Quectel SP895BD-AP AIoT module features Qualcomm Dragonwing Q-8750 SoC with 80 TOPS NPU

Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the SP895BD-AP smart AIoT module based on the Dragonwing Q-8750. It is designed for high-performance IoT applications, including video conferencing, 8K computing power boards, and smart retail terminals, running on Android 15 or Linux.

Earlier in November, we saw Qualcomm introduce the Dragonwing IQ-X series of SoCs for industrial PCs running Windows. The Q-8750 in the Quectel SP895BD-AP seems to be a variant of the high-end version, with an 8-core Oryon CPU (up to 2x 4.32 GHz + 6x 3.53 GHz) and an Adreno Series 8 GPU. It supports 8K video encoding and decoding with three ISPs for up to 3×48MP camera inputs, or a single camera input of 108MP. The module comes in a compact LGA package and supports standard interfaces like MIPI DSI/CSI, PCIe, USB, I2S, UART, I²C, and SPI.

Quectel SP895BD-AP module specifications:

• SoC – Qualcomm Dragonwing Q-8750 (CQ8750-S)
  • CPU –  Qualcomm Oryon CPU 8-core (2x Prime @ 4.32 GHz + 6x Performance @ 3.53 GHz)
  • GPU – Qualcomm Adreno 830 (Series 8) with tiled architecture
  • VPU (Adreno 8550)
    • Video Decode – 4K at 240 fps / 8K at 60 fps for H.264, H.265, VP9, and AV1
    • Video Encode – 4K at 120 fps / 8K at 30 fps for H.264 and H.265
  • DSP – Hexagon DSP with Hexagon Vector/Matrix eXtensions (HVX/HMX)
  • ISP – Triple Spectra ISP
  • AI – NPU with up to 80 TOPS of computing power
• Memory – 12GB or 24GB LPDDR5X memory options
• Storage –  256GB UFS 4.0 + SDIO 3.0 Support
• LGA with I/Os
  • Display
    • 2x 4-lane MIPI-DSI interfaces up to 5120 × 2880 at 60 fps or 2520 × 1200 at 240 fps
    • DisplayPort v1.4 over Type-C with MST (2 × 4Kp60 10-bit or 1 × 8Kp30 with DSC)
  • Camera
    • Interfaces – 4x 4-lane MIPI-CSI D-PHY, 2x 3-trio MIPI-CSI C-PHY
    • Configuration A – Up to 3x 48MP concurrent video input
    • Configuration B – Up to 108MP single camera capture
  • Audio – SWR, Digital Mic, MI2S, Hi-Fi I2S
  • USB – 1x USB 3.1/2.0 Interface
  • PCIe – 1x PCIe Gen4 (2-lane)
  • Other I/O – Up to 10x UART, 21x I2C, 10x SPI, 5x I2S, 4x ADC, GPIOs, PWRKEY (UART, I2C, I2S and SPI are multiplexed interface)
• Power – 3.55V to 4.4V (Typ. 3.8V)
• Dimensions – 39 x 33.0 x 3.85 mm LGA package
• Temperature Range – -30°C to +75°C (Extended operating temperature range)

As I was going through the specifications of the Dragonwing Q-8750 SoC and the Quectel SP895BD-AP side by side, it became clear that Quectel’s specification is less detailed overall. However, it does clarify the CPU cluster configuration of the Q-8750 SoC, which was not explicitly mentioned in the original specification. The module runs Android 15 or Linux.

Quectel claims shift to the Oryon CPU provides a 45% improvement in CPU performance and 44% better energy efficiency compared to the previous generation (likely referring to modules based on the Snapdragon 8 Gen 2 or 3). The Adreno 830 GPU also delivers a 40% boost in graphics performance, making the module suitable for “UHD (8K/3D) displays” and complex rendering tasks.

The company does not mention pricing, so you will have to contact them for a quote. For additional details, you can visit the product page or read the full press release.

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