BCM ESM-HRPL COM-HPC Client Size C module supports up to 24-core Intel Core i9-14900K CPU

The BCM ESM-HRPL is an industrial-grade COM-HPC Client Size C module based on Intel Core 12th to 14th Gen processors, supporting up to the 24-core Intel Core i9-14900K Raptor Lake SoC via an LGA1700 socket. It features PCIe Gen5, Intel Deep Learning Boost, and AI Boost for AI inference, delivering up to 8.2 TOPS of AI processing power.

The module follows the PICMG COM-HPC Client Type specification and supports up to 128GB DDR5 memory via four 262-pin SO-DIMM sockets and optional ECC support depending on the CPU. Interfaces include 2x SATA III ports, dual 2.5GbE, USB 3.2 Gen2x2, eDP, and triple DDI display interfaces (for a total of 4 independent displays). Designed for long-term support, this board targets applications such as AI inference, medical imaging, smart energy, and automation.

BCM ESM-HRPL specifications:

• Processor Support – Compatible with 12th/13th/14th Gen. Intel Core i9/i7/i5/i3/Pentium/Celeron “Alder Lake-S” or “Raptor Lake-S” processor via LGA1700 socket; up to 65W TDP
• System Memory – Up to 128GB 3600–4000 MT/s DDR5 memory via 4x 262-pin SO-DIMM sockets, optional ECC support (CPU-dependent)
• Networking – 2x Intel I226-V 2.5GbE controllers, 1x FTX710‑BM2 10 GbE Ethernet controller
• 2x 400-pin connectors compliant with COM-HPC specifications:
  • Storage – 2x SATA III
  • Video
    • 3x DDI (DP 1.4a / HDMI 2.1b configurable)
    • 1x eDP 1.4b
    • Supports 4 independent displays
  • Audio – HD Audio interface
  • Networking – 2x 2.5GbE, 1x 10GbE
  • USB
    • 4x USB 3.2 Gen2x2
    • 8x USB 2.0
  • Serial – 2x UART
  • Low-speed I/O – 12x GPIO
  • PCIe
    • 1x PCIe Gen5 x16 (bifurcates to 2x PCIe Gen5 x8)
    • 1x PEG x4
    • 2x PCIe x4
    • 9x PCIe Gen3 x1
    • 1x PCIe Gen3 x1 (for BMC via carrier board)
  • 1x I2C, 1x SMBus, 1x GSPI, 1x IPMB, 1x SPI
• Security – TPM 2.0 (optional)
• Misc
  • Watchdog Timer
  • System temperature, voltage, and fan status monitoring
  • AMI UEFI BIOS with 256Mbit SPI Flash ROM
  • Intel Mobile Voltage Positioning 9.1(IMVP9.1)
  • EC IT5782 Embedded I/O  Controller for GPIO, UART, and fan header
• Power – Not mentioned, but should be standard 12V ATX power from the carrier board
• Dimensions – 160 x 120 mm (COM-HPC Client Size C)
• Temperature
  • Operating – 0°C to 60°C with CPU cooler and 0.5m/s airflow
  • Storage – -20°C to 75°C
• Humidity: 95% RH @ 40°C, non-condensing

While writing the specification, I noticed that the block diagram shows an FTX710-BM2 10GbE Ethernet controller and mentions 10GbE LAN support, but the specifications section from BCM does not clearly detail this.

At the time of writing, the company mentions that the module only supports Windows 11 LTSC and Linux, so it should be compatible with Intel drivers, kernel modules, and standard BIOS tools for power management, system monitoring, and others.

BCM also provides the EEV-HC10 COM-HPC carrier board, which comes in an EATX form factor (330 x 305mm). It complies with COM-HPC Rev. 1.2 standards and supports size A/B/C client modules, including the ESM-HRPL.

Key features include support for PCIe Gen5 x16, eight PCIe x4, and one PCIe x1 slots for expansion, multiple IET module interfaces that give access to HDMI/DP, USB3.2 Gen2x2 (Type-C), and high-speed LAN (up to 25GbE). There are also 12-bit GPIOs, UARTs, and low-speed IOs, and onboard eDP support via JST connector.

The company did not provide any pricing information for the module. More information can be found on the product page and the press release.

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