Congatec conga-TC300 COM Express module features up to Intel Core 7 350 Wildcat Lake processor

congatec conga-TC300 is an entry-level edge AI COM Express Type-6 Compact module powered by 15W Intel Core Series 3 “Wildcat Lake” SoCs up to the Core 7 350 hexa-core processor.

The module supports up to 64GB DDR5 SO-DIMM memory and features optional on-board UFS 3.1 storage, an Intel i226 2.5GbE controller, and two standard 220-pin board-to-board connectors exposing I/Os such as SATA, DDI and LVDS or eDP display interfaces, USB4, USB 3.2, USB 2.0, PCIe Gen4/Gen3, and more.

Intel Wildcat Lake COM Express Compact module

congatec conga-TC300 specifications:

  • Wildcat Lake SoC (one or the other)
    • Intel Core 3 305
      • 6-core CPU – 2x P-cores @ 1.5/4.3 GHz (Turbo) + 4x LPE-cores @  1.4/3.3 GHz (Turbo)
      • GPU – 1-core Intel Xe3 Graphics @ 2.3 GHz (9 TOPS)
      • NPU – N/A
    • Intel Core 5 320
      • 6-core CPU – 2x P-cores @ 1.5/4.6 GHz (Turbo) + 4x LPE-cores @ 1.4/3.4 GHz (Turbo)
      • GPU – 2-core Intel Xe3 Graphics @ 2.5 GHz (20 TOPS)
      • NPU – 16 TOPS
    • Intel Core 7 350
      • 6-core CPU – 2x P-cores @ 1.5/4.6 GHz (Turbo) + 4x LPE-cores @ 1.4/3.6 GHz (Turbo)
      • GPU – 2-core Intel Xe3 Graphics @ 2.6 GHz (21 TOPS)
      • NPU – 17 TOPS
    • Common features – 15W PBP, 6 MB Intel Smart Cache
  • System Memory – Up to 64GB DDR5 @ 6400 MT/s via 1x SO-DIMM socket
  • Storage – Optional UFS 3.1 flash on module
  • Networking – Intel i226 2.5GbE controller with TSN support (on selected product variants)
  • Host Interface – 2x 220-pin high-density connectors
    • Storage – 2x SATA (note: 4x SATA interfaces in total but multiplexed)
    • Video Interfaces
      • Up to 2x DDI (2x shared with USB4)
      • LVDS or eDP
    • Audio – HDA and Soundwire (optional)
    • Networking – 2.5 Gbps Ethernet
    • USB
      • Up to 2x USB4 (dedicated BIOS required)
      • 4x USB 3.2 Gen2
      • Up to 8x USB 2.0
    •  PCIe
      • 4x PCIe Gen4
      • Additional 4x PCIe Gen3 (optional via PCIe switch)
    • Low-speed I/Os
      • 2x UART
      • GPIOs
      • GPSPI
      • LPC or eSPI (optional)
      • SMB
      • I2C or I3C (optional)
  • congatec Board Controller – Next Gen 6 congatec Board Controller
    • Multi-stage watchdog
    • Non-volatile user data storage
    • Manufacturing and board information
    • Board statistics I²C bus (fast mode, 400 kHz, multi-master)
    • Power Loss Control, Hardware Health Monitoring, POST Code
  • Security – Trusted Platform Module (TPM 2.0)
  • Misc – AMI Aptio UEFI firmware on 64MB serial SPI flash with congatec Embedded BIOS feature, OEM logo and defaults, LCD and backlight control, flash update
  • Power Management – ACPI 6.0 with battery support
  • Dimensions – 95 x 95 mm (PICMG COM Rev 3.1 Type 6 Compact size)
  • Temperature Range – Operating: 0°C to 60°C; storage: -20°C to 80°C
  • Humidity – Operating: 10 to 85% r. H. non cond; storage: 5 to 85% r. H. non cond.
conga-TC300 block diagram
Block diagram

Since Wildcat Lake processors are limited to six PCIe Gen4 lanes, it’s interesting to look at how congatec has been using them. Four lanes are directly routed to the B2B connectors, one lane is dedicated to the 2.5GbE controller, and the remaining lane is used for the SATA ports or a PCIe Gen4 to 4x PCIe Gen3 switch. As a side note, they also had to use a USB 3.2 hub to provide four USB 3.2 interfaces on the B2B connectors since the CPU only has two.

Congatec provides support for Microsoft Windows 11 IoT Enterprise and Windows 11, Ubuntu Pro Linux, and conga-zones Hypervisor. The company also mentions support for ctrlX OS and KontronOS operating systems. The conga-TEVAL/COMe 3.1 carrier board can be used for evaluation. Both active and passive cooling solutions are available for the modules.

conga TEVAL/COMe 3.0 COM Express carrier board
conga TEVAL/COMe 3.0 COM Express carrier board

The conga-TC300 module targets cost-sensitive edge AI applications such as robotics, industrial automation, medical equipment, transportation, smart cities, and retail/point-of-sale (POS). They are meant as an upgrade for embedded designs based on Intel Atom or Celeron platforms that now require dedicated AI capabilities.

While the conga-TC300 is the first Wildcat Lake COM Express module we’ve come across, it’s not the first industrial/edge hardware based on the new Intel SoCs, and we previously covered Advantech’s MIO-5356 3.5-inch SBC.

Congatec has not provided pricing or availability information for the COM Express module. A few more details may be found on the product page and the press release.

Via All About Circuits

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