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Posts Tagged ‘hisilicon’

Linaro 15.07 Release with Linux 4.2 and Android 5.1

July 31st, 2015 No comments

Linaro 15.07 has been released with Linux 4.2-rc3 (Baseline), Linux 3.10.83, 3.14.45 and 3.18.17 (LSK), and Android 5.1.1_r8.

The Linux kernel got various bug fixes, and a power reduction technique has been implemented for Qualcomm processor. Progress has been made to boot Android with UEFI on Hikey board, and work is still on-going on 96boards including Hisilicon Hikey, Qualcomm DragonBoard 410c, and an upcoming and yet-to-be-formally-announced Marvell PXA1928 board called Helium.

Highlights of this release:

  • Linux Linaro 4.2-rc3-2015.07
    • linaro-android topic updated to 4.2-rc3 and recent AOSP/android-3.18
    • included GATOR version 5.21.1
    • llct-misc-fixes topic: “HACK: of: Limit FDT size for CRC check on arm64” has been dropped. FVP model was the last target to require this hack, but the new FVP firmware doesn’t need it anymore
    • updated integration-linaro-vexpress64 topic by ARM LT: Versatile Express TC2 support is back, HDLCD display now works on TC2, the topic will be renamed to integration-linaro-vexpress next cycle
    • updated integration-linux-qcomlt topic by Qualcomm LT: QCOM Core Power Reduction (CPR) support has been added
    • linaro-builddeb-tweaks topic is dropped (most of our changes have been upstreamed)
  • Linaro builds of AOSP 15.07
    • Android baseline updated to 5.1.1_r8
    • ART CI setup for TIP and stable builds
      • Boot to gui tests added for tip and stable builds
      • ART code coverage for tip and stable builds
      • m-preview based builds setup for emulators
      • ART-host-gtests added for tip and stable builds
    • Hikey builds updated to 5.1.1_r8. Android boots with UEFI and GRUB on HiKey. Wifi drivers are integrated in the build system. Drivers are built as part of Android build process.
  • Linaro OpenEmbedded 2015.07
    • integrated Linaro GCC 4.9-2015.06
    • updated linux-linaro to 4.2-rc3
    • disabled aarch64 bootwrapper
    • integrated various improvements for LNG CI
    • upstreaming:
      • fixed bootimg.bbclass to work with all kernel image types
      • fixed cmake builds for native recipes
  • Linaro Ubuntu 15.07 – updated packages: fvp-pre-boot (FVP firmware), LSK 3.10.83/3.14.45/3.18.17 and linux-linaro 4.2-rc3 kernels
  • 96boards contributions:
    • DragonBoard 410c is now using NetworkManager only to manage the network (previously a combination with systemd-networkd/resolved has been used).
    • HiKey made some progress toward the switch to UEFI. GRUB is now integrated into the snapshots builds for both AOSP and Debian.
    • Initial Debian based build for Marvell PXA1928 Helium is setup and available.

Visit https://wiki.linaro.org/Cycles/1507/Release for a list of known issues, and further release details about the LEB, LMB (Linaro Member Builds), and community builds, as well as Android, Kernel, Graphics, Multimedia, Landing Team, Platform, Power management and Toolchain components.

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HiSilicon D02 Server Board Supports up to 64 ARM Cortex A57 Cores

February 16th, 2015 10 comments

HiSilicon has showcased their latest server SoC and board at Linaro Connect Hong Kong 2015, with up to two processors with 32 Cortex A57 cores @ 2.1GHz, 8 DIMM DDR3 slots (up to 128 GB RAM), 12 SATA ports, 4 PCIe slots, 10GbE / GbE ports.

HiSilicon_D02D02 board specifications:

  • SoC – Hisilicon PhosphorV660 Hip05 with 16 to 32 ARM Cortex-A57 cores @ up to 2.1GHz and 1MB L2 cache/cluster, 32MB L3 cache
  • System Memory – 2x Memory channel 4x DDR3 DIMM(4x DIMM per processor)
  • Storage
    • 12x SAS 3.0 ports @ 12 Gbps (8 for the first processor, 4 for the second).  SAS port are compatible with SATA drives. You may want to read SAS vs SATA post for more details about SAS.
    • 2x SPI Flash 158Mb BIOS/UEFI
    • 1Gb NorFlash
  • Connectivity – 2×10/100/1000Mbit/s Gigabit Ethernet ports, 2x xGE SFP+ ports (10Gb/s)
  • Expansion – 2x 8x PCI express interfaces per processor (4 in total)USB – 1x USB 2.0 host port
  • Debugging – 1x UART interface, 1x ARM Tracer connector, 1x JTAG interface
  • Misc – RTC battery
  • Power – ATX power supply
  • Dimensions – 305 x xyz mm (SSI-EEB/E-ATX Compatible). xyz = 330, 257, 272, 264, or 267 (Not sure yet)

The board can run Ubuntu, Debian, OpenSUSE, or Fedora. The company has released a hacking manual for D02 board, where you can find more details, and learn how to build the kernel, and hack around with Grub and UEFI among other things.

