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Posts Tagged ‘development kit’

e-con Systems Unveils eSOMiMX6 SoM based on μQ7 Form Factor, and Ankaa Development Kit

December 4th, 2014 2 comments

QSeven is one of the many standards for system-on-modules, and it defines both Qseven (Q7) 70x70mm modules, and smaller μQSeven (μQ7) 70x40mm modules. While there are quite a few SoMs following the larger form factor, few modules are based on micro Q7, and e-con Systems eSOMiMX6 has just launched one of these tiny modules with eSOMiMX6 system-on-module powered by Freescale i.MX6 processors, as well the corresponding Ankaa development kit comprised of the SoM and a baseboard.

uQseven_Freescale_i.MX6_SoM

eSOMiMX6 module specifications:

  • SoC – Freescale i.MX6 single, dual or quad Cortex A9 processor @ 800MHz to 1.2 GHz with Vivante GPUs
  •  System Memory – 256MB/512MB (Solo only), 1GB (default), or 2GB (dual/quad only) LVDDR3 RAM
  • Storage – 4GB (default) to 64GB eMMC flash, 2MB SPI NOR flash, and SD/MMC + SATA II  interfaces via MXM connector
  • Display / Video Output:
    • HDMI up to 1920 x 1080
    • Dual channel 24-bit LVDS
    • 24-bit LCD RGB
    • MIPI DSI
  • Camera:
    • 4-lane MIPI-CSI  (2-lane for Solo)
    • 10 bit parallel camera I/F
    • 20-bit parallel camera I/F
  • Connectivity – Optional Gigabit Ethernet controller,  optional module for 802.11 b/g/n Wi-Fi and Bluetooth 4.0 BLE
  • Other I/O accessible via 314-pin MXM connector:
    • USB 2.0 host, USB 2.0 OTG
    • SPDIF audio in and out
    • 2x CAN (FlexCAN)
    • 5x serial UART
    • 3x I2C,  3x PWM, SPI
    • Up to 50x GPIOs
    • PCIe x1 Gen2
  • Power Supply – 3.3V @ 3A
  • Dimensions – 70 x 45mm
  • Temperature Range – Commercial: 0 to 70°C; or Extended: -40 to 85°C

You may have noticed the module size is 70x45mm, and not 70×40 as in Q7 specifications, which is probably why the companies refers to a custom μQseven” form-factor, where they’ve kept the MXM connector, the same mounting holes position, but increased the width of the board. So it should still work with most Q7 baseboards, unless the 5 millimeters extra interfere with your baseboard.

The company provides BSPs for Linux (with bootloader), and Android, with Windows Embedded Compact (WEC) 2013 still in development.

Ankaa Development Kit (Click to Enlarge)

Ankaa Development Kit (Click to Enlarge)

To speed up development, e-con Systems can also provide Ankaa development kit with including eSOMiMX6 Module (eSOMiMX6-CS-P1G-F4G-R1G-WB-E with i,MX6 Solo @ 1GHz, 1GB RAM, 4GB eMMC, Wi-Fi/BT, and Ethernet), Ankaa carrier board, and HDMI cable, a USB to serial port cable, and a 9V power supply. They have both Linux and Android version of the kit, and the latter also adds a 10″ LCD with capacitive touch.

Ports and features available on Ankaa development kit:

  • 314-pin MXM connector for uQ7 SoM
  • Storage – SATA connectors (DATA + Power, not working with Solo SoM),  SD Card slot
  • Camera – MIPI – 4 lane interface; Parallel interface 1 – 10 bit; Parallel interface 2 – 20 bit (Quad processor only) with 5MP, 8MP and 13MP MIPI Cameras available as add on boards.
  • Display –  1x HDMI, 2x LVDS
  • Audio – 3.5mm audio jack
  • Connectivity – WIFI 802.11 b/g/n & Bluetooth 4.0 BLE (on SoM), 1x Gigabit Ethernet
  • Serial Ports – 1x RS232, 1x Debug Port (serial console) via mini USB port.
  • USB –  1x USB Host (2.0), 1x micro USB OTG (2.0), 1x mini USB debug port (UART)
  • Expansion
    • GPIO header with access to GPIOs, I2C, SPI, etc…
    • CAN header
    • mini PCIe slot
  • Misc – Boot selection switch, RTC + battery
  • Dimension – 135mm (L) x 90mm (B)
  • Power Supply – 9V @ 2.5A; 5V supply also available via header
  • Temperature Range – – 0°C to 70°C
Ankaa Devkit Block Diagram

