provide tools and middleware solutions for real-time operating systems (RTOS), networking, USB, graphics and file systems.. In particular, Renesas and ARM are jointly developing a version of RTX CMSIS (Cortex Microcontroller Software Interface Standard)-RTOS for the Cortex-A in order to facilitate transition of application software developed from Cortex-M processors to Cortex-A processors. It’s available in ARM DS-5 for Renesas RZ/A1.

GENMAI CPU Board (RTK772100BC00000BR#ES)

GENMAI CPU Board (R7S72100 CPU Board RTK772100BC00000BR)

To start development early, you can use those software tools on GENMAI CPU Board powered by a 324-pin BGA RZ/A1H processor with 64 MB x 2 NOR flash, 64 MB x 2 SDRAM, 64 MB x 3 Serial flash memory and 16KB EEPROM, as well as most ports supported by the SoC.

The company said samples of select RZ/A1L and RZ/A1H products will be available in July 2013. Further details are available on Renesas RZ/A1 page.

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