industrial

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ASRock Industrial NUC Ultra 100 Meteor Lake-H motherboards feature Core Ultra 5 125H and Core Ultra 7 155H processors

ASRock Industrial NUC Ultra 100 Meteor Lake-H motherboards feature Core Ultra 5 125H and Core Ultra 7 155H processors

ASRock Industrial NUC Ultra 100 Motherboard

ASRock Industrial has just announced two NUC Ultra 100 motherboards powered by Intel Core Ultra Meteor Lake-H processors namely the Core Ultra 5 125H and Ultra 7 155H with up to 16 cores and 22 threads, and integrating Intel ARC Graphics and the new Intel NPU AI engine. As the name implies, the NUC Ultra 100 Motherboard Series are designed in NUC form factor, support up to 96GB dual-channel DDR5-5600 MHz memory, three storage interface, up to four 4K displays, and offer two 2.5GbE networking ports, one USB4/Thunderbolt, and four USB 3.2 Gen 2 ports. ASRock Industrial says those features make the motherboards suitable for smart retail, kiosks, digital signage, smart cities, embedded industries, Edge AIoT applications, etc… NUC Ultra 100 motherboards specifications: Meteor Lake-H SoC (one or the other) Intel Core Ultra 7 T4 155H 16-core (6P+8E+2LPE) processor @ 1.4 / 4.8 GHz with 24MB cache, Intel 8Xe LPG […]

Posted on by Tomisin Olujinmi - No Comments on Persee N1 – A modular camera-computer based on the NVIDIA Jetson Nano

Persee N1 – A modular camera-computer based on the NVIDIA Jetson Nano

Orbbec Parsee N1 camera computer kit

The Persee N1 is a modular camera-computer kit recently launched by 3D camera manufacturer, Orbbec. Not too long ago, we covered their 3D depth and RGB USB-C camera, the Femto Bolt. The Persee N1 was designed for 3D computer vision applications and is built on the Nvidia Jetson platform. It combines the quad-core processor of the Jetson Nano with the imaging capabilities of a stereo-vision camera. The Jetson Nano’s impressive GPU makes it particularly appropriate for edge machine learning and AI projects. The company also offers the Femto Mega, an advanced and more expensive alternative that uses the same Jetson Nano SoM. The Persee N1 camera-computer also features official support for the open-source computer vision library, OpenCV. The camera is suited for indoor and semi-outdoor operation and uses a custom application-specific integrated circuit (ASIC) for enhanced depth processing. It also provides advanced features like multi-camera synchronization and IMU (inertial measurement […]

Posted on by Debashis Das - 1 Comment on Renesas’ RX23E-B MCU offers a low-drift 24-bit A/D converter with a 125 kSPS sampling rate

Renesas’ RX23E-B MCU offers a low-drift 24-bit A/D converter with a 125 kSPS sampling rate

Renesas' new RX23E-B MUC offers a low-drift 24-bit delta-sigma A/D converter with up to 125 kS/S Sampling Rate - That is eight times faster than its predecessor.

Renesas’ new RX23E-B MCU offers a low-drift 24-bit delta-sigma A/D converter with up to 125 kS/S Sampling Rate – That is eight times faster than its predecessor. This controller is clocked at 32-MHz and offers up to 256 KB Flash memory rail-to-rail programmable gain instrumentation amplifiers, ±10 V input pins, a low-drift voltage reference, and on-chip excitation current sources. This year Renesas introduced a range of new products including, the RZ/T2L Arm Cortex-R52 with an EtherCAT controller, and the RA4E2 and RA6E2 Arm Cortex-M33 MCUs for wearables and appliances. Renecus also released its first 32-bit RISC-V CPU  this year, you can check those out if interested. Features of Renesas’ RX23E-B MCU: CPU: 32 MHz 32-bit RXv2 core Includes FPU/DSP instructions Memory: 256 KB code Flash 8 KB data Flash 32 KB SRAM 24-bit Delta-Sigma ADC with PGA: High data rate: max 125 kSPS Ultra-low noise: 190 nVRMS at 977 SPS/gain=64 […]

Posted on by Debashis Das - No Comments on Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AMD Ryzen Embedded V3000 COM Express Type 7 module supports up to 64GB DDR5 memory

AMD Ryzen Embedded V3000 COM Express Type 7 module supports up to 64GB DDR5 memory