Ankaa Devkit Block Diagram

eSOMiMX6 module price starts at $47 for 1,000+ unit orders for the Solo version, and up to $199 for the extended temperature range quad core version will all options, in 1-99 units orders. Ankaa kits sells for $349 for the Linux version, and $449 for the Android version with LCD display. Price for the Android kit is only valid until the end of the year, after which it should cost $674. The camera add-on boards sell between $69 to $99. Further details can be found on  eSOMiMX6 modules and Ankaa devkit product pages, and you can purchase SoM samples, Ankaa devkit, and/or the camera modules via e-con Systems Webstore.

Via Embedded.com and LinuxGizmos

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Intrinsyc Introduces Snapdragon 810 Powered Mobile and Tablet MDPs, DragonBoard Development Kit

November 28th, 2014 3 comments

Intrinsyc has recently announced availability for three development platforms based on Qualcomm Snapdragon 810 ARM Cortex A53/A57 processor, namely a smartphone Mobile Development Platform (MDP), a tablet MDP, and a DragonBoard development kit integration Open-Q 8094 system-on-module, making these one of the first ARM64 development platforms available to individual developers, or at least small software development companies (approved by Qualcomm). All three platforms will run Android 5.0 Lollipop.

Intrinsyc Snapdragon 810 MDP Smartphone

Snapdragon_810_MDPIntrinsyc MDP/S specifications:

  • SoC – Qualcomm Snapdragon 810 (8994)  64-bit octa-core processor with 4x Cortex A57 cores, 4x Cortex A53 cores, Adreno 430 GPU, and Hexagon V56 DSP
  • System Memory – 3 GB LP-DDR4
  • Storage – 32 GB eMMC 5.0  micro SD slot (under battery door)
  • Display – 6.17” QHD (2560×1600) 490ppi, 10-finger multi-touch capacitive touchscreen
  • Video Output – micro HDMI type D
  • Audio
    • Headset jack with ANC support
    • 8 microphones (2 analog/ 6 digital) with support for Qualcomm Fluence Pro technology and Snapdragon digital pen technology
    • Ultrasound emitter for gesture applications
    • Mono speaker
  • Connectivity – 802.11 a/b/g/n/ac Wi-Fi 2.5 GHz/5 GHz,  Bluetooth 4.1, Qualcomm IZat Gen8C GPS
  • Cameras
    • 13 MP rear camera with OIS, Dual LED flash (4K at 30 fps, 1080p @ 60fps)
    • 4 MP front camera with AF (1080p at 120 fps)
  • Sensors – 3-axis accelerometer and 3-axis gyro, 3-axis magnetometer (compass), ambient light sensor, proximity sensor, pressure sensor, temperature and humidity sensor, UV sensor, and Mobeam sensor (for barcodes)
  • USB – micro USB 3.0 OTG port
  • Misc – Volume, power, and home buttons, finger print reader, tri-color status/notification LED
  • Battery – 3020 mAh Lithium-ion battery. Qualcomm Quick Charge 2.0 support when used with optional HVDCP charger

This developer smartphone has some serious specs, and should ship late December 2014 for $799. Please note that there does not seem to be any 3G/LTE support. More details are available on the product page.

Intrinsyc Snapdragon 810 MDP Tablet

Snapdragon_810_MDP-TIntrinsyc MDP/T specifications are somewhat similar to the 810 MDP/S, but with more RAM and storage, a larger screen (possibly even the first 4K UHD screen on a tablet), a larger battery, stereo speakers, and a dual 3D gesture camera, but less sensors:

