MeLE Cyber X1 is an Intel Processor N100 fanless mini PC relying on a plastic heatsink made of many spikes for cooling instead of a more traditional metal enclosure with fins.
Other features include 16GB LPDDR5 memory, an M.2 2280 NVMe or SATA socket fitted with a 512GB NVMe SSD, support for three 4K monitors through HDMI and USB-C ports, an audio jack, Gigabit Ethernet and WiFi 5, and four USB ports for expansion.
MeLE Cyber X1 “F5V” specifications:
- SoC – Intel Processor N150
- Quad-core “Twin Lake” processor @ up to 3.6 GHz (Turbo) with 6MB cache
- GPU – 24EU Intel UHD graphics @ 1000 MHz
- TDP: 6W; The X1 mini PC appears to be configured with PL1 = 10W for higher performance. (Note that the default PL1 power limit varies a lot from 6W to 20W on Intel N100/N150 mini PCs)
- Memory – 16GB LPDDR5 @ 4800 MHz (soldered on mainboard)
- Storage
- 512GB NVMe SSD up to 3,940 MB/s
- M.2 2280 slot for NVMe or SATA SSD (used by the preinstalled 512GB SSD)
- MicroSD card slot, oddly covered by the heatsink just above the audio jack
- Video Output
- 2x HDMI 2.0 ports up to 4K @ 60 Hz
- DisplayPort via USB-C up to 4K @ 60 Hz
- 3x independent displays supported
- Audio
- 3.5mm audio jack
- Digital audio via HDMI
- Networking
- Gigabit Ethernet RJ45 port
- Dual-band WiFi 5 (802.11ac) and Bluetooth 5.1
- USB
- USB 3.2 Gen2 (10 Gbps) Type-A port
- USB 3.2 Gen1 (5 Gbps) Type-A port
- USB 2.0 Type-A port
- USB 3.2 Gen 2 (10 Gbps) Type-C port with DisplayPort Alt Mode and USB PD 3.0
- Security – Built-in TPM header compatible with ASUS TPM encryption module
- Misc
- Power button with LED
- Kensington lock slot
- Reset (CMOS/BIOS) pinhole
- BIOS with auto power on, WoL
- Power Supply – 12V/5A via USB-C port
- Dimensions – 131 x 81 x 24mm
- Weight – 288 grams
MeLE does not mention anything about the operating system, but the photos of the package imply it comes preloaded with Windows (11). The mini PC also ships with a 12V/2A power adapter, a VESA mount, and a user manual.
I was not 100% sure the heatsink was made of plastic when I first looked at it, since it’s rather unusual. However, MeLE makes that 100% clear, promoting the Cyber X1 as a lightweight 288-gram mini PC with 90 to 100 grams of plastic per unit and supporting “low-carbon actions” (whatever that means).
MeLE further explains that the top cover/heatsink is made of a “high thermal conductivity engineering plastic” with a design increasing the cooling surface by 6.4 times, and allowing the fanless mini PC to run faster with PL1 set to 10 Watts.
So a plastic heatsink is lighter, potentially leading to cheaper shipping, and it appears to work quite well based on the company’s claims. However, MeLE notes that the surface temperature may reach up to 55°C to 70°C, which is really hot, but apparently “meets the safety standards of the International Electrotechnical IEC62368-1:2018”. For reference, the Intel N150-based Zimaboard 2 with a metal case could reach up to 76°C during our tests.
The MeLE Cyber X1 can be purchased for $229.99 on Amazon, but it’s not listed on the company’s AliExpress store just yet.
Via AndroidPC.es
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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Hope no one ever needs to clean dust out of that…
[ kind of weird, but a case fan could provide help with no dust settling on the surfaces? (yes, but some noise and motion, if acceptable?) (thx) ]
I would want to know more about the science of such a cooling method before believing the marketing.
the science or art could best be described as the wizardry of the gimmick?
Thermal Conductivity Comparison
MeLE did not mention exactly which material was used, but I can see plastic materials can reach around 20 W/m·K, e.g., Makrolon TC, Therma-Tech… Not quite as good a metals, but much better than ABS.
Your Google-fu is better than mine, I’ve found a lot of blah, but no specific materials or figures (didn’t search very long though). 20 W/m.K would indeed be pretty good for plastic, but it’s still one order of magnitude below that of aluminium.
That information is mostly from Grok. Note that I’m on holiday, and I don’t spend as much time as usual double-checking the information I provide.
Best quote I found on the topic: “Thermally conductive plastic actually means poor instead of extremely poor conductivity.”
From what I read, basically it means thermal conductivity in the units of W/m.K instead of tenths, while aluminium is in the hundreds.
They compensate that with the size of the sink and the number of fins (imagine a metal heat sink of that size and with that shape), but it still remains quite limited. While definitely no specialist of the subject, I think I would be more concerned with how heat is moved from the processor to the case than about how it gets from the case to the air, in that design.
It still only has a TDP of 6W, that’s not quite much. Some devices with no heat sinks or fans like an iPad or MacBook Air have better TDP.
The advantage though is that at the same temperature, the bad conductivity means heat is transferred slower to anything that touches it, including your skin.
“Low carbon action” is likely just a poor translation of “低碳行动“, which likely refers to the “Low Carbon Development Initiative”.
coretemp-isa-0000
Adapter: ISA adapter
Package id 0: +140.0°F (high = +221.0°F, crit = +221.0°F)
Core 0: +140.0°F (high = +221.0°F, crit = +221.0°F)
Core 1: +140.0°F (high = +221.0°F, crit = +221.0°F)
Core 2: +140.0°F (high = +221.0°F, crit = +221.0°F)
Core 3: +140.0°F (high = +221.0°F, crit = +221.0°F)
acpitz-acpi-0
Adapter: ACPI interface
temp1: +82.0°F
iwlwifi_1-virtual-0
Adapter: Virtual device
temp1: +129.2°F
nvme-pci-0200
Adapter: PCI adapter
Composite: +119.9°F (low = +22.7°F, high = +175.7°F)
(crit = +184.7°F)
Putting a block of aluminum on top of the unit lowers the temp by ~15f. Block is 6cm X 6cm X 2cm.
The highest temp recorded so far is 168f.
Thanks for the data.
For those who don’t speak Fahrenheit (like me), 168°F is about 75.6°C.