ADLINK Express-PTL COM Express Type 6 computer-on-module is built on Intel Core Ultra Series 3 “Panther Lake-H” SoCs up to the 16-core Core Ultra 7 368H processor delivering 180 TOPS of AI performance.
The module pairs up to 128 GB DDR5 memory with IBECC support, features high-speed I/O such as PCIe Gen4, multiple display options, USB4/Thunderbolt capability, and industrial features such as TSN Ethernet, TPM 2.0, and advanced power management. As an industrial part, the Express-PTL is designed to operate across an extended –40°C to 85°C temperature range, and targets applications in robotics, industrial automation, medical imaging, transportation, and smart infrastructure.
ADLINK Express-PTL specifications:
- SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other)
- Intel Core Ultra 5 336H 12-core (4P+4E+4LPE) processor up to 1.9 GHz / 4.6 GHz (Turbo) with 18MB cache, 4-core Xe3 graphics (37 TOPS), 47 TOPS NPU; TDP: 25W (15-65W cTDP)
- Intel Core Ultra 7 356H 16-core (4P+8E+4LPE) processor up to 1.9 GHz / 4.7 GHz (Turbo) with 18MB cache, 4-core Xe3 graphics (40 TOPS), 50 TOPS NPU; TDP: 25W (15-65W cTDP)
- Intel Core Ultra 7 368H 16-core (4P+8E+4LPE) processor up to 2.0 GHz / 5.0 GHz (Turbo) with 18MB cache, 12-core Xe3 graphics (Arc B390, 122 TOPS), 50 TOPS NPU; TDP: 25W (15-65W cTDP)
- System Memory – Up to 128GB (2x 64GB) DDR5 SO-DIMM memory up to 7200 MT/s, IBECC on selected SKUs, ,
- Storage – Onboard NVMe SSD (BGA) in place of SATA 0-3 (build option)
- Networking – Intel I226-IT controller with support for TSN by build option
- Host connectors – 2x 220-pin high-density connectors
- Storage – 4x SATA III 6 Gbps
- Display Interfaces
- DDI 1/2/3 supporting DP 2.1, HDMI 2.1, DVI up to 8Kp60 (single output)
- VGA build option via DP-to-VGA IC in place of DDI 3, up to 1920 x 1200 @ 60Hz
- Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, up to 1920 x 1200 @ 60Hz in dual mode
- 4-lane eDP 1.4b, build option in place of LVDS
- Up to 2x USB4 in place of DDI 1/2, supports DP 2.1 by DP alternative mode, Thunderbolt 4 capable (TBC)
- Quad display supported up to 6Kp60 per display
- Audio – Codec on the carrier board, e.g., Express-BASE6 R3.1 with ALC888 standard support
- Networking – 2.5GbE and Gigabit Ethernet
- USB
- 4x USB 3.2
- 4x USB 2.0
- Up to 2x USB4 in place of DDI1/2
- Serial – 2x UART ports with console redirection
- Expansion
- 8x GPIO (GPI with interrupt)
- PCIe x8 Gen4, lanes 16-23, available for H484 and H404
- 8x PCIe x1 Gen4: Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5/6/7; configuration via BIOS
- LPC bus via ESPI-to-LPC bridge IC, SMBus (system), I2C (user), GP_SPI (TBC)
- Debug Headers – 30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs
- Security – TPM 2.0 (SPI)
- Misc
- Embedded BIOS AMI UEFI with CMOS backup in 32 MB SPI BIOS (dual BIOS optional)
- SEMA Board Controller for voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general-purpose I2C, UART, GPIO, watchdog timer, and fan control
- Super I/O Supported on carrier if needed (standard support W83627DHG-P, other Super I/O upon request)
- Power
- Standard Input – ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%
- Wide Input – ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V
- Management – ACPI 5.0 compliant, Smart Battery support (TBC)
- Power States – C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)
- ECO Mode – Supports deep S5 mode for power saving
- Dimensions – 125 x 95 mm (PICMG COM Rev 3.1 Type 6 Basic size)
- Temperature Range
- Standard: 0°C to 60°C (storage: -20°C to 80°C)
- Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C)
- Humidity
- 5-90% RH operating, non-condensing
- 5-95% RH storage (and operating with conformal coating)
- Shock and Vibration
- IEC 60068-2-64 and IEC-60068-2-27
- MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC)
- HALT – Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test
ADLINK provides support for Windows 11 IoT Enterprise LTSC 2024 and Ubuntu 24.04 64-bit for the Panther Lake COM Express module, while Yocto Linux 64-bit can be supported on a project basis. An OpenVino logo is present on the product page, implying it will be used for AI workloads. The Express-PTL is compatible with the company’s Express-BASED6 R3.1 carrier board used with ADLINK’s other COM Express Type 9/10 modules, and it appears ADLINK is also working on an I-Pi development kit based on the computer-on-module, but no details are available at this stage.
It’s not the first COM Express Type 6 module with Intel Core Ultra Series 3 Panther Lake-H processor, as the SECO SOM-COMe-BT6-PTL was first unveiled in January 2026 with a similar set of features up to the Intel Core Ultra X9/9 388H, and the congatec conga-TC1000r is another option using LPCAMM2 memory instead of SO-DIMM memory.
The Express-PTL Panther Lake COM Express Type 6 computer-on-module is still at the preliminary stage, and no availability or pricing information is available. However, the company has started promoting it, so the release date should be very close. More details can be found on the product page.
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
Support CNX Software! Donate via cryptocurrencies, become a Patron on Patreon, or purchase goods on Amazon or Aliexpress. We also use affiliate links in articles to earn commissions if you make a purchase after clicking on those links.
