Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card.
The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP.
Silex SX-SDMAX6E specifications:
- Wireless chipset – NXP IW623 tri-band SoC
- Connectivity
- Wi-Fi
- Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, 6 GHz)
- IEEE 802.11a/b/g/n/ac/ax compliant
- 1×1 or 2×2 MIMO support
- Channel bandwidth – 2.4GHz: 20/40MHz; 5GHz: 20/40/80MHz; 6GHz: 20/40/80MHz
- Fast roaming support (802.11k/v/r)
- Bluetooth – Bluetooth 5.x (BR/EDR/LE)
- Wi-Fi
- Host interface
- Wi-Fi – SDIO 3.0
- Bluetooth – UART
- Misc
- RF pads on the BGA module
- MHF1 connectors on the M.2 module
- Power
- 3.3V main supply
- 1.8V support (LGA version)
- 1.8V/3.3V for GPIOs
- Form factors
- SX-SDMAX6E-2530S – 44-pin LGA (17 × 18 × 2.65 mm)
- SX-SDMAX6E-M2 – M.2 2230 Key-E module
- Operating temperature – -40°C to +85°C
- Humidity – Up to 95% RH (non-condensing)
Silex provides datasheets for both the LGA and M.2 versions of the module, but they are currently available only in Japanese. While checking the block diagram for the LGA module, I noticed it mentions the IW693 instead of the IW623, which is incorrect, or could indicate the company is also planning for an IW693 variant.
In terms of software support, the information is rather limited. So far, Silex only mentions that the drivers are optimized for NXP’s i.MX9x platform, and as an NXP Gold Partner, the company provides “optimized driver software” alongside the chipset. The module is designed for mission-critical applications such as hospitals, factory automation, patient monitoring, medical imaging, and real-time control systems, where low latency, minimal interference, and stable connectivity are required.
Previously, we wrote about simpler modules based on older NXPs wireless SoCs, including the Ezurio Sona NX611, which uses the IW611 for Wi-Fi 6 and Bluetooth 5.3. u-blox MAYA-W2 IoT module and the Murata Type 2EL, based on IW612, which also adds 802.15.4 support. Compared to those, the Silex SX-SDMAX6E uses the much newer IW623 tri-band Wi-Fi 6E module for battery-powered embedded devices.
The Silex SX-SDMAX6E module and its development board are scheduled for release in the spring of 2026. More information about the module can be found on Silex Technology’s product page and NXP’s press release. The company also mentions the module is backed by NXP’s 10-15 year product longevity program, and Silex ensures long-term availability by procuring and storing components to continue manufacturing even after specific parts reach EOL.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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