The Teledyne FLIR Lepton XDS dual-camera module combines a factory‑aligned radiometric 160 × 120 Lepton 3.5 thermal camera with a 5 MP visible camera. Its size, weight, and power (SWaP)‑optimized design makes it suitable for mobile devices, compact electronics, smart buildings, fire detection, occupancy analytics, and equipment‑condition‑monitoring applications.
The company highlights that the Lepton XDS module is International Traffic in Arms Regulations (ITAR)-free, which reduces development risk and accelerates time‑to‑market, since it’s easier to export or integrate into products sold globally.
Lepton XDS specifications:
- EO Camera
- Optics – EFL 1.57 mm, 98.2° HFOV, F/1/2.2
- Sensor – 2592 x 1944 pixels (5 MP), 1.4 µm pitch
- Video – 640×480 @ 30Hz
- IR Camera
- Optics – 57° HFOV, f/1.1
- Video – 8.7 Hz (commercial application exportable, since it’s below 9 FPS)
- Thermal Imaging Detector
- Lepton 3.5 160 x 120 pixels, 12 µm pitch
- Thermal Sensitivity – <50 mK (0.050 °C)
- Temperature Accuracy
- High Gain: Greater of ±5°C or 5% (typical)
- Low Gain: Greater of ±10°C or 10% (typical)
- Power Consumption – 1.6 W Operating, 1.9 W Shutter Event, and 500 mW Standby
- Dimensions – 29 x 26.7 x 8.8 mm
- Weight – 5.6 grams
- Temperature Range – Operating: 0°C to +60°C; non-operating: -40°C to +70°C
- EMI – FCC: 47 CFR FCC Part 15, Subpart B, Class B
- ECCN code – 6A003.b.4.b; ITAR-free, only subject to the less restrictive Export Administration Regulations (EAR)
The module features Prism ISP image‑signal‑processing software with patented FLIR MSX (Multi-Spectral Dynamic Imaging), which adds visible light details to thermal images, and VividIR image‑processing technique designed to deliver higher thermal sharpness and more detail. Thermographic tools add support for regions of interest (ROI), spot meters, isotherms, adjustable color palettes, and additional measurement overlays.
The Lepton XDS module can also save images in the advanced radiometric JPEG (RJPG) format for better software compatibility, and FLIR Thermal Studio can be used for post‑processing and report generation.
The Lepton XDS Development Board Kit allows engineers to quickly evaluate the solution and get started with software development. The kit includes the development board, a tripod, and a USB cable, but somehow, the Lepton XDS module is not included.
The company didn’t provide the specifications for the devkit, but from the photos, we can see two USB Type-C ports: USB0 for debugging and firmware upgrade, and USB1 to connect to the host as a UVC camera. Other features include a 6-pin GPIO header with I2C, PWN, wake-up, and 5V/GND pins, a wake-up button, and a micro USB port for the UART console. The bottom side comes with a chip covered by a heatsink, likely a USB bridge for the cameras.
We’ve already seen this type of dual-camera thermal imager in products like the PitFusion thermal imager for Raspberry Pi, combining a Melexis MLX90640 sensor and RGB camera, and the Xtherm II TS2+ thermal imager, which leverages the built-in camera in smartphones. The Lepton XDS module benefits from a much smaller size and weight suitable for space-constrained applications.
The Lepton XDS module costs $239 (MSRP) for samples (1 piece). The company says it’s available through distributors, but none of the ones I’ve tried (DigiKey, Mouser, Future Electronics) list the new module or the development kit. More information can be found on the product page and the press release, and you may check out a demo if you attend Mobile World Congress in Barcelona, on March 2-5, 2026.
Thanks to TLS for the tip.
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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