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Posts Tagged ‘nougat’

GIGABYTE EL-30 Apollo Lake Fanless IoT Gateway Powered by Intel Pentium N4200 to Launch in Q2 2017

January 31st, 2017 No comments

GIGABYTE will soon introduce their EL-30 “Intel Apollo Lake IoT Gateway Solution” powered by a quad core Intel Pentium N4200 with 32GB storage, dual Gigabit Ethernet ports, dual HDMI ports, WiFi and Bluetooth connectivity, as well as a mini PCIe slot for 3G module or mSATA storage, and an optional Zigbee module.

GIGABYTE EL-30 specifications:

  • SoC – Intel Pentium processor N4200 with 4 cores, 4 threads @ 1.10 – 2.50 GHz with 2MB L2 cache, 18EU Intel HD Graphics 505 (6W TDP)
  • System Memory – 2x SO-DIMM slots for DDR3L 1600/1866MHz memory up to 8GB
  • Storage -32GB eMMC flash + 1x SD card slot + optional mSATA module
  • Video Output – 2x HDMI 1.4b ports up to 3840×2160@30 Hz
  • Audio – Via HDMI ports, 3.5mm audio jack (headphone + mic), Realtek ALC255 audio codec
  • Connectivity
    • 2x GbE LAN ports (Realtek RTL8111HS)
    • Pre-installed WiFi + Bluetooth module in half-size mini PCIe slot
    • 1x Zigbee module (optional)
  • USB – 4x USB 3.0 ports + 1x internal USB 2.0 header
  • Serial – 1x COM port (RJ45), 1x micro USB 5-pin RS232 full-duplex port (TxD, RxD, CTS, RTS, GND)
  • Expansion
    • 1x Full-size Mini-PCIe slot for 3G module or mSATA storage
    • 1 x Half-size Mini-PCIe slot used by pre-installed WiFi+BT module
    • 10-pin GPIO header, SPI-SMB header, RS232 header, and “80H” LPC port on motherboard
  • Misc – Power button with LED, HDD/SSD activity LED, 1x TPM header, Kensington lock slot
  • Power Supply – 19V (65W) DC / 100~240V AC
  • Dimensions – 140.8 x 107.5 x 29.5 mm
  • Weight – 560 grams
  • Temperature Range – Operating: 0°C to 40°C; storage: -20°C to 60°C

The fanless IoT gateway will run Windows 10 64-bit, Windows 10 IoT, Ubuntu 16.04 LTS, or Android N. It will ship with a quick start guide, a 19V power adapter and a US power cord.

Pricing is unknown, but we do know production is scheduled for Q2 2017. More details – including the Quick Start Guide – can be found on the product page.

Thanks to Paul for the tip.

Rockchip RK3328 Quad Core 64-bit ARM SoC is Designed for 4K HDR Android 7.1 & Linux TV Boxes

January 11th, 2017 11 comments

Beside RV1108 visual platform for applications, Rockchip also unveiled another processor at CES 2017 with RK3328 quad core Cortex A53 processor for 4K TV Box with H.265, H.264 and VP9 codecs support, HDR, HDMI 2.0, USB 3.0, Gigabit Ethernet and more.

rk3328-tv-boxRockchip RK3328 STB SoC specifications:

  • Processor – Quad core Cortex A53 @ up to 1.5 GHz
  • GPU – ARM Mali-450MP2
  • Memory I/F – DDR3/DDR3L/DDR4 with “large memory” support (4GB?)
  • Video Output – HDMI 2.0a with HDCP 2.x/1.4 up to 4K @ 60 Hz with HDR10/HLG support, CVBS output
  • Video Processor
    • 4K UHD H.264, 10-bit H.265 and VP9 video decoder
    • 1080p H.265/H.264 video encoder
  • Audio – Embedded audio DAC
  • Peripherals
    • embedded USB 3.0 interface
    • Dual Ethernet interface: RGMII (reduced gigabit media-independent interface) + Fast Ethernet PHY
    • 8 channel I2S interface supporting PDM/TDM
    • TS and smart card interface, with support for CSA 2.0
  • Security – TrustZone, Secure Video Path, Secure Boot, OTP

The new processor with support Android 7.1 and Linux, as well as OP-TEE secure OS and DRM support for Widewine L1 and Microsoft PlayReady. The TS interface will allow for tuner (DVB, ATSC…) support.