  • SoC – Qualcom Snapdragon 810 (8994)  64-bit octa-core processor with 4x Cortex A57 cores, 4x Cortex A53 cores, Adreno 430 GPU, and Hexagon V56 DSP
  • System Memory – 4 GB LP-DDR4
  • Storage – 64 GB eMMC 5.0  micro SD slot (under battery door)
  • Display – 10.1” UHD 4K (3840×2160), 10-finger multi-touch capacitive touchscreen, dual display capable (tablet + HDMI)
  • Video Output – micro HDMI type D
  • Audio
    • Headset jack with ANC support
    • 8 microphones (2 analog/ 6 digital) with support for Qualcomm Fluence Pro technology and Snapdragon digital pen technology
    • Two ultrasound emitters for gesture applications
    • Front-facing stereo speakers
    • 8-channel audio over HDMI
  • Connectivity – 802.11 a/b/g/n/ac Wi-Fi 2.5 GHz/5 GHz,  Bluetooth 4.1, Qualcomm IZat Gen8C GPS
  • Cameras
    • 13 MP rear camera with OIS, Dual LED flash (4K at 30 fps, 1080p @ 60fps)
    • 4 MP front camera with AF (1080p at 120 fps)
    • Dual 3D IR gesture camera
  • Sensors – 3-axis accelerometer and 3-axis gyro, 3-axis magnetometer (compass), ambient light sensor, proximity sensor, temperature and pressure sensor, and ambient humidity sensor.
  • USB – micro USB 3.0 OTG port
  • Misc – Volume, power, reset, and home buttons.
  • Battery – 7,560 mAh Lithium-ion battery. Qualcomm Quick Charge 2.0 support when used with optional HVDCP charger, and Qualcomm WiPower charging capable.

The tablet will ship by mid December 2014, and can be purchased for $999. Check out the product page for more information.

DragonBoard Development Kit based on Snapdragon 810 (APQ8094)

ARM64_development_boardIntrinsyc DragonBoard 64-bit ARM development board technical specs:

  • SoC – Qualcomm Snapdragon 810 processor with 4x Cortex A57, 4x Cortex A53, Adreno 430 GPU and Hexagon v56 DSP
  • System Memory – 4GB LPDDR4 RAM
  • Storage – 16GB eMMC 5.0 flash + 2x SATA + 1 MicroSD card slot
  • Connectivity – Wi-Fi 802.11n/ac, Bluetooth 3.0/4.1, GNSS (GPS and GLONASS)
  • Video Output / Display I/F  – HDMI, 1x MIPI dual 4-lane DSI + touch panel
  • USB – 2x USB 3.0 + 2x USB 2.0 + 1x USB 2.0 micro-AB
  • Camera I/F – 3x MIPI CSI with support for 3D camera configuration
  • Expansions
    • PCI Express Slot with support for Gigabit Ethernet card
    • 4x Expansion headers for additional features, test, and debug

The kit is comprised of a baseboard, and an OpenQ-8094 SoM, which can be procured separately for commercial applications.

This “Early Adopter” board is currently only available to “select customers approved by Qualcomm” for $499, but as time passes by, individuals will hopefully be able to purchase as board, as is the case with other DragonBoards.

Via Liliputing and LinuxGizmos

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Spark Photon is a $19 Hackable IoT Wi-Fi Board

November 14th, 2014 4 comments

Spark Core is a popular Wi-Fi module for the internet of things  with a community of over 20,000 developers, but at $39 it may have started to feel a little expensive compared to the new IoT Wi-Fi modules such as ESP82666 or xWiFi, so the company has unveiled a new Wi-Fi board called Photon that’s smaller, better, and cheaper.

Spark Photon and P0 Module

Spark Photon and P0 Module

Let’s compare Spark Core with the new Spark Photon.

Feature Spark Core Spark Photon
Wi-Fi Support 802.11 b/g 802.11 b/g/n
Wi-Fi Setup Smart Config Soft AP
Wireless Module TI CC3000 Broadcom BCM43362
MCU STM32F103 STM32F205
MCU Speed 72 MHz 120 MHz
Flash Memory 128 KB 1 MB
RAM 20 KB 128 KB
GPIO 18
UART (Serial) Yes
JTAG Yes
I2C Yes
SPI Yes
ADC Yes
DAC No Yes
CAN No Yes
VBAT pin exposed No Yes
Wakeup pin exposed No Yes
Price $39.00 $19.00

So beside slashing the price by 50%, the new board supports 802.11 n, comes with a faster STMicro MCU with more memory, and it adds DAC and CAN interface, as well as access to VBAT and Wakup pins. The Wireless module from Texas Instruments has been replaced by Broadcom BCM43362 module that’s used in products like Nest, LIFX, and more.

