Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs target AI-enhanced drones, cameras, TVs and media hubs

Qualcomm has made a range of announcements at CES 2026, and notably introduced the Dragonwing Q‑7790 and Q‑8750 processors supporting on‑device AI for drones, smart cameras & industrial vision, AI TVs/media hubs, and video collaboration systems.

The mid-range Dragonwing Q-7790 targets both consumer and industrial IoT devices, and offers up to 24 TOPS of on-device AI, 4K video outputs and camera inputs, and AV1 hardware video decode. The higher-end Dragonwing Q-8750 is designed for more advanced IoT applications, delivers up to 77 TOPS (dense) for real-time inference and up to 11B LLMs, handles 8K displays and 8K cameras, and supports up to 12 physical cameras for drones, media hubs, and multi-angle vision systems.

Dragonwing Q-7790

Dragonwing Q-7790

Dragonwing Q-7790 (CQ7790M/CQ7790S) specifications:

  • CPU – Octa-core Kryo processor up to 2.8 GHz
    • 1x Gold+ core @ 2.8 GHz
    • 4x Gold cores @ 2.4 GHz
    • 3x Silver cores @ 1.8 GHz
  • GPU – Qualcomm Adreno 722 GPU up to 1.15 GHz
  • VPU
    • Video Decode – 4K120 H.264/H.265/AV1
    • Video Encode – 4K60 formats: H.264/H.265
  • Audio DSP (LPASS) – Low-power idle mode with an embedded NPU (eNPU5); always-on subsystem
  • AI Acceleration – 24 TOPS (INT8), NSP3, 8K HMX, 4x HVX
  • Memory – Up to 16 GB; 2x 16-bit LPDDR4x @ 2133 MHz, 2x 16-bit LPDDR5 @ 3200 MHz, or 2x 16-bit LPDDR5X @ 4200 MHz
  • Storage
    • UFS 3.1 gear 4/UFS 4.0 gear 5B (2-lane)
    • eMMC 5.1
    • SD 3.0
  • Display
    • 2x MIPI-DSI up to 4K60
    • USB-C DP up to 4K60
    • HDMI Tx 2.1 up to 4K60 with HDCP 2.2
  • Audio – MI2S, 8x DMIC support
  • Camera
    • 14bpp, Triple TFE (21 + 21 + 21 MP)
    • Single IFE Lite
    • 2x 4K30 2-exp sHDR
  • Wireless – 2×2 Wi-Fi 7/Bluetooth 6.0 or Wi-Fi 6E/Bluetooth 5.3 (through external/companion chips: WCN6755, WCN7750)
  • USB – USB 3.1 gen2 Type-C with DP, eUSB 2.0
  • PCIe – PCIe Gen3 x1 and PCIe Gen3 x2
  • Other I/O – MIPI I3C, GPIO, UART
  • Package dimensions – 14.0 x 14.0 x 0.89 mm
  • Temp. Range (Tj) – Up to 95°C

Software support includes OTA-ready Android 15 and Linux. You’ll notice two SKUs for the Q-7790: CQ7790M/CQ7790S, but I could not find any public details about the differences between the two. I’m sure Qualcomm will be delighted to answer after you’ve consulted with your lawyer and signed a ~100-page NDA.

Dragonwing Q-8750

DragonWing Q-8750

Dragonwing Q-8750 (CQ8750S) specifications:

  • CPU – Octa-core Oryon CPU up to 4.32 GHz (no details provided for the cluster)
  • GPU – Adreno 8-series GPU up to 1.1 GHz
  • VPU –
    • Video Decode – 4K @ 240 fps / 8K @ 60 fps for H.264, H.265, VP9, and AV1
    • Video Encode – 4K @ 120 fps / 8K @ 30 fps for H.264 and H.265
  • AI – 77 Dense TOPS; Hexagon V79 tensor processor for AI inference across vision, audio, and sensor workloads
  • Audio DSP (LPASS) – Hexagon V79 @ 4-thread DSP
  • Memory – Up to 24 GB RAM via 4x 16-bit LPDDR5X @ 4800 MHz chips
  • Storage
    • UFS 4.0 2-lane gear 5 Rate B
    • SD 3.0 4-bit for SD card
  • Display
    • Internal panel resolution up to 3840 x 2560 @ 144 Hz
    • 2x MIPI-DSI with 8x DSC v1.2
    • DP v1.4 up to 8K60
  • Audio
    • 5x SoundWire
    • 8x DMICs
    • 7x I2S 32-Channel TDM/PCM support @ 48 kHZ
    • Aqstic Audio Technologies
  • Camera
    • Qualcomm Spectra Image Signal Processor (ISP) 8-series
    • 2x Always Sensing Camera (ASC) interfaces
    • 3x 48 MP at 30 fps ZSL ISP
    • 6x 4-lane D-PHY 1.2/3-trio C-PHY 2.0 interfaces
    • Support for 5 concurrent cameras: 360° vision, video analytics, and surround capture
  • Wireless – Wi-Fi 7 and Bluetooth 6 supported with companion chips
  • USB
    • USB 3.1 Gen 2 @ 10 Gbps, supports USB Type-C with DP v1.4
    • eUSB 2.0
  • PCIe – PCIe Gen 3 x2
  • Other I/O
    • 215x GPIO
    • UART, I2C, I3C, SPI, 10x I2C hubs via QUP
    • Fifteen dedicated buses: 4x I3C/I2C, 3x SPI, 3x I2C, 2x UART, 2x I3C/I2C (for ASC), 1x I2C (for ASC) via sensors interfaces and supported sensors
  • Package – MPSP1512 PoP, 15.95 x 14.0 x 0.60 mm,
  • Temperature Range (Tj) – -30 to +105°C

Qualcomm provides support for Android 15+ and Linux Yocto.

These two new Dragonwing processors are part of the press release focusing on Qualcomm’s IE/IoT (Industrial and Embedded IoT) expansion, which also highlights the recent acquisitions of Arduino, Edge Impulse, Augentix, Focus.AI, and Foundries.io. The company also mentions the Qualcomm Insight Platform video intelligence solution, which leverages Edge AI with an LLM-based conversational engine to turn videos into a real-time, profile-aware data plane.

Qualcomm Dragonwing IOT Ecosystem

More details about the Dragonwing Q-7790 and Q-8750 AIoT processors can be found on their respective product pages.

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