Qualcomm has unveiled two new octacore 64-bit ARM processors for mid-range smartphones with Snapdragon 430 and Snapdragon 617 Cortex A53 SoCs, both of which support the recently announced Quick Charge 3.0 standard and embed LTE connectivity.
Snapdragon 430 key features and specifications:
CPU – 8x ARM Cortex A53 up to 1.2 GHz
GPU – Qualcomm Adreno 505 GPU supporting up to OpenGL ES 3.1+
Wireless Connectivity – WiFi 802.11n/ac (Qualcomm VIVE 2-stream with MU-MIMO), Bluetooth 4.1 + BLE, GPS (Qualcomm IZat Gen8C)
Display – Up to 1080p on device and output
Video – Up to 1080p at 60 FPS; Codecs: H.264 (AVC), H.265 (HEVC)
Audio – Fluence HD noise cancellation technology
Camera – Up to 21 MP camera; Dual Image Signal Processor (ISP)
USB – USB 2.0 support
Charging – Qualcomm Quick Charge 3.0
Security – Qualcomm Haven security suite: Snapdragon StudioAccess Content Protection, SecureMSM hardware and software foundation & Qualcomm SafeSwitch technology
Process Technology – 28 nm
You may find further information on Snapdragon 617 product page. There’s little information about Adreno 505 GPU used in Snapdragon 430, so it’s unclear how it will perform against Adreno 405 GPU used in the new Snapdragon 617 and existing Snapdragon 615 processor.
Smartphones based on Snapdragon 430 should start selling in Q2 2016, while devices featuring Snapdragon 617 are expected to be in commercial devices before the end of 2015.
Qualcomm has recently announced the latest version of its Quick Charge technology that allows to charge supported smartphones much faster than typical smartphones using a 5V charger. The company claims that Quick Charge 3.0 enabled smartphones can typicallly charge from zero to 80 percent in about 35 minutes compared to almost 90 minutes with conventional devices.
Quick Charge 3.0 adds support for Intelligent Negotiation for Optimum Voltage (INOV), a new algorithm developed by Qualcomm Technologies that allows mobile devices to request optimal power transfer (3.6V to 20V in 200mV increments), while maximizing efficiency, which – together with other improvements – increases power efficient by 38% compared to Quick Charge 2.0, and allows charging the device twice as fast as possible with Quick Charge 1.0. That means the voltage and amperage will change during charging between 3.6V to 20V by 200mV increments, instead of 5V, 9V, 12V, and 20V for QC 2.0. Tronsmart reports that when using their Quick Charge 3.0 adapter on a supported phone, the charge starts at 9V/2A, and then the voltage will slowly decrease to 5V until the battery is fully charged. The current will also vary from 2A to 3A during charge.
WC1T Quick Charge 3.0 Adapter by Tronsmart (Under Development)
Quick Charge 3.0 will be supported in Snapdragon 820, 620, 618, 617 and 430, but it is an optional feature, so even if your phone features one of these processors, it may or may not come with Quick Charge 3.0. So far about 40 mobile devices and 100 accessories support Quick Charge 2.0, and QC 3.0 should be found in devices next year.
Inforce 6410Plus SBC is the successor of Inforce 6410 board, also based on Qualcomm Snapdragon 600 processor (APQ8064), but compared to the first version of the board, it adds GPS/Glonass, some MIPI CSI and DSI interface,and a few others changes. The normal price is $143, but it is currently selling for $98 for a limited period.
I’ve reproduced the specifications below as a reminder:
Dual MIPI-DSI (4 lane) – Primary : up to QWXGA (2048 × 1536), 60 Hz refresh rate; Secondary: up to QHD (960 × 540), 60 Hz refresh rate
HD Audio and compact combo jack for headphone and mic-in
USB – 2x USB 2.0, 1x micro USB OTG
1x I2C, 1x SPI, 1x UART, UIM, 12x GPIO
On-board 34-pin expansion header to connect to Peripheral Abstraction Core (PAC) mezzanine adapter card
Debugging – via serial console on 3-pin header
Power – 12V/1.5A power supply
Dimensions – 10cm x 7cm x 1.6 cm (Pico-ITX)
Temperature Range – Operating: 0 to 70 C | Storage: -20 to 80 C
Relative Humidity – 5 to 95% non-condensing
The board can run Android 4.4 or Ubuntu Linaro, and support various software packages such as Vuforia, FastCV, Alljoyn, etc… Documentation including datasheets, user’s manuals, application notes and reference manuals can also be accessed, but only once you’ve got your board and can register an account with its serial number.
So how to you get the board for $98? Follow these simple steps:
Choose your operating system: Android or Linaro Ubuntu
Select “Without the starter kit” option if you don’t need the 12V power supply, micro USB cable and acrylic base. Adding this option will cost $6 extra, [Update: Despite the coupon apparently working with the $6 kit, the company informed the offer is only valid without the kit]
Click “Add to cart”
In the Discount codes section, type 6410Plus98 and click “Apply Coupon” to get a $45 discount.