They’ll also sell P0 module with Broadcom BCM43362 and STM32F205 as shown in the right of the picture above for $10, and a P1 module with a u.FL connector and an antenna on the board.

Finally the company has launched Spark Dev, a new IDE available for Windows and Mac OS, based on Atom project, which also support Linux based distributions.

Spark Photon can be pre-ordered now for $19 + shipping, with delivery scheduled for March 2015.

Via Make

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ARM Unveils Embedded Systems Education Kit Based on NXP LPC4088 Cortex M4 MCU

October 31st, 2014 5 comments

Following up on their first “Lab-In-a-Box” initiative based on Micro STM32F4-Discovery board and Wolfson audio card, ARM launched another low-cost toolkit, based on Embedded Artists LPC4088 QuickStart and Experiment boards, and called “Embedded Systems Education Kit”, to help university educators teach embedded systems design and programming concepts.

NXP_LPC4088_Devkit

LPC4088 QuickStart Board

The kit includes the following hardware, software tools, and teaching materials:

  • Embedded Artists LPC4088 QuickStart Board and LPC4088 Experiment Base Board
  • ARM Keil MDK-ARM Pro microcontroller development suite software licences
  • Complete teaching materials including lecture note slides, demonstration code and hands-on lab manuals with solutions in source for four embedded system courses:
    • ‘Efficient embedded systems design and programming’ teaches microcontroller fundamentals using NXP’s 32-bit ARM Cortex-M4 based LPC4088 microcontroller.
    • ‘Rapid embedded system design and programming’ delivers embedded systems design training for the high-level ARM mbed API
    • ‘OS design’ uses the royalty-free ARM Keil RTX RTOS to show how to design, program and optimize RTOS-based applications
    • ‘DSP’ teaches students about digital signal processing techniques and practice, especially for audio applications, using ARM Cortex-M4 based platforms.
NXP_LPC4088_Experiment_Board

LPC4088 Experiment Base Board

The education kit is available now for less than 20 Euros per student/per course, with all teaching materials provided free of charge to universities worldwide. Details can be found on ARM University Program website.

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Nordic Semi Announces nRF51 DK Arduino Compatible Board, and nRF51 Dongle with Bluetooth Smart, ANT, and 2.4GHz Connectivity

October 29th, 2014 No comments

Nordic Semiconductor has introduced two new low cost development boards supporting Bluetooh LE, ANT/ANT+, and proprietary 2.4GHz applications based on their nRF51 series SoCs: nRF51 DK, an Arduino UNO Rev.3 compatible board that can be used for various IoT and wearables applications, and nRF51 Dongle, a USB dongle to connect to a PC or board, which can be useful for packet sniffing and BLE peer connection.

nRF51 DK Development Board

nRF51_DK

Key features listed for the board:

  • SoC – Supports nRF51822 (BT/2.4Ghz) and nRF51422 (BT/ANT) SoCs based on an ARM Cortex M0 processor, with 128kB or 256kB flash memory, and 16kB or 32kB RAM.
  • Connectivity
    • Bluetooth Smart, ANT/ANT+ and 2.4GHz proprietary
    • Integrated PCB antenna
    • Connector for RF measurements
  • Expansions Headers
    • Arduino Uno Rev. 3 compatible connector for use with 3rd party shields
    • All I/O and interfaces available via connectors
  • Debugging
    • Segger J-Link OB and ARM CMSIS-DAP Program/Debug supported
    • Support for Program/Debug of external target boards
    • Pins for power consumption measurements
  • Misc – 4x user LEDs, 4x user buttons, power switch, reset button coin-cell battery holder (back of the board)
  • Power Supply – 3.6v -1.6v, battery and USB, external
  • Dimensions – 101 x 63 mm
nRF51 DK Pinout

nRF51 DK Pinout

nRF51 DK board supports Keil MDK, IAR Workbench, and GCC toolchains, as well as ARM mbed for rapid prototyping and development using mbed’s cloud-based IDE and toolchain. Software architecture is divided into two layers: Application, SoftDevices, the company’s embedded protocol stacks that include Bluetooth Smart peripheral stack, Bluetooth Smart B-link central stack, Bluetooth Smart concurrent central/peripheral/broadcaster/observer stack, ANT/ANT+ 8 link stack, and Bluetooth Smart peripheral/ANT 8-link stack. Documentation and tools including user’s guides, development tools and drivers, hardware reference files, can be downloaded on Nordic website, sometimes publicly, but most of the times after purchasing nRF51 DK kit. The board also supports OTA-DFU (Over The Air Device Firmware Update) for on-field wireless firmware updates.