The processor is quite similar to Amlogic S905X. However the GPU is a bit weaker, which is not really that important for video applications, but not so good for games, and RK3328 also offer some extra interfaces with USB 3.0, dual Ethernet including one Gigabit Ethernet MAC, and tuner support.

The company did not provide any information about pricing or availability in their press release, and has yet to add RK3328 product page to their website.

Vapor Cooled ASUS Zenfone AR Smartphone Comes with 8GB RAM, Supports Google DayDream and Tango

January 5th, 2017 1 comment

ASUS Zenfore AR is an interesting beast, powered by a Qualcomm Snapdragon 821 processor, it’s the first processor I’ve heard to come with 8GB RAM, and also the first to support both Google DayDream virtual reality, and Google Tango 3D depth sensing camera. On top of that, it’s allegedly cooled by an “advanced vapor cooling system”.
asus-zenfone-ar

Zenfone AR (ZS571KL) specifications:

  • SoC – Qualcomm Snapdragon 821 quad core processor up to 2.35 GHz with Adreno 530 GPU
  • System Memory – 6 to 8 GB LPDDR4 RAM
  • Storage – 32, 64, 128 or 256GB UFS 2.0 flash, micro SD/SDCX card slot up to 2TB, 5GB ASUS WebStorage for file, 100GB Google drive for 2 years
  • Display – 5.7″ WQHD (2560×1440) AMOLED display with Gorilla Glass 4, 10-finger capacitive touch
  • Camera
    • Tricam system with 23MP autofocus, motion tracking, and depth sensing cameras (Tango)
    • 8MP front-facing camera with autofocus dual LED flash
  • Video – 4K video recording
  • Audio – Built-in mono speaker, 3.5mm audio jack
  • Cellular Connectivity – Dual SIM card for 2G, 3G, and 4G networks; up to 600Mbps download speed (LTE cat12); up to 75 upload speed (LTE cat13)
  • Connectivity – 802.11 a/b/g/n/ac 2×2 MIMO, Bluetooth 4.2 + A2DP + EDR, GPS/A-GPS/GLONASS/BDS, NFC
  • USB – 1x USB type C port
  • Sensors – Accelerator/E-Compass/Gyroscope/Proximity sensor/Hall sensor/Ambient light sensor/RGB sensor/IR sensor (Laser Focus)/Fingerprint/Barometer
  • Battery – 3,300 mAh (non-removable) with fast charging through PowerDelivery 2.0 and Quick Charge 3.0
  • Power Supply – 9V/2A (18W) power adapter
  • Dimensions – 158.67 x 77.7 x 4.6 to 8.95 mm
  • Weight – 170 grams

The smartphone will run Android 7.0 Nougat with ZenUI 3.0, and ships with a headset and the power adapter.

Zefone AR is expected to be released in Q2 2017, with pricing yet to be announced. You’ll find more details and photos on ZenFone AR product page.

Tiny Intrinsyc Open-Q 820 SoM Features Snapdragon 820 Processor, WiFi and Bluetooth

January 3rd, 2017 2 comments

Intrinsyc has unveiled a new smaller version of their Snapdragon 820 based Open-Q 820 system-on-module, simply called Open-Q 820 µSOM bringing the module size from 82 x 42mm to 50 x 25mm, while keeping many of the features of the large SoM with 3GB LPDDR4, 32GB UFS 2.0 flash, 802.11ac WiFi, and Bluetooth 4.1. It competes with other small Snapdragon 820 modules such as Inforce 6601 micro SoM.

