Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 Series processors, which feature AMD’s latest Zen 5 architecture, RDNA 3.5 graphics, and an XDNA 2 NPU for 59 TOPS of combined AI performance, including up to 50 TOPS from the NPU.
The module supports up to 96 GB of DDR5-5600 memory and is available in 4-core and 6-core variants with a configurable 15 W to 54 W TDP, allowing both passive and active cooling designs. It supports up to four independent displays, offers PCIe Gen4 and PEG x4 expansion, and includes 2.5 GbE, USB 3.2 Gen 2, and USB 2.0 ports, along with SATA or optional onboard NVMe storage options. Additional features include TPM 2.0, UEFI firmware, and hardware monitoring. The module is available in both commercial and industrial variants with operating temperatures down to -40 °C, which makes it suitable for compact industrial, embedded, and edge AI systems.
Congatec conga-TCRP1 specifications:
- AMD Ryzen AI Embedded P100 Series SoCs (one of the other)
- AMD Ryzen AI Embedded P132 – 6-core/ 12-thread Zen 5 processor up to 4.5 GHz, 6MB L2 and 8MB L3 Cache, 4x RDNA3.5 graphics @ 2800 MHz; TDP: 28W/54W turbo; NPU:50 TOPS (59 Combined)
- AMD Ryzen AI Embedded P121 – 4-core/ 8-thread Zen 5 processor up to 4.4 GHz, 4MB L2 and 8MB L3 Cache, 2x RDNA3.5 graphics @ 2700 MHz; TDP: 28W/54W turbo; NPU: 30 TOPS
- Industrial variants (P132i/P121i) available with -40°C to +85°C support
- System Memory – 2x SODIMM sockets for up to 96GB DDR5-5600 MT/s (ECC supported); note: 128GB DDR5 likely supported too, although not advertised.
- Storage
- Optional onboard BGA NVMe SSD (up to 512 GB)
- 32 MB SPI flash (Embedded BIOS)
- Networking – Onboard Intel i226 2.5GbE Ethernet controller
- 2x 220-pin standard board-to-board connectors
- Storage – 2x SATA III (6Gb/s) ports (shared with NVMe option)
- Display
- 3x DDI (DisplayPort 1.4a / HDMI 2.1)
- LVDS (dual channel) or eDP 1.4c (Via NXP PTN3460 eDP to LVDS bridge on the module)
- Up to 4x independent displays
- Audio – HD-Audio over DDI ports or HDA interface
- Networking – 2.5Gbps Ethernet
- USB
- 4x USB 3.2 Gen 2 (10 Gbps)
- 4x USB 2.0
- Expansion
- 1x PCIe x4 Gen 4 (PEG)
- 8x PCIe Gen 4 lanes
- 2x UART, 8x GPIO, I2C, SMBus, SPI, LPC
- Security – TPM 2.0 (Infineon SLB9672)
- Misc
- Watchdog timer
- Hardware health monitoring
- Power loss control
- POST code redirection
- Power Management
- Configurable TDP – 15 W to 54 W
- ACPI 6.0 with battery support
- Dimensions – 95 x 95 mm (COM Express Compact Type 6)
- Temperature
- Operating – Commercial: 0°C to +60°C; Industrial: -40°C to +85°C
- Storage – Commercial: -20°C to 80°C; Industrial: -40°C to 85°C
- Humidity
- Operating – 10 % to 85 % RH, non-condensing
- Storage – 5 % to 85 % RH, non-condensing
The module features a 50 TOPS NPU, which significantly outperforms the previous-generation Ryzen Embedded 8000 SoCs, which were limited to 16 TOPS. But compared to the top-tier Ryzen AI 300 series, it falls behind in terms of CPU and GPU performance. By the looks of it, the AI Embedded P100 series is designed that way so that it could be used with passive cooling in sealed systems, as the configurable TDP can drop to 15W.
In terms of software support, the conga-TCRP1 supports Windows 11, Windows 11 IoT Enterprise, and Linux, with UEFI firmware for standard x86 boot and platform configuration. The module is also part of Congatec’s aReady.COM ecosystem, so it can be pre-configured with operating systems like ctrlX OS or Ubuntu Pro, and includes virtualization support via the RTS Hypervisor to consolidate real-time control and GUI/AI tasks on a single board.
The company also provides the conga-TEVAL COMe 3.0, an evaluation carrier board for COM Express Type 6 Compact and Basic modules. It exposes all COM Express signals, including multiple PCIe expansion options (six PCIe x1 slots, PCIe x16 PEG, ExpressCard, and mini PCIe), Gigabit Ethernet, USB 2.0 and USB 3.0 ports, SATA storage, and various connectivity and display features such as dual HDMI, dual DisplayPort, LVDS, and legacy CRT support. Additional features include HD audio, serial and parallel ports, GPIO/SDIO, LPC POST code display, onboard system controls, and much more. With a standard ATX-sized form factor, 12V DC input from a banana jack, and 0°C to 60°C operating temperature, this is well-suited for rapid prototyping, validation, and software development with COM Express Type 6 modules.
We had recently written about the Sapphire Technology EDGE+VPR-7P132 “AMD Embedded+” Mini-ITX motherboard built around AMD Ryzen AI Embedded P100 series (and an AMD Versal AI Edge Gen 2 VE3558 SoC FPGA), but the conga-TCRP1 is the first COM Express Type 6 module we’ve seen based on the new family.
The conga-TCRP1 is available in four variants, including the high-end P132/P132i (6-core) and the entry-level P121/P121i (4-core), both in commercial and industrial temperature ranges. On the product page, you have the option to choose compatible memory, cooling solutions, and carrier boards from congatec’s ecosystem, but after that, you have to request a quote directly from the company. Some additional information is also available in the press release.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
Support CNX Software! Donate via cryptocurrencies, become a Patron on Patreon, or purchase goods on Amazon or Aliexpress. We also use affiliate links in articles to earn commissions if you make a purchase after clicking on those links.