The kit includes nRF51 DK board, a CR2032 battery, and 5x nRF51 Series SoC samples, and can be purchased for $69 from Nordic Semi’s distributors, such as Digikey or Mouser. More details can be found on Nordic’s nRF51 DK product page.

nRF51 USB Dongle

nRF51_DonglenRF51 Dongle is a tiny USB dongle that can comes with a user button, an RGB LED, a few GPIO headers, and be used for software development on the nRF51 Series SoCs, and is especially useful when used in conjunction with the company’s nRF Sniffer and Master Control Panel (MCP) firmware and software. nRF Sniffer tool capture BLE packets, which can be viewed in the well-known Wireshark network capture and analysis utility.

Key features listed for nRF51 Dongle:

  • Connectivity – Bluetooth Smart, ANT and 2.4GHz
  • Supports Master Emulator – Bluetooth Smart Peer connection firmware
  • Debugging:
    • Virtual COM port interface through UART
    • Segger J-Link OB and ARM CMSIS-DAP Program/Debug supported
  • Misc – User-programmable RGB LED and button, 6x solder pads for GPIO/interface connections
  • Dimensions – 16 x 28 mm

Development is done very much the same way as with nRF51 DK, including the same toolchains from Keil, IAR, GCC. and ARM (mbed), SoftDevices stacks, and it also support OTA-DFU.

Documentation and tools can be downloaded from nRF51 Dongle page, and the board is available for $49 from various distributors such as Mouser or Digikey.

Via Embedded.com

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ICube MVP SoCs Combine CPU and GPU into a Single Unified Processing Unit (UPU)

October 15th, 2014 2 comments

ICube is a fabless semiconductor company developing SoCs featuring a Unified Processing Unit (UPU) that takes care of the tasks usually handle by separate CPU and GPU on typical SoCs. The UPUs are based on MVP (Multi-thread Virtual Pipeline) instruction set architecture, and are themselves called MVP cores. The company has now two SoCs based on UPU MVP cores: IC3128 and IC3228.

IC3228 Block Diagram

IC3228 Block Diagram

IC3128 is a single core / 4 thread SoC, and IC3228 is a dual MVP core / 8 threads SoC. Let’s have a look at IC3228 technical specifications:

  • CPU function
    • 4-way simultaneous multi-threading (SMT) in each core
    • Symmetric-multi-processing (SMP), dual MVP cores
    • 64KB I-cache, 64KB D-cache and 64KB local memory in each core, 256KB shared L2 cache
    • Homogeneous parallel programs
    • Support Pthread, OpenMP
  • GPU function
    • Data parallel, Task parallel, and/or Function parallel computing
    • Multi-standard media processor
    • Programmable unified shader
    • Support OpenGL ES 2.0
    • 70 million triangles / sec, 300 million pixel / sec
  • System Clock – 600MHz (TSMC 65nm)
  • Multi-thread Processing
  • Simultaneous 8 threads (4 threads x dual core) and 8 hybrid threads
  • Processing Power – 5160 DMIPS (equivalent to 4.3 DMIPS/MHz per core)
  • Display System
    • LCD maximum pixel clock: [email protected] (24-bit) true color,
    • HDMI/DVI output capable
  • Camera – 8/10 bit camera data interface
  • Video – Support HD 720p H.264 decoding via pure software
  • Audio – Max. 5.1 channel audio
  • Memory – Support SD, SDHC, MMC card, USB mass storage device, Nand flash, NOR flash, DDR3 SDRAM
  • Power Control – 10 independent power domain, 3 low power modes
  • Connectivity and I/Os
    • USB host/slave
    • WiFi (external), 3G modem (external), GPS (external)
    • 12 keypad I/O for Qwerty keyboard
    • 4x UART; 2x I2C; 3x I2S; 4x SPI slave; 9x GPIO x 9; 3x PWM
  • Timers – Watchdog, RTC

IC3128 has only one MVP core (4 thread) @ up to 400 MHz, supports 800×400 displays, and can decode 480p videos (H.264, MPEG4, RMVB, and ) @ 25 fps, so it’s very much a low end processor, and you could easily argue that even IC3288 is pretty much low end by today’s standards, especially when it comes to media capabilities. 5,000 DMIPS correspond to what you could get with a single core ARM Cortex A9 processor clocked at 2 GHz.

