TOPST D3-G maker SBC is powered by Telechips TCT8050 “Dolphin3” Cortex-A72/A53/R5 automotive-grade SoC

TOPST D3-G is a single board computer (SBC) powered by a Telechips TCT8050 “Dolphin3/3M” 9-core automotive-grade SoC with four Cortex-A72 cores, four Cortex-A53 cores, and one real-time Cortex-R5 core.

The board features 4GB or 8GB LPDDR4 RAM, 32GB eMMC flash and a microSD card for storage, a Gigabit Ethernet port, a DisplayPort 1.2 connector capable of driving four display through MST, two MIPI CSI connectors, a PCIe Gen3x 1 slot, a few USB ports, a 40-pin GPIO header compatible with Raspberry Pi HAT+, and three CAN Bus interfaces.

TOPST D3-G SBC
TOPST D3-G SBC

TOPST D3-G specifications:

  • SoC  – Telechips TCC8050 (Dolphin3)
    • CPU(45,180 DMIPS​)
      • Quad-core Arm Cortex-A72 @ 1.69 GHz, 31,840 DMIPS​
      • Quad-core Arm Cortex-A53 @1.45 GHz, 13,340 DMIPS​​
    • Real-time MCU core – Arm Cortex-R5 @ 600 MHz
    • GPU – Imagination Technologies PowerVR 9XTP (GT9524) delivering up to 168 GFLOPS; Supported APIs: OpenGL ES 1.1 / 2.0 / 3.2, Vulkan 1.2, OpenCL 2.0 / 3.0
  • System Memory – 4GB or 8GB 32-bit LPDDR4X @ 2133 MHz
  • Storage
    • 32GB eMMC flash
    • MicroSD card slot
  • Video Output
    • DisplayPort 1.4 connector (4-lane, 8.1 Gbps/lane)
    • Up to 4x displays using MST; either 1x 4K60 + 3x 1080p60 or 4x 1080p60
    • Up to 3x 1080p60 displays using daisy-chaining
  • Camera  – 2x 15-pin 2-lane MIPI CSI connectors supporting up to 5MP camera modules
  • Networking – Gigabit Ethernet RJ45 port
  • USB
    • 1x USB 3.0 Type-A port
    • 1x USB 2.0 Type-A Host port
    • 1x USB 2.0 Type-C Device port
  • Vehicle Signals –  10-pin 3x CAN Bus header
  • Expansion
    • PCIe 3.0 x1 slot
    • 40-pin GPIO header with I2C, SPI, UART, I2S, PWM, GPIOs; compatible with (most) Raspberry Pi HATs
  • Debugging
    • 10-pin JTAG – Cortex Debug header
    • 3-pin UART header
  • Power Supply – 5V @ 5A via DC jack
  • Dimensions – 120 x 90 mm
Telechips TCT8050 Dolphin3 M processor
Telechips TCT8050 Dolphin 3M processor
Dophin3 SBC block diagram
TOPST D3-G SBC Block Diagram

Telechips provides a Linux SDK based on Yocto Project 4.0 Kirkstone, and a Ubuntu 22.04 rootfs is supported. Development requires a Windows (WSL2) and Linux computer with at least 60 GB of available storage and 16 GB of RAM. The downside is that the SDK is based on Linux 5.10 LTS released in 2020, and whose support will end in December 2026. Resources to get started and interface the board with various sensors and actuators can be found on the documentation website.

Telechips used to be frequently featured on CNX Software in the years 2012-2016, as chips like the TCC8925 Cortex-A5 SoC were often integrated into low-cost HDMI TV dongles and Android TV boxes. The Android 4.2.2 SDK was also released/leaked, which allowed the community to provide custom ROMs or customize the Linux kernel. I had never heard about the company in many years, and I thought the South Korean company had closed shop, but instead, they are now focusing on automotive SoCs used in infotainment and driver-assistance systems. So, the Telechips TCT8050 Dolphin 3M SoC and board are a bit of a surprise. I was made aware of it through the Open-EP e-Paper project on GitHub, as they have instructions to interface a 4.26-inch grayscale ePaper display with the TOPST D3-G board.

40-pin GPIO header pinout diagram TOPST D3-G

TOPST is not a separate company, and instead, it’s a trademark of Telechips Inc. The TOPST D3-G SBC is available for sale, but only in South Korea, and if we select “Global”, we are greeted with the message “Sales for this region are not yet available”. The 4GB RAM model sells for 161,000 Wons (~$110 US) and the 8GB RAM variant for 189,000 Wons (~$129 US). Note that I was contacted by Telechips last October about the upcoming launch of the open-source hardware TOPST boards, so I fully expect the board to be available globally in due time. More details and purchase links (for Korean users for now) can be found on the product page.

Share this:
FacebookTwitterHacker NewsSlashdotRedditLinkedInPinterestFlipboardMeWeLineEmailShare

Support CNX Software! Donate via cryptocurrencies, become a Patron on Patreon, or purchase goods on Amazon or Aliexpress. We also use affiliate links in articles to earn commissions if you make a purchase after clicking on those links.

Radxa Orion O6 Armv9 mini-ITX motherboard

7 Replies to “TOPST D3-G maker SBC is powered by Telechips TCT8050 “Dolphin3” Cortex-A72/A53/R5 automotive-grade SoC”

  1. Please keep us updated on the global launch of an OSHW board! Going by the number of CNX-Software articles this year, there seem to be quite a number of recent automotive SoC product announcements. While you’re at it, you might also want to cover some of the recent additions to NXP’s S32 family. IIRC, I think, they added the S32N79 as the upper-end part of the S32N sub-family on their web site in early January as a pre-production product, for instance: https://www.nxp.com/products/processors-and-microcontrollers/s32-automotive-platform/s32n-vehicle-super-integration-processors:S32N

    IIRC, I read in some earlier announcement of theirs, that newer parts of the S32 line-up target a 5nm production process, so that one might expect good energy efficiency. Then again, the S32N55 part and also IMX94, for instance, have been in pre-production status for months, such that it is uncertain, when general availability might actually be planned.

    1. I can always claim I do it on purpose to show I’m not “AI”.
      The spellchecker didn’t catch it either, possibly because of capitalized letters or due to lag.

Leave a Reply

Your email address will not be published. Required fields are marked *

Boardcon MINI1126B-P AI vision system-on-module wit Rockchip RV1126B-P SoC
Boardcon MINI1126B-P AI vision system-on-module wit Rockchip RV1126B-P SoC