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Posts Tagged ‘huawei’

Open Source Code Released for Hisilicon Kirin 960 Based Huawei Mate 9 and Huawei P10 Smartphones

June 7th, 2017 4 comments

Manufacturers of products using open source software are normally required to release the source code with their modifications to follow licenses such as the GPL, but not all comply with the license. Huawei has now released the source code with Linux and other open source libraries and programs for their Huawei Mate 9 / Mate 9 Pro and Huawei P10 / P10 Plus models powered by Hisilicon Kirin 960 processor.

With the release of Hikey 960 development board most of the source code for Kirin 960 should already be available, but it’s possible some drivers/modules specific to Huawei phones may be found instead of in the Huawei release.  You’ll find the download in Huawei’s open source page for:

I picked up the LON-NG_EMUI5.0_opensource.tar.gz tarball for Mate 9 Pro (442 MB), and it comes with three directories: external with various open source programs and libraries,  kernel with Linux 4.1.18, and vendor with ffmpeg.

The build instructions for the Linux kernel are also included in the tarball:

################################################################################

1. How to Build
– get Toolchain from android git server, codesourcery and etc ..
– aarch64-linux-android-4.9

– edit Makefile
edit CROSS_COMPILE to right toolchain path(You downloaded).
Ex)   export PATH=$PATH:$(android platform directory you download)/prebuilts/gcc/linux-x86/aarch64/aarch64-linux-android-4.9/bin
Ex)   export CROSS_COMPILE=aarch64-linux-android-

$ mkdir ../out
$ make ARCH=arm64 O=../out merge_hi3660_defconfig
$ make ARCH=arm64 O=../out -j8

2. Output files
– Kernel : out/arch/arm64/boot/Image.gz
– module : out/drivers/*/*.ko

3. How to Clean
$ make ARCH=arm64 distclean
$ rm -rf out
################################################################################

Via XDA Developers

Linux 4.10 Release – Main Changes, ARM & MIPS Architectures

February 20th, 2017 3 comments

Linus Torvalds has just released Linux 4.10:

So there it is, the final 4.10 release. It’s been quiet since rc8, but we did end up fixing several small issues, so the extra week was all good.

On the whole, 4.10 didn’t end up as small as it initially looked. After the huge release that was 4.9, I expected things to be pretty quiet, but it ended up very much a fairly average release by modern kernel standards. So we have about 13,000 commits (not counting merges – that would be another 1200+ commits if you count those). The work is all over, obviously – the shortlog below is just the changes in the last week, since rc8.

Go out and verify that it’s all good, and I’ll obviously start pulling stuff for 4.11 on Monday. Linus

Linux 4.9 added Greybus staging support, improved security thanks to virtually mapped kernel stacks, and memory protection keys, included various file systems improvements, and many more changes.

Some newsworthy changes for Linux 4.10 include:

  • Virtual GPU support – Intel GVT-g for KVM (KVMGT) is a full GPU virtualization solution with mediated pass-through, starting from 4th generation Intel Core processors with Intel Graphics. Unlike direct pass-through alternatives, the mediated device framework allows KVMGT to offer a complete virtualized GPU with full GPU features to each one of the virtualized guests, with part of performance critical resources directly assigned, while still having performance close to native.
  • New ‘perf c2c’ tool, for cacheline contention analysis – perf c2c (for “cache to cache”) is a new tool designed to analyse and track down performance problems caused by false sharing on NUMA systems. The tool is based on x86’s load latency and precise store facility events provided by Intel CPUs. Visit C2C – False Sharing Detection in Linux Perf for more details about the tool.
  • Improved writeback management – Linux 4.10 release adds a mechanism that throttles back buffered writeback, which makes more difficult for heavy writers to monopolize the I/O requests queue, and thus provides a smoother experience in Linux desktops and shells than what people was used to. The algorithm for when to throttle can monitor the latencies of requests, and shrinks or grows the request queue depth accordingly, which means that it’s auto-tunable, and generally, a user would not have to touch the settings. Read Toward less-annoying background writeback for more details about this improvement.
  • FAILFAST support –  This release also adds “failfast” support. RAID disk with failed IOs are marked as broken quickly, and avoided in the future, which can improve latency.
  • Faster Initial WiFi Connection – Linux 4.10 adds support for using drivers with Fast Initial Link Setup as defined in IEEE 802.11ai. It enables a wireless LAN client to achieve a secure link setup within 100ms. This release covers only the FILS authentication/association functionality from IEEE 802.11ai, i.e., the other changes like scanning optimizations are not included.