The advantage for this new architecture is that the company does not need to purchase license for processor cores, GPU cores, etc.. potentially providing  a most cost effective solution, and development should not be hindered by binary blobs, and the obvious downside is that lots of work needs to be done to port software to this new architecture, but the company claims that Android 4.2 / Linux 3.4 have already been ported to the platform.

ICube Evaluation Board

ICube Evaluation Board

ICube also offers a reference platform based on IC3228 with a 4.3″ or 7″ display, HDMI, USB, etc..  for development and evaluation of their solution. Documentation, and Android SDK and NDK are provided with the kit.

I can’t find any product based on ICube MVP processors yet, as it’s still very new, but Rhombus Tech / Qimod has recently made a Micro Desktop prototype based on IC3128 processor, using an EOMA-68 module and a baseboard with Ethernet & USB ports (using SMIC 9514 controller), UART, a micro SD card, etc… and IC3128 price is indeed competitive as it’s supposed to sell for just $2.

There’s no publicly available documentation or source code just yet, but you may want to visit ICube website for a few more details.

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ITEAD Core AW204X AllWinner A20 SoM and Core EVB Baseboard

October 14th, 2014 1 comment

ITEAD Studio has been making systems-on-module based on Allwinner processors for a little while which are found in the company’s IBOX mini PC, MOD Duo guitar pedal, and more. They’ve now launched a new system-on-module with a 204-pin SO-DIMM connector instead of the headers used in the earlier modules.

AW2042_AllWinner_A20_System-on-Module

AW2042 SoM (Click to Enlarge)

ITEAD Core AW2041 / AW2042  SoM specifications:

  • SoC- AllWinner A20 dual core ARM Cortex-A7 @ 1 GHz + ARM Mali 400 MP2
  • System Memory – 1 or 2 GB DDR3 RAM (AW2014: 1GB, AW2042: 2GB).
  • Storage – 4GB NAND Flash, micro SD card slot (on the back), SATA connector.
  • Connector – 204-pin SO-DIMM edge connector with UART, I2C, SPI, LCD, I2S, LVDS, GPIO, etc.. signals
  • Misc – Built-in RTC, reset, FEL and power buttons.
  • Power – 5V supply, 3.3V I/Os. AXP209 PMIC.
  • Dimensions – 67.60 x 48.25 x 1.6 mm
  • Weight – 35 grams
  • Temperature Range – Commercial

To facilitate development, the company is also providing an open source hardware baseboard (Kicad) simply called “EVB Core”.

EVB Core (Click to Enlarge)

EVB Core (Click to Enlarge)

Baseboard specifications:

  • SoC / Memory / Storage – Via AW204x modules.
  • Eternal Storage – SATA port on module, 5V SATA power on EVB, 1x micro SD slot on EVB, 1x micro SD slot on module.
  • Video Output – HDMI 1.4, 18/24-bit single or dual channel LVDS
  • Audio – HDMI, optical S/PDIF, 3.5mm audio jack supporting 8 Ohm speakers @ 3W via included amplifier.
  • Connectivity – 10/100/1000M Ethernet
  • USB – 3x USB 2.0 OTG ports, 1x USB OTG port (full size)
  • Expansions Headers:
    • 32-pin connector (beige) with access to UART, I2C, SPI, I2S, and GPIO signals, that can be used with some add-on boards made by ITEAD Studio.
    • 40-pin headers compatible with Raspberry Pi Model B+ (UART/I2C/SPI/GPIO)
  • Misc – IR receiver, bicolor LED, power, reset, FEL buttons,
  • Power – 7-23V DC via 2.5mm power jack
  • Power Consumption – 200mA typical, 300mA max. @ 5V? (without devices attached to EVB)
  • Dimensions – 140.2 x 90 mm
  • Weight – 82 grams
  • Temperature Range – Operating: 0 to 60℃; storage: -40 to 80℃

The evaluation board can be fitted into IBOX metallic enclosure. The company provide supports for ITEAD OS based on Debian 7.0 (Link to SDK), and Android 4.2 for their modules. Some documentation, mostly the pinout diagrams. can be found on the Wiki for AW204x modules, and EVB Core.

