CNX Software - Embedded Systems News

April 25, 2024April 25, 2024 by Debashis Das - No Comments

Raspberry Pi CM4S module gets 2GB, 4GB, and 8GB RAM variants for commercial products

Raspberry Pi Compute Module 4S with 2GB, 4GB, and 8GB variants

Raspberry Pi has announced three new versions of its Compute Module 4S (CM4S) offering 2GB, 4GB, and 8GB RAM options which is an upgrade from the 1GB variant introduced in 2022. These new modules feature the same Broadcom BCM2711 quad-core Cortex-A72 SoC used in Raspberry Pi 4 and Raspberry Pi CM4 and have a starting price of only $25. The main downside is that the modules can only be purchased in bulk (200-unit boxes) through Raspberry Pi Approved Resellers. Raspberry Pi Compute Module 4S (CM4S) specifications: SoC – Broadcom BCM2711 CPU – Quad-core 64-bit Cortex-A72 processor @ 1.5 GHz GPU – VideoCore VI GPU 3D Graphics: OpenGL ES 3.0 and Vulkan 1.1 Video H.265 (HEVC) (up to 4Kp60 decode) H.264 (up to 1080p60 decode, 1080p30 encode) Memory – 1GB, 2GB, 4GB, and 8GB LPDDR4-3200 SDRAM with ECC Storage – 8GB, 16GB, or 32GB eMMC flash; Option for 0GB eMMC Flash […]

April 25, 2024April 25, 2024 by Debashis Das - No Comments

Quectel BG95-S5 5G NTN + LTE IoT module can seamlessly connect across satellite and cellular networks

Quectel BG95 S5 NTN satellite communication module

The Quectel BG95-S5 is a “multi-mode” 5G NTN satellite + LTE IoT communication module designed for seamless connectivity in remote areas. It supports 3GPP Release 17 IoT-NTN (S and L band frequencies) and offers fallback options with LTE Cat M1, Cat NB2, eGPRS, and integrated GNSS. These features make the module suitable for asset management, wireless POS, heavy industry, and wearables applications. In January this year, Quectel announced their CC660D-LS IoT NTN module in partnership with Skylo which focuses solely on NTN connectivity, whereas the “multi-mode” BG95-S5 seamlessly switches between different connectivity technologies (NTN, LTE Cat M1, Cat NB2, eGPRS). Quectel BG95-S5 IoT-NTN satellite module specifications: Module Type – NTN satellite communication module Compliance – Supports 3GPP Rel-17 IoT-NTN/ LTE Cat M1/ Cat NB2/ EGPRS module with Ultra-low power consumption Frequency Bands IoT-NTN S-Band – B23/ B256 L- Band – B255 (Under development/ planning) LTE-FDD Cat M1 – B1/ 2/ […]

April 25, 2024April 25, 2024 by Tomisin Olujinmi - No Comments

Ronetix launches NXP i.MX93 SoMs in SMARC and OSM-L form factors

Austrian embedded equipment manufacturer, Ronetix, has released two i.MX93 system-on-modules (SoMs): the RNX-iMX93-OSM that follows the Open Standard Module (OSM) form factor, and the RNX-iMX93-SMARC compliant with the SMARC 2.1 (smart mobility architecture) standard. Ronetix i.MX93 SoMs are powered by the NXP i.MX93 processor featuring a 64-bit dual-core Arm Cortex-A55 application processor running at 1.7GHz and a Cortex-M33 core running at 250MHz for low-latency and real-time tasks. The SoC supports up to 2GB LPDDR4 RAM and 512GB eMMC storage, and the integrated Arm Ethos-U65 microNPU offers up to 0.5 TOPS of computing power for machine vision applications and intelligent energy management (IEM). Applicable for industrial automation and IoT, the SoMs also feature two CAN and Ethernet interfaces to aid high-speed data transfer. Other hardware featuring the i.MX93 that we have covered recently include the ADLINK OSM-IMX93, MaaXBoard OSM93, and Ka-Ro Electronics’ QS93. The RNX-iMX93-SMARC system-on-module comes in 82 x 50mm […]

April 25, 2024April 25, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

IBASE ISR500 fanless Edge AI computer and digital signage player features MediaTek Genio 510 or 700 SoC

IBASE Technology ISR500 is a fanless digital signage player and Edge AI computer powered by either a MediaTek Genio 510 hexa-core Cortex-A78/A55 processor or Genio 720 octa-core Cortex-A78/A55 SoC with a real-time AI performance up to 3.2 TOPS. The system ships with 4GB RAM and 64GB eMMC flash, features two HDMI video outputs, a gigabit Ethernet port, a few USB ports, a 3.5mm audio jack, a COM port, and an M.2 socket for wireless expansion. IBASE ISR500 specifications: SoC (one or the other) MediaTek Genio 700 (MT8390) Octa-core CPU – Dual-core Cortex-A78 @ 2.2GHz with 256KB L2 cache, hexa-core Cortex-A55 @ 2.0GHz with 128KB L2 cache, shared 2MB L3 cache GPU – Arm Mali-G57 MC3 with support for OpenGL ES 1.1/2.0/3.2, Vulkan 1.0/1.1, OpenCL 2.2 AI accelerator – Tensilica VP6 MediaTek APU 3.0 up to 3.2 TOPS VPU Video Encode – 4Kp30 H.265/H.264 Video Decode – 4Kp75, AV1, VP9, H.265/H.264 […]

