Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release 17-compliant 5G RedCap (Reduced Capability) modules designed to bridge the gap between LTE Cat 4/6 and full-featured 5G.
Both the modules support 5G Sub-6GHz SA with LTE Cat 4 fallback, peak data rates of up to 223 Mbps downlink and 123 Mbps uplink, and backward compatibility with Rel-15/16 networks. Additionally, the modules support optional multi-constellation GNSS via Qualcomm IZat Gen 9VT technology along with various interfaces such as USB 2.0 and PCIe 2.0 (plus UART, SPI, I2C, SGMII, PCM on the RG255C-NA). Both support dual SIM, DFOTA, and embedded protocol stacks, and are suitable for industrial IoT, smart grids, video surveillance, mobile hotspots, wearables, and other medium-speed applications.
Quectel RM255C-GL and RG255C-NA specifications:
- Connectivity
- 5G NR – 3GPP Release 17 RedCap (Reduced Capability) Sub-6 GHz Standalone (SA) mode
- Max data rates – 223 Mbps (DL) / 123 Mbps (UL)
- LTE fallback – LTE Cat 4 (Up to 200 Mbps DL / 105 Mbps UL)
- 5G NR SA bands
- RM255C-GL – n1/2/3/5/7/8/12/13/14/18/20/25/26/28/30/38/40/41/48/66/70/71/77/78
- RG255C-NA – n2/5/7/12/13/14/25/26/30/38/41/48/66/70/71/77/78 (NA-focused, fewer global bands)
- LTE-FDD bands
- RM255C-GL – B1/2/3/4/5/7/8/12/13/14/17/18/19/20/25/26/28/30/66/71
- RG255C-NA – B2/4/5/7/12/13/14/17/25/26/30/66/71 (reduced global coverage)
- LTE-TDD bands
- RM255C-GL – B34/38/39/40/41/42/43/48
- RG255C-NA – B38/41/42/43/48 (no B34/39/40)
- MIMO – 2×2 DL MIMO support
- GNSS (Optional) – Qualcomm IZat Gen 9VT (GPS, GLONASS, BDS, Galileo, QZSS, and NavIC)
- USB – USB 2.0 high-speed interface
- Audio – Digital Audio (PCM) and DTMF support
- Expansion
- PCIe 2.0 interface
- UART, SGMII, PCM, I2C, SPI, ADC, GPIOs interface (RG255C-NA only)
- Misc – DFOTA, (U)SIM Card Detection, eSIM (Optional), VoNR/VoLTE (Optional on RG255C-NA)
- Power
- Supply
- RM255C-GL – 3.135–4.4 V (3.7 V typical)
- RG255C-NA – 3.3–4.3 V (3.8 V typical)
- Consumption
- RM255C-GL – 101 μA (Power off), 2.83 mA (Sleep), 21.97 mA (Idle)
- RG255C-NA – 2.5 mA (Sleep), 27 mA (Idle)
- Supply
- Dimensions and weight
- RM255C-GL – 30.0 × 42.0 × 2.3 mm | 6 grams (M.2 module)
- RG255C-NA – 29.0 × 32.0 × 2.4 mm | 5.2 grams (LGA module)
- Temperature Range
- RM255C-GL – –30°C to +75°C
- RG255C-NA – –35°C to +75°C
- Both support an optional extended temperature range –40°C to +85°C
- Certifications
- RM255C-GL – CE, RCM, FCC, IC, GCF, PTCRB
- RG255C-NA – FCC, IC, PTCRB
- Both support major US carriers (AT&T / Verizon / T-Mobile)
The company mentions that it will provide USB-to-serial drivers for Windows 10/11, Linux (kernel 2.6–6.x, depending on the interface), and Android (4.x–14.x). Multiple USB networking protocols are supported, including MBIM and RNDIS (Windows and Linux), and QMI_WWAN and GobiNet (Linux). along with PCIe MHI drivers for Linux-based systems. The RG255C-NA additionally provides Android RIL support. Both modules also support DFOTA and Quectel enhanced AT commands for firmware upgrades and device management. All the software and hardware-related information is available on the datasheet.
Other 3GPP Release 17 5G RedCap modules include the Quectel RG255G and Cavli CQM220, both targeting mid-tier IoT applications, but design-wise, they’re different. The RG255G is a low-power LGA module designed for RTOS-based systems. In contrast, the CQM220 is a smart module built around an ARM Cortex-A7 processor running Linux/OpenWrt via Cavli’s OpenSDK, allowing applications to run directly on the module without an external MCU, and is available in multiple form factors, including LCC+LGA, M.2, and mPCIe.
The RM255C-GL global variant is listed on Mouser for $143.85 with a minimum order quantity of 150 units. It is also listed on Avnet and Techship, but currently shows no stock, and the distributors do not mention any lead time. The RG255C-NA variant, on the other hand, is not listed on any of these platforms. More information is available on the Quectel website and in the press release.
Thanks to TLS for the tip.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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