qualcomm-snapdragon-820-somOpen-Q 820 µSOM specifications:

  • SoC – Qualcomm Snapdragon 820 quad core Kryo cores with 2x cores @ up to 2.2GHz, and 2x cores @ up to 1.6GHz, Adreno 530 GPU,  Hexagon 680 DSP
  • System Memory – 3 GB LPDDR4 @ 1866 MHz
  • Storage – 32 GB UFS 2.0 1-lane gear3 flash
  • Connectivity – 802.11 b/g/n/ac 2×2 MU-MIMO, Bluetooth 4.1, Qualcomm IZat Gen 8C GPS
  • 3x board-to-board connectors with the following interfaces:
    • Display
      • 2x MIPI-DSI 4-lane, 60fps, up to 2560×1600 (single port), 4096×2160 (dual port)
      • 1x HDMI 2.0 up to 4096×2160, 60fps
    • Audio – 3x I2S, 1x PCM, 6x Analog in, 6x Analog out, 3x Digital mic
    • Camera – 3x MIPI-CSI  4-lane, dual ISP, up to 28MP
    • USB – USB 3.0 client or host, 1x USB 2.0 host
    • 2x PCIe v2.1
    • 8x BLSP 4-pin port configurable as I2C, SPI, UART or GPIO
    • 1x SDIO
  • Power Supply – 3.6V to 4.2V
  • Dimension – 50 x 25mm
  • Temperature Range – -10°C to +70°C

The company provide Android 7.x Nougat support for the module, as well as Open-Q µ820 Development Kit with the module and a baseboard to get started.

open-q-%c2%b5820-development-kitThe baseboard exposes two USB 3.0 ports, one HDMI 2.0 port, a display connector, a mini PCIe slot+ SIM card slot, a PCIe 1x slot, three camera connectors, audio in and out headers, digital I/O expansion headers, a micro SD card and more.

Intrinsyc Open-Q 820 µSOM will sell for $239, Open-Q µ820 Development Kit for $579, and become available late February 2017. You’ll more more details on the company’s Open-Q 820 µSOM and Open-Q 820 µSOM Development Kit product pages.

Via HackerBoards

Himedia Q5 Pro & Q10 Pro TV Boxes Get Android 7.0 Nougat Firmware

November 24th, 2016 10 comments

The majority of TV boxes sold today are running Android 4.4 to Android 6.0, but with the release of Android 7.0 for smartphones and tablets earlier this year, it was just a question of time before the OS got ported to TV boxes. Himedia appears to be the first company to have released Android 7.0 for their Hisilicon Hi3798CV200 based TV boxes, namely Q5 Pro and Q10 Pro.

tv-box-android-7-0The changelog for the new firmware includes:

  1. Android N OS running stable and smooth
  2. Support for Android N Google Play version
  3. Support for Samba UPnP
  4. System function perfectly upgraded from 5.1 to Android N with compatibility
  5. Youtube updated to 4.10.7 and Netflix to 1.3.11
  6. Homepage, Application Management, Media Center optimized, focus movement are more swift and smooth
  7. Media Player upgraded and support mouse operation
  8. Local Media Playback Improved; Certain rare videos black screen, display ratio of 3D to 2D abnormal, and occasional subtitle defect issues fixed
  9. Blu-ray video slow loading conditions improved and speed up
  10. Local Audio output improved and certain audio tracks unable to decode and output issue fixed
  11. Revised some UI language
  12. Support for Widevine L3

I assume most users are running Android 5.1.1 right now, but for those who are using an Android N beta version, a different firmware file is required

The update procedure is basically the same as most others Android TV boxes on the market:

  • Download a new firmware and copy the file update.zip) to the root directory of a USB drive.
  • Plug the USB drive into the TV box
  • Go to Settings→System→System upgrade to select/click the letter of the USB drive.
  • The TV box will then begin upgrading the firmware from the USB drive.
  • Wait for the TV box to complete the upgrade. Please be patient, as it may take around 5 minutes to complete.
  • The TV box will then automatically reboot, and boot to Android N Final

Just bear in mind that changing Android version often leads to some new bugs, even though the company claims “perfect compatibility” and that everything is running “stable and smooth”.

