Lenovo has recently unveiled new ThinkEdge devices for edge AI applications: the Intel “Arrow Lake”-powered ThinkEdge SE60n Gen 2 fanless computer for up to 97 TOPS of AI performance, the ThinkEdge SE10n Gen 2 edge gateway, the compact ThinkEdge SE30n Gen 2 “Raptor Lake” edge client with up to Intel Core 7 150U, and the company’s first industrial all-in-one (AIO) Panel PC, the ThinkEdge SE50a.
We’ll focus on the ThinkEdge SE60n Gen2 fanless embedded computer in this article. It’s powered by an up to Intel Core Ultra 7 265H SoC paired with DDR5 memory, M.2 NVMe and/or SATA storage, and offering two HDMI and one DisplayPort video outputs, audio out and microphone jacks, dual 2.5GbE, WiFI 6E, six USB 3.0/2.0 ports, two RS232/RS485 COM ports, an 8-bit DIO DB9 connector, three M.2 sockets for expansion, as well as a 80-pin Intelligent Expansion Technology (ITE) connector for optional expansion modules.
Lenovo ThinkEdge SE10n Gen 2 specifications:
- SoC – 28W Arrow Lake family up to Intel Core Ultra 7 265H
- CPU – 16-core (6P+8E+2LPE) processor @ up to 5.30 GHz with 24MB cache
- GPU -8 Xe core Intel Arc 140T GPU @ 2.30 GHz (75 TOPS max)
- AI – Intel AI Boost NPU (13 TOPS); Combined AI performance: 97 TOPS
- System Memory – Up to 64GB DDR5 (5600MT/s) via 2 x 262-pin SODIMM socket (Lenovo also says “potential for 96GB under working conditions”, but I don’t see why 128GB would not be supported)
- Storage
- Up to 2TB M.2 (2280)PCIe Gen5 x4 NVMe SSD
- Up to 1TB M.2 (2242) SATA SSD
- Video Output
- 2x HDMI 2.1 up to 4K @ 60Hz
- DisplayPort 1.2
- Audio – 3.5mm Audio out jack, 3.5mm Mic jack
- Networking
- 2x 2.5GbE ports with Intel vPro support
- WiFi 6E 2×2 MIMO and Bluetooth 5.4 via Intel AX210 “Typhoon Peak 2”
- 8x antenna slots
- USB
- 4x USB 3.0 Type-A ports (5Gbps)
- 2x USB 2.0 Type-A ports
- Serial – 2x RS232/422/485 COM ports (DB9)
- Expansion
- 8-bit DIO (DB9)
- 3x M.2 sockets for WiFi, SSD, and a second SATA SSD
- 80-pin Intelligent Expansion Technology (ITE) module for:
- 4x COM (RS232/422/485) & 2x USB-A (hi-speed USB)
- 4x GbE & 2x USB-A (hi-speed USB)
- 4x PoE GbE & 2x USB-A (hi-speed USB)
- 4x USB-A (USB 5Gbps) & 3x USB-A (hi-speed USB)
- Security
- BitLocker
- Boot Guard
- Discrete Trusted Platform Module (dTPM) 2.0
- NIST Compliant BIOS (NIST SP800-193)
- Optional: Intel vPro
- Misc
- Power button
- Remote power button connector
- Reset pin hole
- Power Supply – 12V to 36V DC via 3-pin terminal block
- Dimensions and Weight
- With I/O expansion module: 240 x 150 x 85mm | 2.6 kg
- Without I/O expansion: 240 x 150 x 59mm | 2.3 kg
- Temperature Range – -20°C to +60°C
- Certifications / Registries
- Bureau of Standards, Metrology and Inspection (BSMI)
- China Compulsory Certification (CCC)
- Conformité Européenne (CE)
- Federal Communications Commission (FCC) Class A
- IP50 compliant
- MIL-STD- 810H
The Lenovo ThinkEdge SE60n Gen 2 ships with a terminal block to lockable DC jack cable, a wall mount, a Quick Start Guide, and optional items like a 120W AC to DC adapter and a DIN Rail Kit. Supported operating systems include Windows 11 IoT Enterprise LTSC 2024, Ubuntu Core 24.04, and Ubuntu Server 24.04.
Lenovo first introduced the ThinkEdge family of embedded computers for edge computing in 2021, but somehow it never made it to our news feed. The ThinkEdge SE60n Gen 2 competes against other Intel Core Ultra Arrow Lake embedded systems, such as Avalue EMS-ARH, AAEON BOXER-6648-ARS, ASRock iEP-7040E, and others.
It’s an early announcement, as none of the new ThindEdge devices are available right now. The Lenovo ThinkEdge SE60n Gen 2 will be available in April 2026, along with the SE30n Gen 2, while the SE50n Gen 1 All-in-One PC will launch in June 2026, and the ThinkEdge SE10n Gen 2 gateway will start selling in July 2026. More details may be found on Lenovo’s edge computing page and in the press release.
Thanks to TLS for the tip.
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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