Some notable ARM architecture improvements and new features:

  • Allwinner:
    • Allwinner A23 – Audio codec driver
    • Allwinner A31/A31s – Display Driver (first pipeline), audio codec support
    • Allwinner A64 – clock driver
    • Allwinner A80 – External SDIO WiFi
    • Allwinner H3 – Audio codec driver, SPI
    • New boards support: NextThingCo CHIP Pro, Pine A64, NanoPi M1
  • Rockchip:
    • Initial support for Rockchip PX5 & PX3 automotive platforms
    • Added Rockchip RK1108 evaluation board
    • Added support for Rikomagic MK808 Android TV stick based on Rockchip RK3066
    • Update Rockchip PCI driver to support for max-link-speed
    • Rockchip rk3399,rk3066 PLL clock optimizations
  • Amlogic
    • Support for the pre-release “SCPI” firmware protocol shipped by Amlogic in their GXBB SoC
    • Initial support for Amlogic S905D, and S912 (GXM) SoCs
    • Added support for Nexbox A1 and A95X Android TV boxes
    • Cleanup for the Amlogic Meson PWM driver
    • New Amlogic Meson Graphic Controller GXBB (S905)/GXL (S905X/S905D)/GXM (S912) SoCs (meson)
    • Resets for 2nd USB PHY
    • Initial support for the SD/eMMC controller in the Amlogic S905/GX* family of SoCs
    • Updated DTS to enable support for USB, I2C, SPI, maibox/MHU, PWM, ethernet MAC & PHY, secure monitor, IR, and watchdog.
  • Samsung
    • Device Tree for Samsung Exynos5433 mobile phone platform, including an (almost) fully supported phone reference board
    • Added support for TOPEET itop/elite board based on exynos4412
    • DeviceTree  updates:
      • Add Performance Monitor Unit to Exynos7.
      • Add MFC, JPEG and Gscaler to Exynos5433 based TM2 board.
      • Cleanups and fixes for recently added TM2 and TM2E boards.
      • Enable ADC on Odroid boards
      • Remove unused Exynos4415 DTSI
  • Qualcomm
    • Add support for Qualcomm MSM8992 (Snapdragon 808) and MSM8994 (Snapdragon 810) mobile phone SoCs
    • Added support for Huawei Nexus 6P (Angler) and LG Nexus 5X (Bullhead) smartphones
    • Support for Qualcomm MDM9615 LTE baseband
    • Support for WP8548 MangOH Open Hardware platform for IOT, based on Qualcomm MDM9615
    • Other device tree changes:
      • Added SDHC xo clk and 1.8V DDR support
      • Add EBI2 support to MSM8660
      • Add SMSC ethernet support to APQ8060
      • Add support for display, pstore, iommu, and hdmi to APQ8064
      • Add SDHCI node to MSM8974 Hammerhead
      • Add Hexagon SMD/PIL nodes
      • Add DB820c PMIC pins
      • Fixup APQ8016 voltage ranges
      • Add various MSM8996 nodes to support SMD/SMEM/SMP2P
  • Mediatek
    • Added clock for Mediatek MT2701 SoCs
    • New Mediatek drivers: mtk-mdp and mtk-vcodec (VP8/VP9/H.264) for MT8173
    • Updated the Mediatek IOMMU driver to use the new struct device->iommu_fwspec member
  • Other new ARM hardware platforms and SoCs:
    • Hisilicon – Hip07 server platform and D05 board
    • NXP – LS1046A Communication processor, i.MX 6ULL SoC, UDOO Neo board, Boundary Devices Nitrogen6_SOM2 (i.MX6), Engicam i.CoreM6, Grinn i.MX6UL liteSOM/liteBoard,  Toradex Colibri iMX6 module
    • Nvidia – Early support for the Nvidia Tegra Tegra186 SoC, NVIDIA P2771 board, and NVIDIA P3310 processor module
    • Marvell – Globalscale Marvell ESPRESSOBin community board based on Armada 3700, Turris Omnia open source hardware router based on Armada 385
    • Renesas “R-Car Starter Kit Pro” (M3ULCB) low-cost automotive board, Renesas RZ/G (r8a7743 and r8a7745) application processors
    • Oxford semiconductor (now Broadcom) OX820 SoC for NAS devices, Cloud Engines PogoPlug v3 based on OX820
    • Broadcom – Various wireless devices: Netgear R8500 router, Tenda AC9 router, TP-LINK Archer C9 V1, Luxul XAP-1510 Access point
    • STMicro  – stm32f746 Cortex-M7 based microcontroller
    • Texas Instruments – DRA71x automotive processors, AM571x-IDK industrial board based on TI AM5718
    • Altera – Macnica Sodia development platform for Altera socfpga (Cyclone V)
    • Xilinx – MicroZed board based on Xilinx Zynq FPGA platforms

