Thundercomm has launched the TurboX C7790 development kit, a compact edge AI platform built around the Qualcomm Dragonwing Q-7790 (CQ7790S) processor. The kit offers up to 24 TOPS of AI performance and support for both Android and Linux operating systems.
The development kit pairs a TurboX C7790 system-on-module equipped with 12GB LPDDR5X RAM and 128GB flash with a carrier board featuring a wide range of interfaces from dual GbE to HDMI, USB-C, and MIPI DSI display interfaces. Target applications include AI cameras, video conferencing, robotics, and edge AI gateways.
TurboX C7790 Development Kit specifications:
- System-on-Module – TurboX C7790
- SoC – Qualcomm Dragonwing Q-7790 (CQ7790S) 4nm processor
- CPU – Octa-core Kryo processor up to 2.8 GHz
- 1x Gold+ core @ 2.8 GHz
- 4x Gold cores @ 2.4 GHz
- 3x Silver cores @ 1.8 GHz
- GPU – Qualcomm Adreno 722 GPU up to 1.15 GHz
- VPU
- Video Decode – 4K120 H.264/H.265/AV1
- Video Encode – 4K60 formats: H.264/H.265
- Audio DSP (LPASS) – Low-power idle mode with an embedded NPU (eNPU5); always-on subsystem
- AI Acceleration – 24 TOPS (INT8), NSP3, 8K HMX, 4x HVX
- CPU – Octa-core Kryo processor up to 2.8 GHz
- Memory – 12GB LPDDR5X
- Storage
- 128GB flash storage (UFS/eMMC/NAND constraints apply)
- SDC (SD3.0) for SD cards
- SoC – Qualcomm Dragonwing Q-7790 (CQ7790S) 4nm processor
- Carrier board
- Storage
- M.2 M-Key slot for NVMe SSD
- MicroSD card slot
- Display
- 2x HDMI port
- DisplayPort over USB Type-C
- MIPI DSI connector (hardware muxed; cannot be used concurrently with HDMI OUT1)
- Camera
- 3x 4-lane D-PHY camera connectors (supports triple ISP, 21MP+21MP+21MP)
- HDMI input port
- Audio
- 3.5mm headphone jack
- 4x onboard Digital Microphones (DMIC)
- Digital (I2S) audio via HDMI output
- Digital (SoC native) audio via HDMI output
- Digital (I2S) audio via HDMI input
- Networking
- 2x 1000M Gigabit Ethernet ports (RJ45)
- Optional WiFi and Bluetooth via M.2 E-Key socket
- USB
- 4x USB 3.0 Type-A connectors
- USB 3.1 Type-C port
- Debugging – USB Type-C connector with UART support for debugging
- Expansion
- M.2 M-Key socket for NVMe SSD
- M.2 E-Key socket for Wi-Fi/BT module
- 40-pin expansion header
- Misc
- Fan connector
- RTC connector
- FORCE USB Boot button
- Power On, Volume Up/Down tactile switches
- Accelerometer + Gyro (A+G sensor)
- E-Compass
- Storage
- Power – 12V via DC barrel Jack (5.5 x 2.5mm)
- Dimensions – 160 x 124 x 20.5 mm
- Operating Temperature – -30°C to +75°C


Thundercomm provides Android and Linux BSPs with OTA update capability. The platform also supports AI frameworks, as well as Thundercomm’s Claw AI solutions for running AI models locally.
Full BSP downloads for the TurboX C7790 Development Kit are not publicly available; you must create a Thundercomm account and obtain approval to access them. The public pages only offer basic documents like the Product Brief and Quick Start Guide. But once approved, you can download the Android and Linux BSPs using the TurboX SDK Manager, which also supports building and flashing images. OTA updates are included, but the detailed instructions are in the private SDK documentation. The company also mentions that you need to sign an NDA and other license agreements on Thundercomm’s portal to access 3D models or schematics, while a Qualcomm PKLA agreement is required for the core source code.
The TurboX C7790 Development Kit is available for purchase at $1,499. In the box, you’ll get the main board assembly (with the SOM already mounted), one Sony IMX577 camera module with ribbon cable, two external speakers, a USB 3.0 Type-A to Type-C cable, and a 12V power adapter (note: not included for Japan due to local regulations). More information can be found on the product page and in the press release.

Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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