For example, provided you’ve already installed the right development tools,. including Aarch64 toolchain, you should be able to build the kernel for the board as follows:

git clone  https://github.com/hisilicon/estuary
cd estuary
export ARCH=arm64
export CROSS_COMPILE=aarch64-linux-gnu-
make hulk_defconfig
make -j8
make ./hisilicon/hip05-d02.dtb

Binary files can also be downloaded directly from https://github.com/hisilicon/d02_binary.

Charbax filmed a demo of the board running Ubuntu, Linaro LAVA server, and LXC (Linux Containers). The board currently come with Hip05 SoC with 16 Cortex A57 cores, but in a couple of months, the version with 32 cores will come out, and and Linaro engineers working on ARM64 server should get their hands on several boards.

Via ARMdevices.net

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ARM Unveils Cortex A72 Processor and Mali-T880 GPU

February 4th, 2015 5 comments

ARM has just announced their new Cortex A72 ARMv8 core with 3.5 times the performance of Cortex A15 ARMv7 cores, together with Mali-T880 GPU delivering 1.8 times the performance of  Mali-T760, and CoreLink CCI-500 Cache Coherent Interconnect to link the new CPU, GPU and I/Os together.

ARM Cortex A72

Cortex-A72Some of the key features of the new core include:

  • Architecture – ARMv8-A
  • Multicore – 1-4x SMP within a single processor cluster, and multiple coherent SMP processor clusters through AMBA 5 CHI or AMBA 4 ACE technology
  • ISA Support
    • AArch32 for full backward compatibility with ARMv7
    • AArch64 for 64-bit support and new architectural features
    • TrustZone security technology
    • NEON Advanced SIMD
    • DSP & SIMD extensions
    • VFPv4 Floating point
    • Hardware virtualization support
  • Cache – 48KB I-cache, 32KB D-cache, and 512 KB to 2MB L2 cache with ECC
  • Debug & Trace – CoreSight DK-A57
  • Process – 16nm FinFET

A cluster can support up to 4 Cortex A72 cores clocked up to 2.5 GHz in mobile devices and higher frequencies for larger form factor devices such as servers. Cortex A72 cores may also be combined with low power Cortex A53 cores in big.LITTLE configuration for power efficient SoCs.

Cortex_A72_Performance

Relative Performance – Cortex A15 vs Cortex A57 vs Cortex A72

ARM also claims 75% power usage reduction in typical mobile workloads thanks to the new 16nm FinFET manufacturing processor. Expected applications include premium smartphones, larger screen mobile devices, enterprise networking, servers, wireless infrastructure, digital TV, and automotive ADAS/IVAI.

ARM Mali-T880 GPU

Mali-T880_GPUTechnical specifications for Mali-T880 GPU:

  • Anti-Aliasing – 4x MSAA, 8x MSAA, 16x MSAA
  • API Support
    • OpenGL ES 1.1, 1.2, 2.0, 3.0, 3.1
    • OpenCL 1.1, 1.2
    • DirectX 11 FL11_2
    • RenderScript
  • Bus Interface – AMBA4, ACE-LITE
  • L2 Cache – 256 to 2048KB (256 to 512KB for every 4 shader cores
  • Memory System – Virtual Memory with built-in Memory Management Unit (MMU)
  • Multi-Core Scaling – 1 to 16 cores
  • Adaptive Scalable Texture Compression (ATSC) – Low dynamic range (LDR) and high dynamic range (HDR) for 2D and 3D images
  • ARM Frame Buffer Compression (AFBC) – 4×4 pixel block size (lossless image compression format)
  • Transaction Elimination – 16×16 pixel block size (Only performs a partial update to the frame buffer with the changed pixel blocks)
  • Smart Composition – 16×16 pixel block size (Identical pixel blocks of input surfaces are not read, not processed for composition and not written to final frame buffer)

The GPU is also manufactured with 16nm FinFET process. Mali-T880MP16 can be clocked up to 850 MHz, and outputs up to 1700 million triangles per second, and 13.6 gigapixels per second. That’s 1.8 times better performance than Mali-T760, and ARM also claims 40% more energy efficiency.