April 24, 2024April 24, 2024 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

ASRock SBC-262M-WT 3.5-inch motherboard features up to Intel Atom X7433RE Amston Lake processor

ASRock Industrial SBC-262M-WT is a 3.5-inch SBC motherboard powered by the latest Intel Atom x7433RE quad-core Amston Lake embedded processor with support for up to 48GB DDR5-4800 memory, triple 4K display outputs, two Ethernet ports, including one with 2.5Gbps Ethernet and Intel TSN/TCC. The motherboard also takes SATA 3.0 and M.2 Key M NVMe storage, offers multiple USB interfaces, supports WiFi and/or 4G LTE or 5G cellular connectivity via M.2 modules and SIM card socket, and provides industrial features such as a wide -40 to 85°C operating temperature range and a wide 9V to 36V DC voltage input range that make it suitable for smart retail, smart cities, and embedded industrial environments. ASRock Industrial SBC-262M-WT 3.5-inch motherboard specifications: SoC – Intel Amston Lake Processors up to Atom X7433RE quad-core processor clocked up to 3.4GHz with Intel UHD Graphics; 9W TDP System Memory – Up to 48GB single-channel DDR5 4800 MHz […]

April 24, 2024April 24, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

STMicro LSM6DSV32X Edge AI motion sensor aims to extend battery life in wearables, trackers, and activity monitors

STMicro LSM6DSV32X is a new low-power 6-axis inertial module with the company’s machine-learning core (MLC) with AI algorithms based on decision trees, a 3-axis accelerometer with a full-scale range of 32g, and a 4000 degrees-per-second gyroscope designed to measure intensive movements, impacts, and freefall height (estimation). The features of the sensors enable it to lower the power consumption for functions such as gym-activity recognition to under 6µA, while 3D orientation tracking consumes just 30µA when using STMicro’s Sensor Fusion Low-Power (SFLP) algorithm. It will be found in a range of battery-powered devices such as consumer wearables, asset trackers, and impact and fall alarms for workers or the elderly. STMicro LSM6DSV32X specifications: Triple-channel architecture for UI (user interface), EIS, and OIS data processing Data storage – Smart FIFO up to 4.5 KB Sensors Accelerometer – ±4/±8/±16/±32 g full scale Gyroscope – ±125/±250/±500/±1000/±2000/±4000 dps full scale Embedded temperature sensor Host interfaces SPI, […]

April 24, 2024April 23, 2024 by Dennis Mwihia - No Comments

Ambarella CV75S AI SoC brings Vision Language Models (VLM) and Vision Transformer Networks to cameras

Ambarella has been expanding its AI SoC portfolio, and the latest addition is the CV75S family of 5nm chips. The company claims this family introduces the most cost- and power-efficient SoC option for running the latest AI-based image processing like vision language models (VLMs) and vision transformer networks in security, robotics, conferencing, and sports cameras. The CV75S family is the first in Ambarella’s lineup to integrate the latest CVflow 3.0 AI engine, which results in 3 times the performance compared to the former generation. CVflow 3.0 is a chip architecture designed based on a deep understanding of the core computer vision algorithms. It features a dedicated vision-processing engine that Ambarella has programmed using a high-level algorithm description and works with Tensorflow, Caffe, and PyTorch. This engine enables the SoC to perform trillions of operations each second at a fraction of the power consumption of leading GPUs and general-purpose CPU solutions. These chips also […]

April 24, 2024April 24, 2024 by Debashis Das - 1 Comment

BIGTREETECH Pi 2 SBC and CB2 module for 3D printers now feature Rockchip RK3566 SoC with Gigabit Ethernet

BIGTREETECH Pi 2 and the BIGTREETECH CB2 Compute Modules

BIGTREETECH recently announced the release of the BIGTREETECH Pi 2 SBC and BIGTREETECH CB2 SoM, both powered by the Rockchip RK3566 SoC. These new modules are direct upgrades from the BIGTREETECH Pi v1.2 and BIGTREETECH CB1, which we covered and reviewed in our previous posts. Specially designed for 3D printers, these new modules have a similar form factor to that of a Raspberry Pi and the RPI CM4 module, and come with a set of upgraded features including support for GbE Ethernet, dual-band WiFi, up to 32GB of LPDDR4 RAM, eMMC storage, HDMI, USB, and more. BIGTREETECH Pi 2 Specifications SoC – Rockchip RK3566 CPU – Quad-core Arm Cortex-A55 processor @ 1.8 GHz GPU – Arm Mali G52-2EE GPU with support for OpenGL ES 1.1/2.0/3.2, Vulkan 1.1, OpenCL 2.0 NPU – 0.8 TOPS AI accelerator VPU – 4Kp60 H.265/H.264/VP9 video decoding, 1080p100f H.265/H.264 video encoding System Memory – 2GB LPDDR4 (Customizable – 1GB/2GB/4GB/8GB) […]