That’s a long list of changes and new boards and devices… Linux 4.10 only brings few MIPS changes however:

  • KVM fixes: fix host kernel crashes when receiving a signal with 64-bit userspace,  flush instruction cache on all vcpus after generating entry code (both for stable)
  • uprobes: Fix uprobes on MIPS, allow for a cache flush after ixol breakpoint creation
  • RTC updates:  Remove obsolete code and probe the jz4740-rtc driver from devicetree for jz4740, qi_lb60
  • microblaze/irqchip: Moved intc driver to irqchip. The Xilinx AXI Interrupt Controller IP block is used by the MIPS based xilfpga platform and a few PowerPC based platforms.
  • crypto: poly1305 – Use unaligned access where required, which speeds up performance on small MIPS routers.
  • MIPS: Wire up new pkey_{mprotect,alloc,free} syscalls

You can also read Linux 4.10 changelog with comments only, generated using git log v4.9..v4.10 --stat, in order to get a full list of changes. Alternatively, you could also read Linux 4.9 changelog on kernelnewbies.org.

Huawei Unveils Mate 9 HiSilicon Kirin 960 Smartphone with 5.9″ display, 4GB RAM, 64GB Storage

November 4th, 2016 10 comments

Hisilicon Kirin 960 is one of the most powerful ARM mobile processor to date with four ARM Cortex A73 cores up to 2.4 GHz, four low power Cortex A53 cores, and a Mali G71MP8 GPU. It was expected in Huawei Mate 9 smartphone, but we did not have that many details, and now the company has made it official.

huawei-mate-9Huawei Mate 9 specifications:

  • SoC – HUAWEI/HiSilicon Kirin 960 octa-core processor with 4 Cortex A73 cores @ up to 2.4 GHz A73, four Cortex A53 cores at up to 1.8 GHz, a Mali-G71 MP8 GPU, and i6 co-processor/sensor hub
  • System Memory – 4GB RAM
  • Storage – 64GB UFS 2.0 flash + micro SD card slot up to 256 GB
  • Display – 5.9″ FHD (1920 x 1080) display, 373ppi, 16.7M colors
  • Audio – 4x microphones, stereo? speakers, 3.5mm headphone jack!
  • Cellular connectivity
    • MHA-L29 model: dual SIM support (one share with micro SD slot)
      • SIM1: 4G TDD and FDD LTE, 3G UMTS/HSPA+/DC-HSDPA, 3G TD-SCDMA, CDMA EV-DO Rev.A (China Telecom only), 2G GSM
      • SIM2: 3G UMTS (Band 1/2/4/5/6/8/19), CDMA: BC0 (800MHz) only for China Telecom, 2G GSM: 850/900/1800/1900MHz
    • MHA-L09 model: single SIM support with 4G TDD & FDD LTE, 3G UMTS/HSPA+/DC-HSDPA, 3G TD-SCDMA, 2G GSM
  • Wireless connectivity – 802.11a/b/g/n/ac WiFi, Bluetooth 4.2 LE, GPS/Glonass/Galileo/BDS, NFC
  • Camera
    • 20 MP monochrome + 12 MP RGB rear camera, F2.2, OIS (Optical image stabilization), BSI CMOS, Dual-tone flash, PDAF+CAF+Laser+Depth auto focus,2x Hybrid zoom, 4K H.265 / H.264 video recording
    • 8MP front-facing camera with autofocus, F1.9
  • USB – 1x USB type C (high speed) port
  • Sensors – Fingerprint Sensor, G-Sensor, Gyroscope sensor, Compass, Ambient Light Sensor, Proximity sensor, Hall sensor, Barometer, IR
  • Battery – 4,000 mAh good for about two days typical usage, 20 hours video playback, 105 hours music playback, 30 hours of 3G voice calls and 20 hours of 4G browser; About 1 day charge is possible in 20 minutes thanks to 5A charging current.
  • Dimensions – 156.9 x 78.9 x 7.9 mm (All metal body)
  • Weight – 190 grams

The phone will run Android 7.0 with EMUI 5.0 skin, and ship with a audio headset, a  charger, a USB-C cable, a USB-C to Micro USB adapter, an eject tool, a Quick Start Guide, and a Matte case. Beside faster processor, memory and storage, and a larger display, the phone comes with dual rear cameras for better photos, as well as large battery to longer use between charges.

The phone is expected to sell for 699 Euros inc. VAT in Europe by the end of the year, as well as in other locales but pricing and availability have not been disclosed so far. If you are financially well-off, you could also consider the Porsche edition with more memory (6GB), more storage (128 GB), a smaller 5.5″ display, and a 1395 Euros price tag.

HiSilicon Kirin 960 Octa Core Application Processor Features ARM Cortex A73 & A53 Cores, Mali G71 MP8 GPU

October 20th, 2016 2 comments

Following on Kirin 950 processor found in Huawei Mate 8, P9, P9 Max & Honor 8 smartphones, Hisilicon has now unveiled Kirin 960 octa-core processor with four ARM Cortex A73 cores, four Cortex A53 low power cores, a Mali G71 MP8 GPU, and an LTE Cat.12 modem.

kirin-960-block-diagram

The table below from Anandtech compares features and specifications of Kirin 950 against the new Kirin 960 processor.

SoC Kirin 950 Kirin 960
CPU 4x Cortex A72 (2.3 GHz)
4x Cortex A53 (1.8 GHz)
4x Cortex A73 (2.4 GHz)
4x Cortex A53 (1.8 GHz)
Memory
Controller
LPDDR3-933
or LPDDR4-1333
(hybrid controller)
LPDDR4-1800
GPU ARM Mali-T880MP4
@ 900 MHz
ARM Mali-G71MP8
@ 900 MHz
Interconnect ARM CCI-400 ARM CCI-550
Encode/
Decode
1080p H.264
Decode & Encode2160p30 HEVC
Decode
2160p30 HEVC & H.264
Decode & Encode2160p60 HEVC
Decode
Camera/ISP Dual 14bit ISP
940MP/s
Improved
Dual 14bit ISP
Sensor Hub i5 i6
Storage eMMC 5.0 UFS 2.1
Integrated
Modem
Balong Integrated
UE Cat. 6 LTE
Integrated
UE Cat. 12 LTE
4x CA
4×4 MIMO

ARM claims 30% “sustained” performance improvement between Cortex A72 and Cortex A73,  but the GPU should be where the performance jump is more significant, as ARM promises a 50 percent increase in graphics performance, and a 20 percent improvement in power efficiency with Mali G71 compared the previous generation (Mali-T880). Kirin 960 also integrates twice the GPU cores compared to Kirin 950, and some GPU benchmarks provided by Hisilicon/Huawei confirm the theory with over 100% performance improvement in both Manhattan 1080p offscreen and T-Rex offscreen GFXBench 4.0 benchmarks.

kirin960-gpu-performance
The first smartphone to feature Kirin 960 is likely to be Huawei Mate 9 rumored to come with a 5.9″ 2K display, 6GB RAM, and 256 UFS flash.