If you are interested in either devices Himedia Q5 Pro is sold for $199.99, and Q10 Pro for $299.99 on sites such as GeekBuying, Aliexpress, and W2comp.

Via AndroidPC.es

Huawei Unveils Mate 9 HiSilicon Kirin 960 Smartphone with 5.9″ display, 4GB RAM, 64GB Storage

November 4th, 2016 10 comments

Hisilicon Kirin 960 is one of the most powerful ARM mobile processor to date with four ARM Cortex A73 cores up to 2.4 GHz, four low power Cortex A53 cores, and a Mali G71MP8 GPU. It was expected in Huawei Mate 9 smartphone, but we did not have that many details, and now the company has made it official.

huawei-mate-9Huawei Mate 9 specifications:

  • SoC – HUAWEI/HiSilicon Kirin 960 octa-core processor with 4 Cortex A73 cores @ up to 2.4 GHz A73, four Cortex A53 cores at up to 1.8 GHz, a Mali-G71 MP8 GPU, and i6 co-processor/sensor hub
  • System Memory – 4GB RAM
  • Storage – 64GB UFS 2.0 flash + micro SD card slot up to 256 GB
  • Display – 5.9″ FHD (1920 x 1080) display, 373ppi, 16.7M colors
  • Audio – 4x microphones, stereo? speakers, 3.5mm headphone jack!
  • Cellular connectivity
    • MHA-L29 model: dual SIM support (one share with micro SD slot)
      • SIM1: 4G TDD and FDD LTE, 3G UMTS/HSPA+/DC-HSDPA, 3G TD-SCDMA, CDMA EV-DO Rev.A (China Telecom only), 2G GSM
      • SIM2: 3G UMTS (Band 1/2/4/5/6/8/19), CDMA: BC0 (800MHz) only for China Telecom, 2G GSM: 850/900/1800/1900MHz
    • MHA-L09 model: single SIM support with 4G TDD & FDD LTE, 3G UMTS/HSPA+/DC-HSDPA, 3G TD-SCDMA, 2G GSM
  • Wireless connectivity – 802.11a/b/g/n/ac WiFi, Bluetooth 4.2 LE, GPS/Glonass/Galileo/BDS, NFC
  • Camera
    • 20 MP monochrome + 12 MP RGB rear camera, F2.2, OIS (Optical image stabilization), BSI CMOS, Dual-tone flash, PDAF+CAF+Laser+Depth auto focus,2x Hybrid zoom, 4K H.265 / H.264 video recording
    • 8MP front-facing camera with autofocus, F1.9
  • USB – 1x USB type C (high speed) port
  • Sensors – Fingerprint Sensor, G-Sensor, Gyroscope sensor, Compass, Ambient Light Sensor, Proximity sensor, Hall sensor, Barometer, IR
  • Battery – 4,000 mAh good for about two days typical usage, 20 hours video playback, 105 hours music playback, 30 hours of 3G voice calls and 20 hours of 4G browser; About 1 day charge is possible in 20 minutes thanks to 5A charging current.
  • Dimensions – 156.9 x 78.9 x 7.9 mm (All metal body)
  • Weight – 190 grams

The phone will run Android 7.0 with EMUI 5.0 skin, and ship with a audio headset, a  charger, a USB-C cable, a USB-C to Micro USB adapter, an eject tool, a Quick Start Guide, and a Matte case. Beside faster processor, memory and storage, and a larger display, the phone comes with dual rear cameras for better photos, as well as large battery to longer use between charges.

The phone is expected to sell for 699 Euros inc. VAT in Europe by the end of the year, as well as in other locales but pricing and availability have not been disclosed so far. If you are financially well-off, you could also consider the Porsche edition with more memory (6GB), more storage (128 GB), a smaller 5.5″ display, and a 1395 Euros price tag.

