At CES 2026, Intel unveiled the Core Ultra Series 3 processors, codenamed Panther Lake-H, built on the Intel 18A (1.8-nanometer class) process, and targeting both consumer and industrial applications. Vecow introduced one of the first industrial Panther Lake-H platforms with the TGS-2000 series, a new family of ultra-compact, stackable Edge AI computers designed for high-performance space-constrained applications and based on either the 16-core Intel Core Ultra 9 386H or 12-core Intel Core Ultra 5 336H SoC.
This new 2000 series is an upgrade of the previous TGS-1000 series, which was launched in 2024 with Intel Meteor Lake processors. While the overall design stays mostly the same, the transition to Core Ultra Series 3 enhances AI performance, reaching up to 100 TOPS combined performance with the selected SKUs (note: the top-end Panther Lake-H CPU can deliver up to 180 TOPS). The TGS-2000 Series is available in three variants, including the fanless TGS-2000, the actively cooled TGS-2000F, and the TGS-2500F, which also supports an MXM GPU card for heavier graphical workloads.
Vecow TGS-2000 Series specifications:
- SoC – Intel Core Ultra Series 3 “Panther Lake-H” processors
- Intel Core Ultra 9 386H
- 16-core CPU with 4x Performance cores up to 2.1 / 4.9 GHz, 8x Efficient cores up to 1.6 / 3.9 GHz, and 4x Low Power Efficient-cores up to 1.6 / 3.5 GHz
- Cache – 18 MB Intel Smart Cache
- GPU – 2.5 GHz 4-core Intel Arc Xe3 GPU delivering up to 40 TOPS
- AI – Intel AI Boost NPU up to 50 TOPS; CPU+GPU+NPU combined: 100 TOPS
- PBP: 25W; MTP: 80 W
- Intel Core Ultra 5 336H
- 12-core CPU with 4x Performance cores up to 1.9 / 4.6 GHz, 4x Efficient cores up to 1.5 GHz / 3.6 GHz, and 4x Low Power Efficient-cores up to 1.5 / 3.2 GHz
- Cache – 18 MB Intel Smart Cache
- GPU – 2.3 GHz 4-core Intel Arc Xe3 GPU delivering up to 37 TOPS
- AI – Intel AI Boost NPU up to 47 TOPS’ combined: TBD
- PBP: 25W; MTP: 80 W
- Intel Core Ultra 9 386H
- SIO – IT8659E chipset
- System Memory – Up to 128GB DDR5 6400MHz via 2x SO-DIMM slots
- Storage – M.2 Key-M Socket for NVMe SSD
- Display
- 2x HDMI 2.1 (up to 4096 x 2304 @ 60Hz)
- DisplayPort 1.4 via USB Type-C (up to 3840 x 2160 @ 60Hz)
- TGS-2500F only: Adds 2x DisplayPort 1.4 (up to 4096 x 2304 @ 60Hz) via MXM card
- Audio
- Realtek ALC888S-VD 7.1 Channel HD Audio
- 1x Mic-in, 1x Line-out
- Networking – 2x 2.5GbE RJ45 ports via Intel I226 controllers (one supports iAMT)
- USB
- 1x USB 3.2 Gen 2×2 Type-C (20 Gbps) port
- 2x USB 3.2 Gen 2 Type-A ports
- 2x USB 2.0 Type-A ports
- Expansion
- M.2 Key-E socket (2230) for WiFi/Bluetooth
- M.2 Key-B socket (3042/3052) with SIM slot for 4G/5G
- M.2 Key-M socket (2280, PCIe 4.0 x4) for NVMe SSD
- Stackable expansion connectors (compatible with TGS-100 series modules)
- TGS-101 – 16-bit GPIO
- TGS-102 – 16-bit Isolated DIO (8DI, 8DO)
- TGS-103 – 2x COM (RS-232/422/485)
- TGS-104 – 2x Isolated COM
- TGS-105 – 2x USB 3.0
- TGS-106 – 2x 1GbE LAN
- TGS-107 – 4G Module
- TGS-2500F only – 1x MXM graphics card slot
- Misc
- Power, HDD LEDs
- Watchdog Timer – Reset 1 to 255 sec./min. per step
- HW Monitor – Monitoring temperatures and voltages. Auto throttling control when the CPU overheats.
- BIOS – AMI
- Power Supply
- TGS-2000 / TGS-2000F – DC 12V to 24V via 3-pin terminal block
- TGS-2500F – DC 24V only
- Dimensions and Weight
- TGS-2000 (Fanless) – 117 x 120 x 64mm | 1.8 kg (3.96 lb)
- TGS-2000F (Fan-cooled) – 117 x 120 x 38mm | 0.9 kg (1.98 lb)
- TGS-2500F (MXM support) – 117 x 120 x 114mm | 2.3 kg (5.07lb)
- Temperature Range
- Operating
- TGS-2000: -25°C to 45°C (-13°F to 113°F) with air flow
- TGS-2000F / TGS-2500F: -25°C to 55°C (-13°F to 131°F)
- Storage – -40°C to 85°C (-40°F to 185°F)
- Operating
- Humidity – 5% to 95% Humidity, non-condensing
- Shock – IEC 61373: 2010
- Vibration – Rolling Stock Equipment, Shock and Vibration Tests
- EMC – CE, FCC, ICES, EN50155, EN50121-3-2
The company mentions support for Windows 11, Windows 10 (LTSC), and Linux. For AI development, the system supports Intel’s OpenVINO toolkit, allowing developers to build and optimize AI workloads for edge deployment.
The device comes with some additional accessories to support deployment and expansion, including certified DDR5 memory options (8GB, 16GB, and 32GB), a 120W power adapter with a terminal block, and multiple stackable expansion docking modules (as mentioned in the specification section). There are also accessories such as DIN-rail and VESA mounting kits, M.2 storage modules, and optional 5G, 4G/GPS, and Wi-Fi & Bluetooth modules for industrial, edge AI, and smart infrastructure applications.
Intel officially unveiled the Core Ultra Series 3 processors (codenamed “Panther Lake”) at CES 2026 just days ago. Built on the company’s advanced 18A process node, which utilizes a new hybrid architecture that pairs “Cougar Cove” Performance cores with “Darkmont” Efficient cores. The Series 3 chips also debut the Xe3 “Celestial” graphics architecture and the 5th-generation NPU (NPU 5), which work together to deliver up to 180 Platform TOPS. This shift to the 18A node is significant for embedded applications, as it promises improved performance-per-watt compared to the previous Meteor Lake and Lunar Lake generations. The full list of Core Ultra Series 3 processors can be found on Intel Ark.
At the time of writing, the company does not mention anything about pricing, and you need to contact Vecow’s sales team directly for quotes. For more details, you can visit the product pages for TGS-2000, TGS-2000F, and TGS-2500F on the Vecow website, and additional information may also be available in the press release.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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