ARIES Embedded MSRZG3E is an OSM-compliant system-in-package (SiP) built around the Renesas RZ/G3E MPU, designed for HMI, industrial, medical, and edge AI applications.
The Renesas RZ/G3E SoC integrates a quad-core Arm Cortex-A55 CPU, a Cortex-M33 real-time core, and an Ethos-U55 NPU delivering up to 512 GOPS for AI power. Other features include PCIe Gen3, USB 3.2, dual Gigabit LAN, plus CAN FD, UART, I2C, SPI, and ADC. Multimedia support includes dual displays, MIPI-CSI camera input, and H.264/H.265 video codec. The SiP ships with 512 MB to 8 GB LPDDR4 RAM and 4 GB to 64 GB eMMC flash, with commercial and industrial-grade temperature support.
MSRZG3E MSRZG3E SiP specifications:
- SoC – Renesas RZ/G3E dual or quad Arm Cortex-A55, Arm Cortex-M33 core MCU
- Memory – 512 MB to 8 GB LPDDR4 RAM
- Storage
- 4 GB to 64 GB eMMC NAND flash
- 2 Mbit to 512 Mbit SPI NOR flash
- 476-pad land grid array (LGA)
- Display
- MIPI-DSI up to 1920×1200 @ 60 fps
- RGB display interface up to 1280×800 @ 60 fps
- Camera – MIPI-CSI camera interface (1/2/4 lanes)
- Networking – 2x 10/100/1000Mbps Ethernet ports
- USB
- 1x USB 3.2 host
- 2x USB 2.0 (Host/OTG)
- Expansion
- 1x PCIe Gen3 x2 (Root complex or Endpoint selectable)
- I²C, SPI
- Serial – UART, 2x CAN
- Analog – ADC
- Display
- Dimensions – 45 x 30 mm; Compliant with the SGET OSM standard Size M
- Operating Temperature
- 0°C to +70°C (commercial)
- -40°C to +85°C (industrial)
In terms of software support, the MSRZG3E runs on a Linux BSP based on the Yocto Project, offering full support for graphics, multimedia, and connectivity, while the integrated Cortex-M33 core can handle FreeRTOS, Zephyr, or bare-metal tasks for real-time control. As it’s built around the Renesas RZ/G3E MPU, it also supports Renesas e² studio, GCC toolchains, and the Yocto SDK. More information can be found on ARIES-Embedded’s GitHub repository.
The company also provides product resources, including detailed datasheets, block diagrams, and evaluation kits for rapid prototyping. On top of that, there are various documents, application notes, and other resources for the Renesas RZ/G3E Arm Cortex-A55/M33 MPU.
From the temperature specification, I have to assume that there are two variants of the module, but the company does not mention any specifics for that.
The company also provides the MSRZG3EEVK evaluation kit for the MSRZG3E OSM SiP. As part of the Open Standard Module (OSM) specification, the board supports connector-less integration, making it suitable for various space-constrained applications.
MSRZG3EEVK Evaluation Kit specifications:
- Main Module – ARIES Embedded MSRZG3E SiP (R9A09G047E57GBG CPU)
- Memory – 2GB LPDDR4 RAM
- Storage
- 8GB eMMC NAND flash
- 128Mbit SPI NOR
- Micro SD Card
- Display – FPC connector or pin header
- Networking – Gigabit Ethernet RJ45 connector
- USB
- USB Host Type-A port
- USB OTG microAB port
- Console interface via USB microAB port
- Expansion I/O (via pin headers) – UART, CAN, SPI, I2C, GPIO, JTAG on pin headers
- Operating temperature – -25°C to +70°C
The company mentions that the MSRZG3E MSRZG3E SiP and MSRZG3EEVK Evaluation Kit will be available from Q3, 2025, but I could not find any pricing details for the module and its development board. More information is available on the product page and the press release.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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To bad the MSRZG3EEVK Evaluation Kit does break out the PCIe