UP Squared Apollo Lake Development Board Comes with Up to 8GB RAM, 128 GB Storage for 89 Euros and Up (Crowdfunding)

November 1st, 2016 4 comments

AAEON Introduced a Intel Atom X5 based Raspberry Pi-like development board named “UP Board” last year that sold for as low as 89 Euros via a Kickstarter campaign. The company is now back with the first Apollo Lake development board for makers I’ve seen so far, powered by either a dual core Celeron N3350 or a quad core Pentium N4200 processor, featuring an Altera MAX 10 FPGA, and called UP2 (“UP Squared”).

apollo-lake-development-board

There are six variants of UP Squared board sharing most of the same technical specifications:

  • SoC
    • Intel Celeron N3350 dual core “Apollo Lake” processor @ 1.1 GHz / 2.4 GHz with 12 EU Intel HD graphics 500 @ 200 MHz / 650 MHz (6W TDP)
    • Intel Pentium N4200 quad core “Apollo Lake” processor @ 1.1 GHz / 2.5 GHz with 18 EU Intel HD graphics 505 @ 200 MHz / 750 MHz (6W TDP)
  • FPGA – Altera Max 10 FPGA
  • System Memory –  2, 4 or 8 GB LPDDR4 SDRAM
  • Storage – 16, 32, 64 or 128 GB eMMC flash, 1x SATA 3 port + SATA power
  • Video Output – 2x HDMI 1.4b; eDP connector; 3 independent displays support
  • Audio I/O – HDMI
  • Connectivity – Dual Gigabit Ethernet ports,
  • USB – 3x USB 3.0 ports, 1x USB 3.0 OTG port, header with 2x USB 2.0 ports
  • Camera – 1x 4-lane MIPI CSI connector
  • Expansion
    • 40-pin GP (general purpose) Raspberry Pi compatible header with GPIOs, I2C, SPI, ADC … signals controlled by the Apollo Lake processor (according to the block diagram below)
    • 60-pin EXHAT connector with GPIO, I2C, UART, USB 3.0… signals controlled by Altera FPGA and the Intel processor based on the block diagram.
    • M.2 2230/E-key slot
    • mini PCIe x1 slot
    • Header with 2x HSUART
  • Debugging – JTAG header for FPGA
  • Misc – Power button, 4x LEDs, RTC header, fan power header, reset and power pin headers
  • Power Supply – 5V DC via power barrel
  • Dimensions – 85.6 x 90 mm
  • Temperature Range – Operating: 0 to 60 C
  • Certifications – FCC, CE, RoHS

up-squared-boardThe six available boards have only differences in terms of processor, RAM, and storage:

  • UP2 Celeron (89 Euros) – 2 GB LPDDR4, 16 GB eMMC flash
  • UP2 Celeron Plus (105 Euros) – 2 GB LPDDR4, 32 GB eMMC flash
  • UP2 Celeron Ultra (125 Euros) – 4 GB LPDDR4, 32 GB eMMC flash
  • UP2 Pentium (169 Euros) – 4 GB LPDDR4, 32 GB eMMC flash
  • UP2 Pentium Plus (199 Euros) – 8 GB LPDDR4, 64 GB eMMC flash
  • UP2 Pentium Ultra (229 Euros) – 8 GB LPDDR4, 128 GB eMMC flash

up2-block-diagramThe board will support Windows 10, Windows IoT Core, Linux (Ubuntu, Ubilinux Debian, Yocto Project), and Android. UP2 board should also leverage UP board eco-system with support for Intel RealSense for robotics project, LoRa connectivity for IoT gateways, EnOceon solutions for home automation, and TPLink for WiFi, and many more.

UP and UP2 Boards Comparison

UP and UP2 Boards Comparison

UP Squared is larger than UP board, but as seen from the table above offers many more features, and more performance for about the same price.

