ADLINK COM-HPC-mPTL COM-HPC Mini computer-on-module features up to 180 TOPS Intel Core Ultra Series 3 CPU

ADLINK COM-HPC-mPTL is a COM-HPC R1.3 Mini computer-on-module powered by the Intel Core Ultra Processor Series 3 “Panther Lake” family, up to the 180 TOPS 16-core Core Ultra X7 358H processor.

The module supports up to 64GB LPDDR5x and optional NVMe SSD BGA storage, and features two 2.5GbE controllers, optional MIPI CSI camera connectors,  and a 40-pin  debug connector. All I/Os are exposed through a standard 400-pin high-density board-to-board connector, including four display interfaces (HDMI, DP, USB4, eDP), and up to 16x PCIe Gen4/Gen5 lanes.

COM-HPC Mini module based on Intel Core Ultra Series 3 Panther Lake

COM-HPC-mPTL specifications:

  • SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other)
    • Intel Core Ultra 5 325 8-core (4P+0E+4LPE) processor up to 2.1 GHz / 4.5 GHz (Turbo) with 12MB cache, 4-core Xe3 graphics (40 TOPS), 47 TOPS NPU; PBP: 25W
    • Intel Core Ultra 7 356H 16-core (4P+8E+4LPE) processor up to 1.9 GHz / 4.7 GHz (Turbo) with 18MB cache, 4-core Xe3 graphics (40 TOPS), 50 TOPS NPU; PBP: 25W
    • Intel Core Ultra X7 358H 16-core (4P+8E+4LPE) processor up to 1.9 GHz / 4.8 GHz (Turbo) with 18MB cache, 12-core Xe3 graphics (Arc B390, 122 TOPS), 50 TOPS NPU; PBP: 25W
  • System Memory – Up to 64 GB (4x 16GB) LPDDR5x up to 7467 or 8533 MT/s depending on SKU
  • Storage – Onboard NVMe SSD (optional co-lay with PCIe lane 4 & 5 w/ PCIex2 Gen5)
  • Camera – 2x MIPI-CSI FFC connectors
  • Networking – 2x Intel I226 2.5 Gbps Ethernet controllers with support for TSN by build option
  • Host connectors – 400-pin high-density connector
    • Display Interfaces
      • 2x DDI ports (DDI 0/1) for DP 1.4a or HDMI 2.1 (Default DDI0)
      • 3x USB4 ports with support for DP alt mode
      • eDP 1.4b
      • Up to 4x independent displays
    • Audio – Realtek codec on the carrier board
    • Networking – 2x 2.5GbE
    • USB
      • 3x USB4 ports with DisplayPort Alt mode
      • 4x USB 3.2 Gen2x1 (10 Gbps)
      • 4x USB 2.0
    • Serial – 2x UART ports with console redirection
    • Expansion
      • Up to 16x PCIe lanes
        • 8x PCIe Gen5 lanes (8-15): x8, x4 configurations
        • 4x PCIe Gen4 lanes (0-3): x4, x2, x1 configurations
        • 2x PCIe Gen4 lanes (4-5): x2, x1 configurations
        • 2x PCIe Gen5 lanes (6-7): x2 (lane 6-7), x1(only lane 6) configurations
        • Note: Lanes 4-7 can be combined as PCIe Gen5 x4. (available w/o onboard NVMe SSD function).
      • SMBus (system), 2x I2C (user), 1x GP_SPI, 1x Boot_SPI and eSP
      • 12x GPIO (GPI with interrupt)
  • Debug Headers – 40-pin FFC/FPC connector, compatible with the DB40-HPC debug module; used for BIOS POST code LEDs, EC access, SPI BIOS flashing, power test points, and debug LEDs
  • Security – Infineon TPM 2.0 (SPI)
  • Misc
    • Embedded BIOS AMI UEFI with CMOS backup in 32 MB SPI BIOS (dual BIOS optional)
    • SEMA Board Controller for manageability, voltage/current monitoring, power sequence debug support,  logistics & forensic information (event/history), general-purpose interfaces (I²C, UART, GPIO), watchdog timer, and fan control
  • Power
    • Standard Input – AT mode: 12V±5%; Vin: 8-20V (single power rail)
    • Wide Input – AT: 8.5-20V
    • Power States – C0-C6, S0, S3, S5; ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)
  • Dimensions – 95 x 70 mm (COM-HPC Mini Rev 1.3)
  • Temperature Range
    • Standard: 0°C to 60°C (storage: -20°C to 80°C)
    • Industrial: -40°C to 85°C (storage: -40°C to 85°C)
  • Humidity
    • 5-90% RH operating, non-condensing
    • 5-95% RH storage, non-condensing
  • Shock and Vibration
    • IEC 60068-2-64 and IEC-60068-2-27
    • MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

ADLINK COM-HPC-mPTL

COM-HPC-mPTL Mini Module Bottom Side

ADLINK provides standard support for Windows 11 IoT Enterprise LTSC and Ubuntu 24.04 LTS, as well as VxWorks upon request. The company also provides the COM-HPC Mini base ATX carrier board for evaluation with two Ethernet ports, DP and eDP connectors, PCIe x8 and x4 slots, audio jacks, a range of USB ports, and more.

COM-HPC Mini carrier board
COM-HPC Mini Base carrier board

The COM-HPC-mPTL is the first COM-HPC (Mini) computer-on-module we’ve covered here with an Intel Core Ultra Series 3 “Panther Lake” processor, but congatec is also working on the conga-HPC/mPTL with similar features. The COM-HPC Mini module can also be seen as a more compact variant of the ADLINK Express-PTL COM Express Type 6 module that takes DDR5 DO-DIMM memory, instead of soldered-on LPDDR5 memory.

Intel Core Ultra Series 3 Panther Lake COM-HPC Mini block diagram
COM-HPC-mPTL block diagram

ADLINK didn’t provide availability and pricing information for the COM-HPC-mPTL computer-on-module, and for reference, the product page is still shown as “preliminary”.

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