Qualcomm has provided more details about Snapdragon 820 processor featuring custom-designed 64-bit ARM Kryo cores, an Adreno 530 GPU and an Hexagan 680 DSP, with claims that it should be twice as fast and consume half the power of Snapdragon 810 processor with Cortex A57 and A53 cores. Based on the chart below, it will also be faster than Snapdragon 620 with Cortex A72 and A53 cores.
Snapdragon 820 will feature four Kryo cores (succeeding Krait cores) clocked at up to 2.2 GHz and be manufactured using 14nm FinFET process technology. Adreno 530 GPU is expected to deliver over 40% performance improvement over Adreno 430 GPU while also keeping power consumption 40% lower, a new Spectra camera dual ISP will support 14-bit sensors, and Hexagon 680 DSP adds a separate low power DSP for always-on sensor processing, and support for HVX (Hexagon Vector eXtensions) to be used for advanced imaging and computer vision. This will for example greatly accelerate low light image processing and drastically reduce power consumption for such task since it can be handled by the DSP instead of the CPU.
Low Light Shot (Left) Processed by Hexagon 680 DSP (Right)
Qualcomm also introduced the Symphony System Manager that will make sure the CPU, GPU, DSP or ISP work together as best as possible in order to further improve performance and efficiency.
Snapdragon 820 should be found in devices in H1 2016, and not only in mobile devices, as the company expects the new processor to be used in automotive and embedded applications.
So judging by how little happened this week, it wouldn’t have been a mistake to release 4.2 last week after all, but hey, there’s certainly a few fixes here, and it’s not like delaying 4.2 for a week should have caused any problems either.
So here it is, and the merge window for 4.3 is now open. I already have a few pending early pull requests, but as usual I’ll start processing them tomorrow and give the release some time to actually sit.
The shortlog from rc8 is tiny, and appended. The patch is pretty tiny too.
Go get it,
Some notable changes made to Linux 4.2 include:
New features for F2FS including per file encryption
CIFS support SMB 3.1.1 (experimental)
Cryptography – Jitter Entropy Random Number Generator, Chacha20 stream cipher and Poly1305 authentication (RFC7539),New RSA implementation. See lwn.net for details.
AMD GPU driver added support for AMD “Tonga,” “Iceland,” and “Carrizo” systems. That driver has now over 400,000 lines of code…
“Flower” packet classifier allows to “classify packets based on a configurable combination of packet keys and masks.”
Added SPMI PMIC Arbiter device tree node for MSM8916
Added 8×16 chipset SPMI PMIC’s nodes
Added MSM8916 restart device node
Added initial set of PMIC and SoC pins for APQ8016 SBC board
Fix exynos3250 MIPI DSI display and MIPI CSIS-2 camera sensor
Bring back cpufreq for exynos4210
New processors: Hisilicon ARM64 SoCs (e.g. Hi6220)
Various fixes for ARM64 for ACPI, MMU, SMP, perf, and more.
Enabled EDAC on ARM64
Support for Hikey board, ARM Juno r1 board
Various changes to some Atmel and Marvell processors, see Free Electrons blog post for details.
Other new ARM SoCs & hardware platforms – Freescale i.MX 7Dual, ZTE ZX29670, Buffalo WXR-1900DHP, ASUS RT-AC87U, SmartRG SR400ac, Compulab CM-A510, and more
There has also been some interesting changes for the MIPS architecture:
many bug fixes: LLVM build issue, KVM fixes, fix seccomp MIPS64, fix for oprofile (get_c0_perfcount_int), Fix JR emulation for R6, etc…
Some code cleanups (fixed misspellings, removes some code)
Added support for appended DTP
Improvements for R12000, R3000, Broadcom BCM47xx and BCM63xx, ATH79
Large patchset for Ingenic JZ4740 SoC
Added support to Pistachio SoC
New MIPS platforms: MIPS Creator CI20 board and XWR-1750 board
A complete changelog for Linux 4.2 should soon be published on Kernelnewbies.org, and you’ll probably also want to look at their ARM architecture and drivers sections for more details about to various platforms including ARM and MIPS. I’ve also generated a complete Linux 4.2 Changelog with comments only (13.9MB) using git (git log v4.1..v4.2 --stat)
Linaro 15.07 has been released with Linux 4.2-rc3 (Baseline), Linux 3.10.83, 3.14.45 and 3.18.17 (LSK), and Android 5.1.1_r8.
The Linux kernel got various bug fixes, and a power reduction technique has been implemented for Qualcomm processor. Progress has been made to boot Android with UEFI on Hikey board, and work is still on-going on 96boards including Hisilicon Hikey, Qualcomm DragonBoard 410c, and an upcoming and yet-to-be-formally-announced Marvell PXA1928 board called Helium.