The project has now launched on Kickstarter, where the company has also surpassed their 10,000 Euros funding target, with pledges currently totaling a little over 22,000 Euros. Most rewards starting with UP Squared Celeron at 89 Euros come with the board only, but you may consider pledge for kits that include the power supply, HDMI cable, SATA cable, USB 2.0 pin header cable, and WiFi 802.11ac and BT 4.2 M.2 module (Starter/Innovator Package). Most rewards are expected to ship on April 2017, excepted Innovator packages with Beta boards reaching backers in February 2017. Shipping is not included, but is only 13 to 16 Euros for Europeans, and between 28 and 46 Euros (Brazil) for the rest of the world. More details include the 40-pin header pinout can be found in UP Squared product page.

Via HackerBoards

Intel Introduces 3 Atom E3900 Apollo Lake Processors for IoT, Industrials and Automotive Applications: x5-E3930, x5-E3940, x7-E3950

October 26th, 2016 4 comments

intel-atom-e3900Intel previously introduced Celeron and Pentium Apollo Lake processors for laptops and mini PCs, and it seemed Atom was gone for good from that processor family, but the vendor has now introduced Atom E3900 “Apollo Lake” processor family for IoT, industrial and automotive applications with three models: x5-E3930, x5-E3940, and x7-E3950.

All three new processors will support up to 8 GB of LPDDR4/DDR3L memory, come in a FCBGA1296 package, be manufactured using 14 nm process, support 4K UHD video output up to 60 Hz on three independent displays, up to 15 simultaneous 1080p30 video stream, as well as 13MP cameras for photos and 1080p60 video capture. Peripherals interfaces include SATA 3.0,  PCIe lane, HDMI, DisplayPort, embedded DisplayPort, USB 3.0 & 2.0 ports and more.

The new processors also integrate Intel Time Coordinated Computing (TCC) Technology that “coordinates and synchronizes peripherals and networks of connected devices, achieving improved determinism. It can resolve latency issues in applications, such as robotics manufacturing, by synchronizing the clocks of devices across networks to within 1 μs”. The technology will be available through Linux built with the Yocto Project.

Click to Enlarge

Intel Atom E3900 Processor Series Reference Platform Block Diagram – Click to Enlarge

Reliability is achieved via ECC memory, high-temperature rating between -40°C to 110°C, and some upcoming A3900 SKUs will be qualified for automotive applications. Atom 3900 series also include some security features through Intel Trusted Execution Engine 3.0 (TXE 3.0), secure or measured boot, DRM with HDCP 1.4 wired / HDCP 2.2 wireless, protected audio video path (PAVP), and Intel Platform Trust Technology to store keys and perform crypto operatings compliant with TPM 2.0 specifications.

The three Atom E3900 SKUs most differ by their number of cores, clock speed, max TDP, and GPU.

CPU Cores Base Frequency Burst Frequency L2 Cache Size Graphics Execution
Units (EU)
TDP
Intel Atom x5-E3930 2 1.3 GHz 1.8 GHz 2 MB 12 EU 6.5W
Intel Atom x5-E3940 4 1.6 GHz 1.8 GHz 2 MB 12 EU 6.5W
Intel Atom x7-E3950 4 1.6 GHz 2.0 GHz 2 MB 18 EU 12W

Operating systems supported will include Microsoft Windows 10 Enterprise (64-bit) and IoT Core (32-/64-bit), Linux through Wind River 8 (64-bit) and a Yocto Project BSP (64-bit), Android 7.0 Nougat 64-bit (Q2 2017 target release), and Wind River VxWorks 7 real-time operating systems.

intel-apollo-lake-iot

The processors will be used in industrial settings for predictive maintenance, accelerated time to market and increased quality and remote management,  digital security and surveillance (DSS) / vision systems (video) for visual data identification and analysis, safety and security, traffic management and monitoring, agriculture and pipeline monitoring, manufacturing inspection…, as well as for transportation and automotive applications for software-defined cockpits and vehicle-to-vehicle communication.

You’ll find more details on Intel Apollo Lake products’ page.