ADLINK OSM-IMX95 – An NXP i.MX 95 OSM Size-L system-on-module for IoT and industrial applications

ADLINK OSM-IMX95 is an OSM Size-L solder-on system-on-module powered by an NXP i.MX 95 hexa-core Arm Cortex-A55 SoC with an up to 2 TOPS eIQ Neutron NPU/AI accelerator.

It follows the OSM-IMX93 OSM Size-L module based on NXP i.MX 93 SoC, but features a more powerful SoC, up to 16GB LPDDR4L RAM, up to 256GB eMMC flash, and high-speed interfaces like USB 3.0 and PCIe Gen3. The new NXP i.MX 95 OSM module is designed for Smart Home, Smart Building, Smart City, medical, and Industry 4.0 applications.

ADLINK OSM-IMX95:

• SoC – NXP i.MX 95
  • CPU
    • Up to 6x Arm Cortex-A55 cores @ up to 1.8 GHz
    • Real-time co-processors – Arm Cortex-M7 @ 800MHz and Cortex-M33 @ 250MHz
  • 2D/3D Graphics Acceleration
    • Arm Mali-G310 3D GPU with OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0
    • 2D GPU
  • Video Encode / Decode – 4Kp30 H.265 and H.264
  • AI/ML – 2 TOPS eIQ Neutron NPU
• System Memory – 2GB, 4GB (default), 8GB, or 16GB LPDDR4L
• Storage
  • Up to 256GB eMMC flash; standard/default: 32GB or 64GB.
  • Optional SPI NOR flash on carrier via QSPI interface
• 662 contacts
  • Storage IF – 2x 4-bit SDIO compatible with SD/SDIO standard version 3.0
  • Display
    • 4-lane MIPI DSI
    • 8-lane LVDS
    • Note: HDMI supported on carrier via DSI to HDMI bridge, eDP via DSI to eDP bridge
  • Camera – 2-lane MIPI CSI RX interface (1x lane mixed with DSI)
  • Audio – 2x I2S for audio codec located on carrier board up to 192kHz
  • Networking – 2x Gigabit Ethernet interfaces, both with TSN support
  • USB – 1x USB 3.0 host, 1x USB 2.0 device/host
  • PCIe – PCIe Gen3 x1
  • Low-speed I/Os
    • 4x UART interfaces
    • 3x SPI, 3x I2C
    • 2x CAN Bus (shown on block diagram only)
    • Up to 12x or 14x GPIO with interrupt (implemented through an external MCU via I2C?)
• Power Supply – 5V DC
• Dimensions – 45 x 45mm – OSM Size-L (Large) form factor compliant with SGET OSM Specifications 1.2
• Temperature Range
  • Standard – 0 to +60°C
  • Rugged – -40 to +85°C
• Humidity
  • Operating – 5-90% RH, non-condensing
  • Storage and operating with conformal coating – 5-95% RH
• Shock and Vibration – IEC 60068-2-64 and IEC 60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
• HALT – Thermal Stress, Vibration Test, Thermal Shock, and Combined Test

AAEON provides support for Yocto Linux BSP and Android, the latter by project. Extended BSP support using Foundries.IO’s Linux microPlatform (LMP) is also possible. I was unable to find any information about a development board or evaluation kit for it at this point.

We first noticed the ADLINK OSM-IMX95 last June, when we covered the Compulab MCM-IMX95 solder-down module (not OSM compliant), and noted it was one of the first upcoming NXP i.MX 95 OSM modules. Since then, Advanctech introduced the AOM-2521 OSM Size L system-on-module, so there’s already some competition.

 

ADLINK OSM-IMX95 system-on-module is still shown as “preliminary”, but considering the company has started advertising the module (on CNX Software), it should become available very soon. Once it is launched, ADLINK will guarantee 15 years of product availability. Visit the product page for a few more details.

Support CNX Software! Donate via cryptocurrencies, become a Patron on Patreon, or purchase goods on Amazon or Aliexpress. We also use affiliate links in articles to earn commissions if you make a purchase after clicking on those links.