Samsung has just issued a press release announcing the Korean company had just started mass-production of the first SoC for Wearables using 14-nm FinFET process with their Exynos 7 Dual (7270) dual Cortex A53 processor. Exynos 7270 is also said to be the first such SoC to embed full connectivity and LTE modem integration.
- CPU – Dual-core ARM Cortex–A53 processor @ up to 1.0 GHz
- GPU – ARM Mali-T720
- Memory – LPDDR3 support
- Storage – eMMC 5.0, SD card interfaces
- Display – Up to 960×540 (qHD) resolution
- Camera – Up to 5MP pixel sensor support
- Multimedia – HD ([email protected]) video with HEVC, H.264, VP8 Codec
- LTE Modem – LTE Category 4 non-CA
- Connectivity – WiFi, Bluetooth 4.2, FM Radio
- GNSS – GPS, GLONASS, BeiDou
- PMIC – Integrated in SiP-ePoP package
- Package – SiP-ePoP, 10x10mm (SiP: System-in-Package; ePoP: embedded Package-on-Package)
The SoC will be packaged inside a SiP-ePOP package with DRAM, eMMC, and a power management IC, which will allow for a much smaller board, and more space for the battery for example, which combined with the more power efficient 14-nm FinFET process should allow for longer battery life for wearables.
Samsung can also provide a reference platform with display, NFC, audio codec, diverse sensors and a sensor hub to help companies getting started with their product design.
More information can be found on Exynos 7 Dual product page.