ARM Cortex A75 processor, Mali-T880 GPU, CoreLink-C500 cache coherent interconnect, Mali-DP550 display processor unit, and  Mali-V550 video processor can be combined to create SoCs support 4K video output, and decoding up to 120 fps.

Ten partners have already become licensees including Rockchip, Mediatek, and HiSilicon, and products are expected in (early) 2016. Further details may be found on ARM’s Cortex A72 and Mali-T880 product pages.

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How to Upgrade Firmware in HiSilicon Hi3798M TV Boxes

January 13th, 2015 5 comments
HiSilicon based Android TV boxes are not that popular, at least outside of China, but I’ve got one with BFS 4KH featuring HiSilicon Hi3798M processor, and since we could not fix AC3 audio decoding after a factory reset in the firmware I have, the company provided me with a new firmware, and I’ll document the procedure I followed below.
  1. Download the firmware, the file should be update.zip. For BFS 4KH, I could get it @ http://pan.baidu.com/s/1kTrCcMr (password: xpef). It includes YouTube and Google Play, but not the Rainbow launcher, nor XBMC, but these can be side-loaded.
  2. Now copy update.zip on the root of a USB flash drive formatted with FAT32, and at least 1GB free storage.
  3. Connect the USB flash to the USB 2.0 port of the device, as the USB 3.0 port can’t be used for firmware upgrade.
  4. In the current firmware, go to Settings->System->Local Update, and select the drive letter for the USB drive (e.g. D), and you should be prompted with a window asking you want to go ahead with the upgrade.
    hisilicon_firmware_upgrade
  5. The box will then reboot, show the usual Android upgrade animation, and reboot automatically in the new firmware.
  6. Done

Overall the procedure is very similar what is done on Amlogic devices.

Now the test firmware I received did not include XBMC, nor the necessary codec. So I installed XBMC for HiSilicon (password: amaw) and MXPlayerCodec (works with BFS 4KH only), and I could run XBMC, and downmixed audio worked with AC3, and some other Dolby and DTS codec.

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Hisilicon Hi3798M Quad Core Android TV Box with USB 3.0, and 4K / HEVC Support Sells for $53

December 8th, 2014 4 comments

I’ve been informed about a quad core Cortex A7 TV box supporting 2160p output, H.265 codec and featuring a USB 3.0 port, that’s currently selling for just $52.99 on Aliexpress including shipping, as well as Ebay for $62 from the same seller. Only “quad core ARM cortex A7” was listed in the specs, and the exact processor was not mentioned, but I could see marketing material about “Q3 quad core” used, and a quick search redirected me to Himedia Q3 Quad Core also powered by an Hisilicon processor, but a different device. So I decided to contact the seller (“Buyforsure”) who quickly replied it was indeed powered by Hisilicon Hi3798M processor.

Hisilicon_quad_core_TV_box

The model is called BFS 4KH on Aliexpress/Ebay, but that name has probably been made up by the seller, so it will also be found under other name. Nevertheless here are the specifications of this low cost 4K TV Box:

  • SoC – HiSilicon Hi3798M V100 quad core ARM Cortex A7 @ 1.5GHz + quad core ARM Mali-450MP GPU.
  • System Memory – 1 GB DDR3
  • Storage – 8GB NAND Flash
  • Video Out – HDMI 1.4a with HDCP 1.2, and composite RCA output
  • Audio Output – HDMI, and L/R stereo output (RCA)
  • Video Codecs – MPEG1/2/4, H.264/AVC, H.265, VC-1, REALVIDEO 8/9/10, XviD, DviX, VP6 ,etc.. up to 2160p
  • Audio Support – MP3, WMA, AAC, APE, FLAC, WAV, MKA, DTS, DTS HD, Dolby Digital Plus, Dolby True HD,
  • Connectivity – 10/100M Ethernet, and 802.11 b/g/n Wi-Fi with external antenna
  • USB – 1x USB 3.0 port, 1x USB 2.0 host port
  • Misc – Power switch (On/Off)
  • Power Supply – N/A
  • Dimensions – N/A

4KH_Media_player_Hisilicon_Hi3798M_USB_3.0

The box runs Android 4.4.2 with Google Play support, and XBMC pre-installed. It ships with an IR remote control, a power adapter, and an HDMI cable. Supported file systems include NTFS, FAT32, and EXT2/3. In theory, it’s great to have a USB 3.0 port, but it becomes pretty useless, as least for storage devices, if all you have is 10/100M Ethernet, or 802.11n Wi-Fi. Unfortunately, this HiSilicon processor only features an 10/100M Ethernet PHY, so it’s a limitation from the processor itself, and not the device. The power on/off switch is mechanical, but power control is allegedly handled by an MCU, which could allow clean power off, and power on from the remote control.