AMD Ryzen V3000 COM Express Module

ADLINK Express VR7 is a COM Express Basic size Type 7 computer-on-module powered by the eight-core AMD Ryzen Embedded V3000 processor with two 10GbE interfaces, fourteen PCIe Gen 4 lanes, and optional support for the “extreme temperature range” between -40°C and 85°C. The COM Express module supports up to 64GB dual-channel DDR5 SO-DIMM  (ECC/non-ECC) memory and targets headless embedded applications such as edge networking equipment, 5G infrastructure at the edge, video storage analytics, intelligent surveillance, industrial automation and control, and rugged edge servers. Express-VR7 specifications: SoC – AMD Embedded Ryzen V3000 (one or the other Ryzen V3C48 8-core/16-thread processor @ 3.3/3.8GHz; TDP: 45W Ryzen V3C44 4-core/8-thread processor @ 3.5/3.8GHz; TDP: 45W Ryzen V3C18I 8-core/16-thread processor 1.9/3.8GHz; TDP: 15W (useful in the extreme temperature range) Ryzen V3C16 6-core/12-thread processor 2.0/3.8GHz; TDP: 15W Ryzen V3C14 4-core/8-thread processor 2.3/3.8GHz; TDP: 15W System Memory – Up to 64GB (2x 32GB) dual-channel ECC/non-ECC DDR5 memory […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Robustel introduces EG5101 and EG5200 Debian 11 industrial IoT gateways with 4G LTE cellular connectivity

Robustel introduces EG5101 and EG5200 Debian 11 industrial IoT gateways with 4G LTE cellular connectivity

Robustel EG5101 EG5200 Debian 11 industrial gateways

Robustel introduced the EG5101 and EG5200 industrial IoT gateways running Debian 11 a few weeks ago, both with 4G LTE cellular connectivity, but the NXP i.MX 6ULL-based EG5101 has a more compact design, while the NXP i.MX 8M Plus-powered EG5200 provides more I/Os and resources. Expanding the earlier EG5100, EG5120, and LG5100 models from the company, the two edge computing gateways target Industry 4.0 and smart infrastructure applications and enable real-time analytics at the edge with lower latency than running workloads in the cloud. Robustel EG5101 and EG5200 SoC/Memory/Storage EG5101 NXP i.MX 6ULL Cortex-A7 32-bit processor @ 792 MHz 512MB to 1024MB DDR3 8GB eMMC flash EG5200 NXP i.MX 8M Plus quad-core Cortex-A53 64-bit processor @ 1.6 GHz with 2.3 TOPS NPU 4GB DDR4 32GB eMMC flash, microSD card socket Connectivity EG5101 1x 10/100 Mbps Ethernet port 4G LTE with 1x SMA-K antenna connector, 2x Mini SIM (2FF) EG5200 5x […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Cincoze P2202 Alder Lake-P embedded computer powers industrial panel PCs

Cincoze P2202 Alder Lake-P embedded computer powers industrial panel PCs

Alder Lake-P industrial Panel PCs

Cincoze P2202 is an Intel Alder Lake-P embedded computer based on the Core i3-1215UE or Core i5-1245UE processor and designed for industrial, sunlight readable, or open-frame panel PCs from the company with sizes ranging from 12.1-inch to 24-inch. The P2202 supports up to 64GB DDR5 memory and two 2.5-inch SATA drives, and the system also offers four display interfaces including the company’s CDS (Convertible Display System) interface, two gigabit Ethernet ports, optional WiFi and 4G LTE/5G connectivity, multiple USB ports, four serial RS232/RS422/RS485 ports, digital I/Os, and various M.2, mPCIe, and PCIe sockets and slots for expansion. Cincoze P2202 specifications: Intel Alder Lake-P U-series SoC (one or the other) Intel Core i3-1215UE hexa-core processor up to 4.40 GHz with Intel UHD Graphics; TDP: 15W Intel Core i5-1245UE deca-core processor up to 4.40 GHz with Intel Iris Xe Graphics; TDP 15W System Memory – 2x DDR5 4800MHz SO-DIMM sockets for up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on MediaTek unveils 5G RedCap solutions: M60 5G modem and T300 Arm Cortex-A35 SoC

MediaTek unveils 5G RedCap solutions: M60 5G modem and T300 Arm Cortex-A35 SoC

MediaTek M60 5G RedCap Modem

MediaTek has introduced its first 5G RedCap solutions with the M60 5G modem and the MediaTek T300 Arm Cortex-A35 SoC design to bring 5G-NR to wearables, light-weight AR devices, IoT modules, and consumer and industrial Edge AI devices. 5G RedCap (Reduced Capability), part of 3GPP Release 17, aims to keep some 5G features such as low latency, low power consumption, enhanced security, and network slicing while limiting the bandwidth (to around 85 Mbps) in order to be used in IoT devices and products that may not need the bandwidth required by smartphones and computers, but would benefit from longer battery life and a smaller footprint. MediaTek claims to be the first company to unveil 5G RedCap chips with the M60 modem and T300 SoC. MediaTek M60 key features and specifications: 3GPP Release 17 standard 5G modem R17 UE power saving R17 Coverage enhancement R17 Small data transmission LTE & NR-FR1 […]