Theobroma Announces Rockchip RK3368 and RK3399 Qseven System-on-Modules

Theobroma Systems, an embedded system company based in Austria, has designed several Allwinner systems-on-module compliant with μQseven & Qseven standards in the past. The company has now started to work with Rockchip and reached “an advanced design stage” for the development of μQseven and QSeven systems-on-module powered by RK3368 and RK3399 processors.

rockchip-rk3399

RK3368-uQ7 module specifications:

  • SoC – Rockchip RK3368 octa-Core ARM Cortex-A53 processor up to 1.2GHz with Imagination Technologies PowerVR G6110 GPU
  • System Memory – up to 4GB DDR3-1600 SDRAM on-module (512MB, 1GB, 2GB (default) and 4GB configuration available)
  • Storage – Up to 128GB eMMC flash on-module (8GB default), 16 Mbit to 128 Mbit SPI NOR flash on-module
  • Video Capabilities –  H.264 decoding up to 2160p30, H.265 decoding up to 2160p60, video encoding up to 1080p30
  • Connectivity – GbE PHY on-module
  • CAN – On-module communication offload controller for CAN
  • 230-pin MXM edge connector with:
    • 10/100/1000 Mbps Ethernet
    • USB – 1x USB 2.0 dual-role port, 3x USB 2.0 host port
    • Display – HDMI 2.0 up to 4K (60fps), LVDS (single-channel), MIPI-DSI, Embedded DisplayPort (eDP) up to 4 lanes (2.7Gb/s each)
    • Camera – MIPI-CSI, each with 4 lanes (up to 1Gb/s per lane)
    • Additional Interfaces – UART, 8x GPIO, I2S, I2C, SMBus, SPI, FAN, CAN
  • Security Module – Global Platform 2.2.1 compliant JavaCard environment, on-module EAL4-certified smartcard controller
  • Power Supply – 5V supply
  • Power Consumption – < 9W
  • Dimensions – 70 x 40mm (μQseven 2.1 form factor)
  • Temperature Range – Commercial: 0°C to 60°C; Industrial: -20°C to 85°C
Click to Enlarge
Theobroma “Hainan” carrier board for Q7 and μQ7 modules – Click to Enlarge

RK3399-Q7 module specifications:

  • SoC – Rockchip RK3399 hexa-Core processor with 2x Cortex-A72 up to 2.0 GHz (48KB+32KB L1 cache and 1024KB L2 cache), 4x Cortex-A53 (32KB+32KB L1 cache and 512KB L2 cache), and an ARM Mali-T864MP4 GPU
  • System Memory – up to 4GB DDR3-1600 SDRAM on-module (512MB, 1GB, 2GB (default) and 4GB configuration available)
  • Storage – Up to 128GB eMMC flash on-module (8GB default), 16 Mbit to 128 Mbit SPI NOR flash on-module
  • Video Capabilities –  Decoding up to 2160p60, encoding up to 1080p30
  • Connectivity – GbE PHY on-module
  • CAN – On-module communication offload controller for CAN
  • 230-pin MXM edge connector with:
    • 10/100/1000 Mbps Ethernet
    • USB – 1x USB 3.0 superspeed dual-role port, 2x USB 3.0 superspeed host ports, 1x USB 2.0 host port
    • Display – HDMI 2.0 up to 4K (60 Hz), 2x MIPI-DSI up to 250×1600 @ 60 Hz, Embedded DisplayPort (eDP) up to 4 lanes (2.7Gb/s each)
    • Camera – 2x MIPI CSI, each with 4 lanes (up to 1.5 Gb/s per lane)
    • 4-lane PCIe 2.1
    • Additional Interfaces – UART, 8x GPIO, I2S, I2C, SMBus, SPI, FAN, CAN
  • Security Module – Global Platform 2.2.1 compliant JavaCard environment, on-module EAL4-certified smartcard controller (optional)
  • Power Supply – 5V supply
  • Power Consumption – < 15W
  • Dimensions – 70 x 70 mm (Qseven form factor)
  • Temperature Range – Commercial: 0°C to 60°C; Industrial: -20°C to 85°C

Both modules support Linux and Android 6.0 operating systems, and the company can provide Hainan development kit with a carrier board to get started with development.

RK3399-Q7 SOM will ship to early-access customers in Q1 2017, I could not find availability information for RK3368 module. You’ll find some more details in the announcement, and RK3399-Q7 product page.

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3 Replies to “Theobroma Announces Rockchip RK3368 and RK3399 Qseven System-on-Modules”

  1. Interesting to know what the idle & typical power consumption of the RK3399 version actually measures.

    15Watts seems rather excessive for a 7x7cm board, and I imagine would require a noisy fan ?

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