Android Wear 2.0 Developer Preview Release

May 19th, 2016 No comments

Google I/O 2016 has started, and among several announcements, Google released Android Wear 2.0 develop preview which according to the company is the “most significant update” since the launch of Android Wear two years ago.

Android_Wear_2.0Some noticeable changes include:

  • Standalone apps Android Wear apps can now access the Internet directly over Bluetooth, Wi-Fi, or cellular, without relying on a paired smartphone or tablet.
  • New system UI – New notification design and app launcher, as well as a new watch face picker.
  • Material design for wearables
  • Keyboard and handwriting input methods added
  • Google Fit platform – Improvements to the Google Fit platform make it easier to app developers to use fitness data and detect activity.
  • Android N Support – Data Saver, Java 8 Lambda support, emojis, etc…

A new Complication API has also been added to display small pieces of information directly on the watch face.

Preview images for LGE Watch Urbane 2nd Edition and Huawei Watch, so you can give it a try if you own any of these two smartwatches, or alternatively you could run the preview in the emulator. Bear in mind that it only a developer preview, so there should still be some bugs. Android Studio v2.1.1 is required for development on Android Wear 2.0.

Huawei Quick Charging Li-Ion Batteries Promise 10 Times Faster Charge

November 15th, 2015 1 comment

Watt Lab, part of Huawei’s Central Research Institute, has demonstrated new fast charging batteries for smartphone and tablets at the 56th Battery Symposium in Japan. The lab claims these new batteries can be charged 10 times faster than normal batteries, reaching about 50% capacity in a 5 minutes for a 3,000 mAh battery.

Huawei_quick_charging_batteryTwo video demos were uploaded online both using a special charger for the battery only, and compared it to a mobile phone charge with a power adapter.

The first demo includes a depleted 600 mAh filled to 68% in just 2 minutes.

The second demo is quite similar but with a 3,000 mAh battery (620 Wh/L energy density) charged to 48% in 5 minutes.

That means you could get about half day worth of battery with a 5 minute charge. The feat can apparently be achieved by adding “heteroatoms“:

According to Huawei, the company bonded heteroatoms to the molecule of graphite in anode, which could be a catalyst for the capture and transmission of lithium through carbon bonds. Huawei stated that the heteroatoms increase the charging speed of batteries without decreasing energy density or battery life.

There are other existing quick charging technologies. For example, Qualcomm Quick Charge 3.0 can fill a battery to 65% in less than 30 minutes, so Huawei technology is several times faster, probably 3 to 5 times faster (Qualcomm did not divulge the battery capacity with their numbers).

It’s unclear if smartphones will need removable batteries for fast charging, or whether in the future, the new batteries can be charged inside the phone. Huawei did not give any clues as to when the battery might become available to consumers.

Via Liliputing and XDA Developers

Categories: Hardware, Video Tags: battery, huawei, smartphone

Huawei Kirin 950 Octa-core Processor Comes with 4 Cortex A72 Cores, 4 Cortex A53 Cores, and a Sensor Hub

November 5th, 2015 5 comments

Smartphone based on MediaTek Helio X20 (MT6797) processor with 10 cores including two Cortex A72 cores should start shipping next month, but MediaTek will soon be joined by another Asian company with a mobile SoC with Cortex A72 cores with Huawei that has recently demonstrated their Kirin 950 Octa-core processor with four Cortex A72 coers and four Cortex A53 cores, achieving over 82,000 points in Antutu 5.6 (why an older version?) on a reference board.