I’ve included a block diagram for Hi3798M for reference below. Also it only shows 1080p60 for the video decoder, the product brief specifies 4K x  2K video decoding is indeed supported.

Hi3798M V100 Block Diagram (Click to Enlarge)

Hi3798M V100 Block Diagram (Click to Enlarge)

Thanks to Gabe for the tip.

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Huawei Introduces Kirin 620 Octa Core Cortex A53 LTE SoC for Smartphones

December 3rd, 2014 1 comment

Huawei / Hisilicon has announced a new 64-bit ARM processor with Kirin 620 featuring eight ARM Cortex A53 cores coupled with a Mali-450MP GPU, as well as an LTE Cat4 modem.

Kirin_620Key specifications of this application processor include:

  • CPU – 8x ARM Cortex A53 @ 1.2 GHz
  • GPU – Mali-450MP4 GPU
  • Memory – LPDDR3
  • Camera – 13MP, ZSL (Zero Shutter Lag), HDR
  • Video – Decode & Encode: 1080p30 H.264
  • Cellular connectivity – LET Cat4 150M/50M, HSPA+ Cat24 42M / Cat6 5.76M, TDS R7 2.8M/2.2M, GSM R6 Class33
  • Voice Solution – VoLTE/eSRVCC, CSFB, SGLTE, DSDA, DSDS
  • Peripherals – USB, HSIC, SD/MMC, DMAC
  • Process – 28 nm

Kiron_620_block_diagram

That’s about all I know so far. Hisilicon mobile SoCs have not found their way in many handsets in the past, apart from Huawei smartphones. We’ll see if that one becomes more popular.

Via AndroidPC.es and Android Headlines.

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Linaro 14.09 Release with Kernel 3.17 and Android 4.4.4

September 27th, 2014 No comments

Linaro 14.09 has just been released with Linux kernel 3.17-rc4 (baseline), Linux 3.10.54 & 3.14.19 (LSK), and Android 4.4.2 & 4.4.4.

Linaro has kept working on their member boards such as IFC6410 (Qualcomm), D01 (Huawei/Hisilicon), Ardnale (Samsung), and Juno (ARM). They’ve also announced they’ll change the tools to build GCC by using cbuild2 instead of cbuild1 for next release, and they’ve enabled a build with gcov (for code coverage analysis) which may mean they’ll work on reducing the kernel size by getting rid off unused code. I’ve also noticed the Arndale and Arndale Octa Ubuntu images are now based on Linux LSK with Mali GPU support since last month.

Here are the highlights of this release:

  • Linux Linaro 3.17-rc4-2014.09
    • GATOR version 5.19
    • updated topic from Qualcomm LT (ifc6410 board support) and HiSilicon LT
    • updated Versatile Express ARM64 support (FVP Base and Foundation models, Juno) from ARM LT.
    • updated Versatile Express patches from ARM LT
    • updated LLVM topic (follows the community llvmlinux-latest branch)
    • Big endian support (the 2014.05 topic version rebased to 3.17 kernel)
    • config fragments changes – added gcov config fragment, disabled DRM_EXYNOS_IOMMU to work around boot failure on Arndale
  • Linaro Toolchain Binaries 2014.09
    • based on GCC 4.9 and updated to latest Linaro TCWG releases: Linaro GCC 4.9-2014.09, Linaro binutils 2.24-2014.09, and Linaro GDB 7.8-2014.09.
    • This will be the last release done with cbuild1 and crosstool-ng. Next releases will be done with cbuild2. Official support for very old host environments will be dropped.
  • Linaro builds of AOSP 14.09 built with Linaro GCC 4.9-2014.09.
  • Linaro OpenEmbedded 2014.09
    • integrated Linaro GCC 4.9-2014.09, Linaro binutils 2.24-2014.09, integrated Linaro GDB 7.8-2014.09.
    • imported Linaro eglibc 2.19 into meta-linaro after OE-core switched to glibc 2.20
    • fixed shadow securetty for Qualcomm and STMicroelectronics SoCs
    • upstreaming – fixed libpng on aarch64 (neon symbol), updated PM QA to 0.4.14, updated libunwind to include aarch64 support
  • Linaro Ubuntu 14.09
    • added linux-tools (perf standalone, splitted from kernel build)
    • updated packages: Juno firmware 0.8.1, LSK 3.10.55/3.14.19 and linux-linaro 3.17-rc4 kernels.
  • A gcov enabled build has been added
  • Linaro builds of the Android NDK have been updated to current upstream sources and current Linaro toolchain component releases.
  • Standalone Android toolchain binary builds now use Linaro binutils for improved armv8 support.

