Remi Pi is a compact, low-cost SBC powered by a Renesas RZ/G2L Cortex-A55/M33 SoC

Remi Pi SBC

MYiR Tech Remi Pi is a low-cost SBC based on the company’s MYC-YG2LX CPU module featuring a Renesas RZ/G2L Arm Cortex-A55/M33 processor, 1GB RAM,  8GB eMMC flash, and plenty of ports and interfaces. Those include two gigabit Ethernet ports, a wireless module with dual-band WiFi 4 and Bluetooth 4.2 connectivity, HDMI and LVDS display interfaces, MIPI CSI camera input, a 3.5mm audio jack, a few USB ports, and a 40-pin GPIO header compatible with the one on the popular Raspberry Pi SBCs. Remi Pi specifications: System-on-Module – MYiR MYC-YG2L23 module with SoC – Renesas RZ/G2L processor (R9A07G044L23GBG) CPU 1.2 GHz dual-core Arm Cortex-A55 processor 200 MHz Arm Cortex-M33 real-time core GPU – Arm Mali-G31 3D GPU VPU – H.264 decoding/encoding System Memory – 1GB DDR4 Storage – 8GB eMMC flash, 32KB EEPROM PMIC – Renesas RAA215300 power management IC Storage – MicroSD card slot Display interfaces HDMI video output LVDS […]

Kaki Pi is a Raspberry Pi-inspired Renesas RZ/V2H AI SBC with four camera connectors, a PCIe 3.0 interface

Kaki Pi Renesas RZ/V2H SBC Raspberry Pi flavor

Japanese company Yuridenki-Shokai Co. Ltd will soon launch the Kaki Pi single board computer based on the just-announced Renesas RZ/V2H Arm microprocessor with a powerful 80 TOPS AI accelerator, with Raspberry Pi-inspired form factor and features such as the 40-pin GPIO header, the same PCIe 3.0 connector as found in the Raspberry Pi 5, and four 22-pin MIPI CSI connectors that look to be compatible with the Raspberry Pi cameras. The board also comes with up to 8GB LPDDR4,  a microSD card for the OS, a 22-pin MIPI DSI connector for a display, a gigabit Ethernet port, two USB 3.0 ports, two CAN Bus connectors, and other interfaces that make it suitable for robotics applications such as Autonomous Mobile Robots (AMR) and HSR (Human Support Robots) as well as IoT projects. Kaki Pi specifications: SoC – Renesas RZ/V2H CPU/MCU cores Quad-core Arm Cortex-A55 processor up to 1.8 GHz Dual-core Arm […]

ADLINK MXA-200 5G IIoT gateway ships with Debian or Yocto Linux

ADLINK MXA-200 5G industrial gateway

ADLINK MXA-200 is an NXP i.MX8M Plus-based 5G IIoT gateway running Debian or a Yocto-based Linux distribution with two RS-232/422/485 isolated serial ports, two gigabit Ethernet ports, two USB 3.0 port, and an operating temperature range of -20 to 70°C. The fanless gateway also features two M.2 slots for integrating Wi-Fi and/or 4G LTE or 5G modules, and ADLINK expected the MXA-200 to find its way into renewable energy applications, EV chargers, smart city and smart factory applications that require big data collection, cloud-based applications, and video related monitoring solutions. ADLINK MXA-200 specifications: SoC – NXP i.MX8M Plus CPU – Quad-core Arm Cortex-A53 processor @ 1.6/1.8GHz MCU – Arm Cortex-M7 real-time core @ 400 MHz GPU – Vivante GC520L 2D GPU, Vivante GC7000UL 3D GPU VPU – 1080p60 hardware decoder (HEVC, H.264, VP9, and VP8) and encode (H.265/H.264) AI accelerator – 2.3 TOPS NPU System Memory – 2GB or 4GB […]

Embedded Open Source Summit 2024 schedule – Embedded Linux, Zephyr OS, and Real-time Linux