Huawei_Kirin_950_Antutu

For reference the top 10 Antutu scores so far in 2015, only got as high as ~77,000 points fro Meizu Pro 5.  Since the benchmark was run on a reference, it’s possible the score will drop once it’s in a tighter package.

Some key features of Kirin 950 processors:

  • CPU – 4x Cortex A72 cores @ 2.3 GHz, 4x Cortex A53 cores @ 1.8 GHz
  • GPU – ARM Mali-T880MP4 GPU @ 900 MHz
  • Co-processor – i5 sensing co-processor / sensor hub (As low as 6.5 mA)
  • Dual 14-bit Dual ISP 960/s with standalone DSP
  • 5 Mode LTE Cat6 Modem
  • Memory – LPDDR3/4
  • Peripherals – USB, HSIC, SDMMC, DMAC…
  • 4K video support
  • Process – TSMC 16nm FinFET+
Kirin_950_Block_Diagram

Kirin 950 Block Diagram

The company also mentioned that they decreased power consumption by up to 60 percent (compared to their processor using TSMC 28nm Process) thanks the 16nm FinFet+ manufacturing,  its new i5 co-processor that “consumes” 6.5 mA instead of 90 mA on the previous i3 co-processor, lower power consumption GPS (Fused Location Provider) and more.

Kirin 950 processor might be found in Huawei Mate 8 smartphone which could possibly launch on November 26

Via Liliputing, Mydrivers, Anzhuo, and Android Central

Google Officially Unveils Nexus 5X & 6P Android 6.0 Smartphones

September 30th, 2015 No comments

Google released Android 6.0 “Marshmallow” SDK and final preview last month, and the first stable Android 6.0 release is expected on the first week of October on recent Nexus devices, including the latest Nexus 5X and Nexus 6P just announced by Google.

Nexus 5X and Nexus 6P

Nexus 5X and Nexus 6P

Here are the specs of the two phones:

  • LG Nexus 5X Specifications
    • SoC – Qualcomm Snapdragon 808 (MSM8992) dual core Cortex-A57 @ 1.82 GHz  and quad core Cortex-A53 @ 1.44 GHz with Adreno 418 GPU
    • System Memory – 2GB LPDDR3
    • Storage – 16 or 32GB storage, no micro SD slot
    • Display – 5.2″ capacitive touchscreen (1920×1080 resolution), Gorilla Glass 3 with fingerprint and smudge-resistant oleophobic coating
    • Audio – Front facing speaker, 3 microphones with noise cancellation, 3.5mm audio jack
    • Connectivity – Wi-Fi 802.11 a/b/g/n/ac 2×2 MIMO, Bluetooth 4.2, GPS with A-GPS and GLONASS, NFC
    • Cellular Connectivity
      • All versions – GSM/EDGE: 850/900/1800/1900MHz; single nano SIM card
      • North America – UMTS/WCDMA: B1/2/4/5/8; CDMA: BC0/1/10; LTE (FDD): B1/2/3/4/5/7/12/13/17/20/25/26/29; LTE (TDD): B41; LTE CA DL: B2-B2, B2-B4, B2-B5, B2-B12, B2-B13, B2-B17, B2-B29, B4-B4, B4-B5, B4-B7, B4-B12, B4-B13, B4-B17, B4-B29, B41-B41
      • Hong Kong –  UMTS/WCDMA: B1/2/5/8; LTE (FDD): B1/3/7/8/26; LTE (TDD): B38/40/41
        LTE CA DL: B1-B3, B3-B3, B3-B7, B3-B8, B41-B41
      • Rest of world –  UMTS/WCDMA: B1/2/4/5/6/8/9/19; CDMA: not supported; LTE (FDD): B1/2 /3/ 4/5/7/8/9/17/18/19/20/26/28; LTE (TDD): B38/40/41; LTE CA DL: B1-B3, B1-B5, B1-B7, B1-B8, B1-B18, B1-B19, B1-B26, B3-B3, B3-B5, B3-B7, B3-B8, B3-B19, B3-B20, B3-B28, B5-B7, B7-B7, B7-B20, B7-B28, B40-B40, B41-B41
    • Camera
      • 12.3 MP rear autofocus camera with dual flash
      • Video capture up to 4K @ 30Hz
      • Slow motion at 120 fps
      • 5 MP front-facing camera
    • USB – 1x USB type-C connector
    • Sensors – Fingerprint scanner, accelerometer, gyroscope, barometer, proximity sensor, ambient light sensor, digital compass, and hall sensor
    • Battery – 2700 mAh Battery
    • Dimensions – 147 x 72.6 x 7.9 mm
    • Weight – 136 grams
  • Huawei Nexus 6P specifications:
    • SoC – Qualcomm Snapdragon 810 v2.1 (MSM8994v2) quad-core ARM Cortex A57 at up to 2 GHz and quad-core A53 with Adreno 430 GPU
    • System Memory – 3GB LPDDR4
    • Storage – 32, 64, or 128GB storage, no micro SD slot
    • Display – 5.7″ capacitive touchscreen (2560×1440 resolution), Gorilla Glass 4 with fingerprint and smudge-resistant oleophobic coating
    • Audio – Dual front facing stereo speakers, 3 microphones with noise cancellation, 3.5mm audio jack
    • Connectivity – Wi-Fi 802.11 a/b/g/n/ac 2×2 MIMO, Bluetooth 4.2, GPS with A-GPS and GLONASS, NFC
    • Cellular Connectivity
      • All versions – GSM/EDGE: 850/900/1800/1900MHz; single nano SIM card
      • North America – UMTS/WCDMA: B1/2/4/5/8; CDMA: BC0/1/10; LTE (FDD): B2/3/4/5/7/12/13/17/25/26/29/30; LTE (TDD): B41; CA DL: B2-B2, B2-B4, B2-B5, B2-B12, B2-B13, B2-B17, B2-B29, B4-B4, B4-B5, B4-B13, B4-B17, B4-B29, B41-B41
      • Hong Kong – UMTS/WCDMA: B1/2/5/8; LTE (FDD): B1/3/7/8/26; LTE (TDD): B38/40/41; LTE CA DL: B1-B3, B3-B3, B3-B7, B3-B8, B41-B41
      • Rest of world – UMTS/WCDMA: B1/2/4/5/6/8/9/19; CDMA: not supported; LTE (FDD): B1/2 /3/ 4/5/7/8/9/17/18/19/20/26/28; LTE (TDD): B38/40/41; LTE CA DL: B1-B3, B1-B5, B1-B7, B1-B8, B1-B18, B1-B19, B1-B26, B3-B3, B3-B5, B3-B7, B3-B8, B3-B19, B3-B20, B3-B28, B5-B7, B7-B7, B7-B20, B7-B28, B40-B40, B41-B41
    • Camera
      • 12.3 MP rear autofocus camera with dual flash (No optical image stabilization)
      • Video capture up to 4K @ 30Hz
      • Slow motion at 120 fps
      • 8 MP front-facing camera
    • USB – 1x USB type-C connector
    • Sensors – Fingerprint scanner, accelerometer, gyroscope, barometer, proximity sensor, ambient light sensor , digital compass, and Hall sensor.
    • Battery – 3450 mAh Battery
    • Dimensions – 159.3 x 77.8 x 7.3 mm
    • Weight – 178 grams

Both phones are clearly high-end phones with fast processors, sufficient memory for most users, and plenty of storage, but there aren’t any innovations that aren’t already found in many phones, except maybe Bluetooth 4.2 and the USB Type-C connector. The two Nexus phones also lack a micro SD slot, abd only come with a single nano SIM card. The strength of the phones are support for Android Marshmallow and the 18-month firmware update window.

Nexus 5X price starts at $379 and Nexus 6P at $499 with 32GB storage, and goes up to $649 with 128GB storage in the US.You can find more details on Nexus 5X and Nexus 6P product pages.