You can visit https://wiki.linaro.org/Cycles/1409/Release for a list of known issues, and further release details about the LEB, LMB (Linaro Member Builds), and community builds, as well as Android, Kernel, Graphics, Multimedia, Landing Team, Platform, Power management and Toolchain components.

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Linaro 14.07 Release with Linux Kernel 3.16 and Android 4.4

August 1st, 2014 No comments

Linaro 14.07 has just been released with Linux Kernel 3.16-rc6 (baseline), Linux Kernel 3.10.50 (LSK), and Android 4.4.4.

This month, Linaro has continued development on Juno 64-bit ARM development board, as well as other member boards from Broadcom (Capri), Qualcomm (IFC6410), Hisilicon D01, Samsung (Arndale / Arndale Octa), etc.. Android have been upgraded to version 4.4.4 with images released for Pandaboard, Arndale, Nexus 10, and Nexus 7, built with Linaro GCC 4.9.

Here are the highlights of this release:

  • Linux Linaro 3.16-rc6-2014.07 released
    • GATOR version 5.18 (same version as in 2014.04)
    • updated basic Capri board support from Broadcom LT. Good progress in upstreaming the code: now the topic has 21 patch on top of v3.16-rc4 vs 53 patches on top of v3.15 in 2014.06 cycle
    • removed cortex-strings-arm64 topic as the code is accepted into the mainline
    • new topic from Qualcomm LT to add IFC6410 board support
    • updated Versatile Express ARM64 support (FVP Base and Foundation models, Juno) from ARM LT. cpufreq support for Juno has been added.
    • updated Versatile Express patches from ARM LT
    • more HiP0x Cortex A15 family updates from HiSilicon LT
    • switched to mainline support for Arndale and Arndale-octa boards
    • updated llvm topic (follows the community llvmlinux-latest branch)
    • Big endian support (the 2014.05 topic version rebased to 3.16 kernel)
    • removed ftrace_audit topic as the code is accepted into the mainline
    • config fragments changes – added ifc6410.conf
  • Linaro Toolchain Binaries 2014.07 released – Based on GCC 4.9 and updated to latest Linaro TCWG releases:  Linaro GCC 4.9-2014.07 & Linaro binutils 2.24.0-2014.07
  • Linaro Android 14.07 released
    • built with Linaro GCC 4.9-2014.07
    • Pandaboard, Arndale, Nexus 10, Nexus 7 upgraded to Android 4.4.4.
    • LSK Engineering build moved back to 4.4.2.
    • Android LSK v3.14 CI loop added
  • Linaro OpenEmbedded 2014.07
    • Integrated Linaro GCC 4.9-2014.07
    • Integrated Linaro EGLIBC 2.19-2014.07
    • Integrated Linaro binutils 2.24.0-2014.07
    • Upstreaming:
      • fixes recipes related to oe-core autotools update
      • cleaned up overlayed recipes
      • updated PM QA to 0.4.12
  • Linaro Ubuntu 14.07 released
    • added gstreamer 1.0
    • updated packages: ARM trusted firmware (support latest FVP models), PM QA (0.4.12), LSK 3.10.49/3.14.13 and linux-linaro 3.16-rc6 kernels.
  • Integrate ARMv8 Big endian systems into LAVA and CI
  • Migrate Linaro Android builds to 4.9 Linaro toolchain
  • LSK: add ARMv8 kernel + arm32 rootfs CI loop
  • Package rt-app
  • LSK: enable member kernel configs for build testing

You can visit https://wiki.linaro.org/Cycles/1407/Release for a list of known issues, and further release details about the LEB, LMB (Linaro Member Builds), and community builds, as well as Android, Kernel, Graphics, Multimedia, Landing Team, Platform, Power management and Toolchain components.

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