Embedded Open Source Summit 2024

The Embedded Open Source Summit 2024 (EOSS 2024) will take place on April 16-18 and the Linux Foundation has already announced the schedule with conference sessions, lightning talks, and birds of a feather (BoF) sessions covering embedded Linux, Zephyr OS, and real-time (RT) Linux. While I won’t be attending in person, I still find it interesting to check out the schedule as we may learn more about the current status of embedded Linux. So I’ve created my own little virtual schedule out of the available talks. Tuesday, April 16 – Day 1, Embedded Open Source Summit 2024 9:05 – 9:45 – No, It’s (Still) Never Too Late to Upstream Your Legacy Linux-Based Platforms by Neil Armstrong, Linaro Nearly 7 years ago, Neil already spoke about this subject in Berlin, and it’s still very true. Do you maintain or used to maintain a Linux-based board or SoC off-tree? Then there are […]

Rockchip RK3568-powered ASUS Tinker Board 3N is now available in three variants

ASUS Tinker Board 3N

The ASUS Tinker board 3 was first unveiled in April 2023 before being renamed as Tinker Board 3N later that year, and the three variants of the Rockchip RK3568 single board computer (SBC) are now available. The standard configuration is the Tinker Board 3N in the commercial temperature range, while the Tinker Board 3N Plus has the same features, except it can operate in the industrial temperature range (-40°C to 85°C). The Tinker Board 3N Lite is a cost-down version in the same form factor, but with a single gigabit Ethernet port without PoE support, no M.2 B-key socket for an NVMe SSD or 4G/5G cellular connectivity, no 16MB SPI flash, fewer serial interfaces, and no CAN Bus. You’ll find a comparison of the specifications for the three variants in the table below. Note the prices above are from Amazon with a 10% discount when applicable. ASUS provides support for […]

Avnet MSC C10M-ALN – A COM Express Type 10 Mini Module with Intel Alder Lake-N CPU, LPDDR5 memory

MSC C10M ALN COM Express Type 10 Module

Avnet MSC C10M-ALN is a COM Express Type 10 module powered by the Alder Lake-N family of processors including the Intel Core i3, Intel Atom x7000E, and Intel Processor N-Series. The design allows for easy adaptation of applications between various Intel CPU models, ensuring compatibility across different performance and power needs. The module supports up to 16GB LPDDR5 memory with optional In-Band Error Correcting Code(IBECC), eMMC 5.1 storage, and features an Intel i226 2.5GbE controller. It can handle up to two 4K displays through DDI and eDP video outputs, ten USB ports including USB 3.2 Gen 2, and four PCI Express Gen 3 x1 slots for expanded connectivity options. Avnet MSC C10M-ALN Com Express Module Specification: Alder Lake-N SoC (one or the other) Intel Core i3-N305, eight-core, 1.0GHz/1.8GHz, 32EU Intel UHD Graphics, 9/15W, PUC (PC Client Use Conditions) Intel Atom x7425E, four-core, 1.5GHz, 24EU Intel UHD Graphics, TCC, 12W, EUC […]

PANZER-PLUS fanless AIoT computer to support Ubuntu 24.04, Android 14, Yocto 5.0

PANZER-PLUS fanless AIoT gateway

Taiwan-based MayQueen Technologies has recently introduced the PANZER-PLUS fanless AIoT computer powered by an NXP i.MX 8M Plus Arm SoC with support for Ubuntu 22.04, Android 12/13, and Yocto 4.0 “Kirkstone”, but the company also claims it is working on Ubuntu 24.04 and Android 14 operating systems, as well as Yocto 5.0 “Scarthgap”. The company initially pinged us in 2018 about its NXP iMX6UL-powered PANZER fanless box PC and contacted us again last week with the new PANZER-PLUS model equipped with an NXP i.MX 8M Plus AI processor, which I found only mildly interesting until the company informed me about (planned) software support. So let’s have a closer look. PANZER-PLUS specifications: SoC – NXP i.MX8M Plus CPU – Quad-core Arm Cortex-A53 processor @ 1.8GHz MCU – Arm Cortex-M7 real-time core @ 400 MHz GPU – Vivante GC520L 2D GPU, Vivante GC7000UL 3D GPU VPU – 1080p60 hardware decoder (HEVC, H.264, […]

Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

EDATEC Raspberry Pi 5 fanless case