Both the modules and baseboard appear to be available now. AW2041 SoM (1GB RAM) sells for $45, AW2042 (2GB RAM) for $60, and EVB Core for $29.99, so a complete development kit would start at $75.

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F&S Electronik Systeme Introduces eFus A9 Industrial Computer Modules Powered by Freescale i.MX6 SoC

October 7th, 2014 No comments

F&S Electronik Systeme, a German embedded systems company, has announced their efus A9 Computers-on-Module (CoM) based on Freescale i.MX6, are now in mass production. The CPU comes in two variants A9V2 for i.MX6 Solo, and A9V3 with i.MX6 DualLite, both of which are certified for automotive and industrial applications, and support commercial, extended, and industrial temperature ranges.

eFus_A9_CoM

eFuse A9 computer-on-module specifications:

  • SoC –  CPU Freescale i.MX6 Solo (eFus A9V2) or DualLite (eFus A9V3) @ up to 1.2 GHz + Vivante 2D and 3D GPUs
  • System Memory – 512MB (Up to 1GB RAM)
  • Storage – 256 MB NAND flash (Up to 1GB), 2 GB eMMC (eFus A9V3 only. up to 32GB), optional SPI NOR, optional I2C EEPROM
  • Display I/F – 18-bit RGB, 2x 24-bit LVDS, and DVI
  • Other interfaces available via 230 pins MXM-2 edge connector:
    • 2x SD card I/F
    • 1x Gigabit Ethernet
    • 1x USB Host, 1x USB Device
    • 2x CAN
    • 4x UART
    • 2x I2C, 2x SPI
    • I2S
    • Touch Panel ext. via I2C
    • 1x digital camera interface
    • 1x PCIe
  • Power Supply – +5VDC/ ±5%
  • Temperature Range – Operating: 0°C – +70°C, optional:-20°C – +85°C or -40°C – +85°C.
  • Dimensions – 47×62.1x11mm
  • Weight – 15 grams

eFus A9 modules come with BSPs for either Windows Embedded Compact 7, Windows Embedded Compact 2013, or Linux 3.3 operating systems. Wireless modules (Bluetooth, WLAN, ZigBee, Z-Wave, EnOcean) can also be connected to the CoM without changing the layout of the CPU area.

eFus A9 Starter Kit

eFus A9 Starter Kit

For evaluation and development, the company provides Starter kits composed of eFus A9 CoM and eFus Start Interface baseboard with the following hardware details:

  • CoM Connector – 230-pin MXM-2 socket
  • External Storage – 1x micro SD card slot, 1x SD card slot, 1x SATA (AFAIK not usable with i.MX6 Solo / DualLite modules)
  • Video Output – DVI/HDMI connector, digital RGB connector, backlight, resistive and capacitive touch headers
  • Audio I/F – HDMI, Line In, Line Out, Mic IN
  • Connectivity – 2x Ethernet RJ45 ports
  • USB – 2x USB 2.0 host ports, 1x micro USB device port
  • Camera – Analog and digital camera interfaces (analog not supported by current eFus A9 modules)
  • Expansion Headers:
    • 2×29-pin “feature” connector with SPI, I2C, PWM, UART, VBAT, etc…
    • 2×5-pin CAN headers
    • Three 2×5 serial headers
  • Expansion slots – mini PCIe socket
  • Misc – Reset button, RTC with battery slot
  • Power Supply – 5V power barrel

There are four versions of the starter kit depending on the operating system (Linux or Windows), and the version (V2 or V3) or the eFus CoM. The kit includes the baseboard and module, as well as a cable kit, and access data to documentation and software. V3 kit also adds a 7“ WVGA TFT display.

F&S eFus A9 computer-on-modules are available now starting at 39 Euros, Starterkit efus A9 Linux/Windows (V3 module) for 399 Euros including the display, and Starterkit 2 efus A9 Linux/Windows (V2 module) for 169 Euros. The company commits to long term availability of the modules until 2027. Further details about the modules and devkits, including some publicly available hardware and software documentation,  can be found on F&S Electronik Systeme’s eFus A9 product page.

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