Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

Advantech MIO-5355 is a 3.5-inch SBC based on Qualcomm QCS6490 or QCS5430 Edge AI processor. The board features up to 8GB of LPDDR5 memory, 128GB of UFS storage, and supports various operating systems, including Windows 11 IoT Enterprise, Ubuntu 24.04 LTS, and Yocto Linux.

We have seen other QCS6490-based hardware in the past, such as the Radxa Dragon Q6A, the Quectel QSM560DR SBC, or the Rubik Pi 3, most of which come in compact form factors. The Advantech MIO-5355 takes a different approach, using a standard industrial 3.5-inch form factor (146 × 102 mm) and targeting industrial deployments with support for –20°C to 70°C operation and long-term availability.

MIO 5355 Qualcomm Dragonwing QCS6490 3.5-inch SBC

Advantech MIO-5355 specifications:

  • SoC (one or the other)
    • Qualcomm DragonWing QCS6490
      • CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz
      • GPU – Adreno 643 GPU @ 812 MHz with support for Open GL ES 3.2, Open CL 2.0, Vulkan 1.x, DX FL 12
      • DSP – Hexagon DSP with dual HVX and 4K HMX
      • VPU – Adreno 633 VPU up to 4K60 decode for H.264/H.265/VP9, Up to 4K30 encode for H.264/H.265; Support for HDR10 and HDR10+ playback
      • Spectra ISP – 64 MP / 36 + 22 MP / 3×22 MP at 30fps ZSL; 192 MP non-ZSL
      • AI – 6th gen Qualcomm AI Engine that combines Compute Hexagon DSP with dual Hexagon Vector, eXtensions (HVX), Hexagon Co-processor (Hexagon CP) 2.0, and Hexagon Tensor accelerator for up to 12.3 TOPS of AI performance
    • Qualcomm DragonWing QCS5430
      • CPU – Hexa-core Kryo 670 with 2x Gold Plus cores (Cortex-A78) @ up to 2.1 GHz, 4x Silver cores (Cortex-A55) @ up to 1.8 GHz
      • GPU –Adreno 642L clocked at 812 MHz, supports OpenGL ES 3.2, DirectX FL 12, OpenCL 2.0, and Vulkan.
      • DSP – 1.4 GHz Hexagon DSP with dual HVX and 4K HMX
      • VPU – Adreno 642L VPU 4K60 decode for H.264/H.265/VP9, Up to 4K30 encode for H.264/H.265; Support for HDR10 and HDR10+ playback
      • Spectra ISP – Dual SpectraISP, 14-bit depth, supports up to 22+22 MP cameras, 4K video capture at 30 fps, 720p at 960 fps slow motion.
      • AI – 3.5 TOPS, scalable AI architecture, on-device machine learning, dual-core AI processor, audio ML DSP
  • System Memory – Up to 8GB LPDDR5 (soldered)
  • Storage
    • Up to 128GB UFS flash or 128GB eMMC flash
    • M.2 B-Key 2280 socket for NVMe SSD
    • MicroSD card slot
  • Display
    • 1x HDMI 2.0 up to 4k @ 60Hz.
    • 1x LVDS (dual-channel 18/24-bit) up to 1920×1080 or 1x eDP 1.4 (hardware selectable by SW1).
    • Dual independent display support
    • The block diagram reveals that a Chrontel CH7218A chip is used for DP to HDMI conversion and a CH7513A for eDP to LVDS.
  • Camera – 2x 4-lane MIPI-CSI interfaces.
  • Audio – 3.5mm combo audio jack (Realtek ALC5682I codec).
  • Networking
    • 2x Gigabit Ethernet RJ45 ports via Realtek RTL8211FS controllers
    • Optional WiFi/Bluetooth via M.2 E-Key module
    • Optional 5G/4G LTE via M.2 B-Key module + Nano-SIM slot
  • USB
    • 2x USB 3.0 Type-A ports
    • 2x USB 2.0 Type-A ports
    • Internal headers for 2x USB 3.0 + 2x USB 2.0.
  • Serial – 2x RS-232/422/485 and 2x RS-232 interfaces via internal headers
  • Expansion
    • M.2 E-Key 2230 slot (PCIe/USB/I2C/UART) for Wireless modules
    • M.2 B-Key 3052 slot (PCIe x1 / USB 2.0) for 5G/LTE modules
    • M.2 B-Key 2280 slot (PCIe x2) for storage
    • 8-bit GPIO, I2C, SPI
  • Security – Qualcomm Trusted Execution Environment (TEE) v5.3
  • Misc
    • Power-on, Reset, Power LED
    • RTC with 3V/200mAH Lithiumbattery supports CMOS battery
    • API for Hardware Monitor, Brightness Control, I2C, GPIO, WDT
  • Power
    • Supply – 12V DC ± 10%; ATX 2x2pin connector (DC-in jack option available by request)
    • Consumption
      • QCS6490 – Max consumption is 18.08W (TBD).
      • QCS5430 – Idle consumption is 8.26W (TBD).
  • Dimensions – 146 x 102 mm (3.5-inch form factor)
  • Weight – 128 grams (without heatsink)
  • Temperature range
    • Operating – 0 ~ 60°C (Standard), -20 ~ 70°C (Extended with 0.7m/s airflow)
    • Storage – -40 ~ 85 °C (-40 ~ 185 °F)
  • Humidity – Operating 40°C @ 95% relative humidity, non-condensing; storage 60°C @ 95% relative humidity, non-condensing
  • Certification – CE, FCC Class B, ESD 8KV/15KV Criteria A
  • Vibration Resistance – 3.5 Grms
MIO 5355 Block Diagram
MIO-5355 Block Diagram

The block diagram confirms that the QCS6490/5430 sits on an OSM Size-L module (AOM-2721) soldered onto the 3.5-inch SBC board, rather than being directly soldered onto the main PCB. This is a common practice in industrial design to simplify manufacturing variations between SKUs.

On the software side, Advantech offers Windows 11 IoT Enterprise LTSC, Ubuntu 24.04 LTS, and a Yocto 4.0 (Kirkstone) BSP. The company also provides its “SUSI” API for hardware monitoring, brightness control, and GPIO management. More information, including downloads and an installation guide, is available in the user guide.

MIO 5355 Hardware Overview Top
MIO-5355 Hardware Overview (Top)
MIO 5355 Hardware Overview bottom
MIO-5355 Hardware Overview (Bottom)

At the time of writing, the company only mentions two SKUs, MIO-535506Z-U7A1U (Taiwan origin) and MIO-535506Z-U7A1 (China origin), both of which are based on the QCS6490, and there are no SKUs for the QCS5430.

The Advantech MIO-5355 is already available, but like most industrial hardware, pricing has not been made public. You can find more details and request a quote on the product page. Avnet has also just announced availability, and the product is listed on other resellers such as Fortec US and APC Technology (UK).

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