Highlights of this release:
Linux Linaro 4.2-rc3-2015.07
linaro-android topic updated to 4.2-rc3 and recent AOSP/android-3.18
included GATOR version 5.21.1
llct-misc-fixes topic: “HACK: of: Limit FDT size for CRC check on arm64” has been dropped. FVP model was the last target to require this hack, but the new FVP firmware doesn’t need it anymore
updated integration-linaro-vexpress64 topic by ARM LT: Versatile Express TC2 support is back, HDLCD display now works on TC2, the topic will be renamed to integration-linaro-vexpress next cycle
updated integration-linux-qcomlt topic by Qualcomm LT: QCOM Core Power Reduction (CPR) support has been added
linaro-builddeb-tweaks topic is dropped (most of our changes have been upstreamed)
Linaro builds of AOSP 15.07
Android baseline updated to 5.1.1_r8
ART CI setup for TIP and stable builds
Boot to gui tests added for tip and stable builds
ART code coverage for tip and stable builds
m-preview based builds setup for emulators
ART-host-gtests added for tip and stable builds
Hikey builds updated to 5.1.1_r8. Android boots with UEFI and GRUB on HiKey. Wifi drivers are integrated in the build system. Drivers are built as part of Android build process.
Linaro OpenEmbedded 2015.07
integrated Linaro GCC 4.9-2015.06
updated linux-linaro to 4.2-rc3
disabled aarch64 bootwrapper
integrated various improvements for LNG CI
fixed bootimg.bbclass to work with all kernel image types
DragonBoard 410c is now using NetworkManager only to manage the network (previously a combination with systemd-networkd/resolved has been used).
HiKey made some progress toward the switch to UEFI. GRUB is now integrated into the snapshots builds for both AOSP and Debian.
Initial Debian based build for Marvell PXA1928 Helium is setup and available.
Visit https://wiki.linaro.org/Cycles/1507/Release for a list of known issues, and further release details about the LEB, LMB (Linaro Member Builds), and community builds, as well as Android, Kernel, Graphics, Multimedia, Landing Team, Platform, Power management and Toolchain components.
Linaro announced the 96Boards initiative at Linaro Connect Hong Kong last month, and in collarabation with Huawei announced Hikey development board following this new standard. Qualcomm has now joined the Fray with Dragonboard 410c, a 96Boards board powered by Qualcomm Snapdragon 410 quad core Cortex A53 processor.
Dragonboard 410c (Click to Enlarge)
Dragonboard 410c specifications:
SoC- Qualcomm Snapdragon 410 (APQ8016) quad-core ARM CortexA53 @ 1.2 GHz with Adreno 306 GPU @ 400MHz
System Memory – LPDDR2/3 533MHz, Single-channel 32-bit (4.2GBps)
Analog expansion connector – Headset, Speaker, FM antenna
Arduino compatibility through mezzanine board
Power Supply – 6.5 – 18V DC input
The board will support Linux and Android, and target embedded computing and Internet of Everything (IoE) products, such as robotics, cameras, medical devices, vending machines, smart buildings, digital signage, casino gaming consoles, etc…
That’s about all we know for now, except it will be launched in summer 2015. You can register your interest on Qualcomm’s DragonBoard 410c page.
Qualcomm has announced four new processors including Snapdragon 415 and 425 octa-core Cortex A53 processor, as well a Snapdragon 618 and 620 big.LITTLE processor with the latest Cortex A72 cores coupled with four Cortex A53 little cores.
Snapdragon 618 is the hexa-core version with 2 Cortex A72 cores, while Snapdragon 620 comes with eight cores including 4 Cortex A72, but apart from the difference in number of cores, both share the same technical specifications:
Snapdragon 618 – 64-bit dual-core ARM Cortex A72 @ 1.8GHz and quad-core Cortex A53 @ 1.2GHz
Snapdragon 620 – 64-bit quad-core ARM Cortex A72 @ 1.8GHz and quad-core Cortex A53 @ 1.2GHz
GPU – Next generation Qualcomm Adreno GPU with support for the latest graphics APIs, hardware tessellation and geometry shading
DSP – Qualcomm Hexagon V56 DSP
Memory – Dual channel LPDDR3 (933MHz)
Integrated X8 LTE, with Global Mode supporting LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO, TD-SCDMA and GSM/EDGE
Cat 7 speeds of up to 300 Mbps down/100 Mbps up via 2×20 MHz carrier aggregation in the downlink and uplink on LTE FDD and LTE TDD
Support for LTE Broadcast, LTE multimode dual SIM and VoLTE with HD Voice and SRVCC
RF – Qualcomm RF360 front end solution
USB – USB 2.0
Bluetooth – Bluetooth Smart 4.1
WiFi – Qualcomm VIVE 1-stream 802.11ac
GPS – Qualcomm IZat Gen8C
4K@30fps capture, 1080p@120fps capture
Hardware HEVC (H.265) encode and decode
Qualcomm Immersive Audio
Hi-Fi 192kHz/24bit music playback
Support for low power Snapdragon Voice Activation
Camera – Dual ISPs can support up to 21MP and 930MP/sec throughput
Primary Quad HD 2560×1600
Miracast support for up to 1080p wireless display
Fast Charging – Quick Charge 2.0
Snapdragon StudioAccess Content Protection
Qualcomm SafeSwitch Technology
Qualcomm SecureMSM hardware and software foundation
Qualcomm will soon release Qualcomm Reference Design (QRD) versions of the Snapdragon 620, 618, 425 and 415 processors to OEM partners, with retail devices expected in H2 2015. You may find more details on Snapdragon 618 product page, and Snapdragon 620 product brief (PDF).