NXP has introduced the RW610FML, a compact, low-power, certified Wi-Fi 6 and Bluetooth Low Energy (BLE) 5.4 wireless module based on the company’s RW610 Cortex-M33 microcontroller, the little brother of the RW612 without an 802.15.4 radio.
Designed for smart appliances, home automation, industrial gateways, and medical devices, the surface-mount module combines the 260 MHz Arm Cortex-M33 wireless SoC with 8MB of on-module NOR flash, a built-in antenna, an RF matching circuit, and a crystal oscillator.
NXP RW610FML Specifications:
- Wireless MCU – NXP RW610
- CPU Core – 260 MHz Arm Cortex-M33 core with Arm TrustZone-M
- Internal memory – 1.2 MB embedded on-chip SRAM
- Connectivity
- Wi-Fi – Dual-band 2.4 GHz and 5 GHz Wi-Fi 6 (IEEE 802.11a/b/g/n/ac/ax) SISO
- 20 MHz channel bandwidth
- Up to MCS9 (114 Mbps) peak data rate
- Bluetooth – Bluetooth Low Energy (LE) supporting 2 Mbit/s high-speed mode, long-range operation, and extended advertising
- Wi-Fi – Dual-band 2.4 GHz and 5 GHz Wi-Fi 6 (IEEE 802.11a/b/g/n/ac/ax) SISO
- Storage – 8 MB NOR flash
- Castellated holes and pads for connection to host board
- Storage
- 2x FlexSPI interfaces for external NOR Flash (XIP) and PSRAM
- SDIO 3.0
- Display – LCD interface
- Audio – I2S / PCM, Digital Microphone Interface (DMIC)
- Other I/O
- ADC, DAC, Analog Comparator (ACOMP)
- USB, UART, I2C, SPI, GPIOs
- Universal Subscriber Identity Module (USIM)
- Wireless Coexistence Interface 2 (WCI-2)
- Packet Traffic Arbitration (PTA)
- Debugging – JTAG, Serial Wire Debug (SWD)
- Storage
- Security – NXP EdgeLock technology with secure boot, secure debug, secure firmware updates, secure life cycle management, hardware cryptography, and a physically unclonable function (PUF) for secure key management
- Misc
- Integrated PCB antenna
- Timers – SCTimer / PWM, Micro-tick timer (UTICK)
- Dimensions – 25.5 × 18 × 3.16 mm (Surface-mount LGA module form factor)
- Weight – Approximately 1.51 grams
- Temperature Range – Operating: -40°C to 85°C (Industrial Grade); storage: -45°C to 95°C
- Moisture Sensitivity Level (MSL) – 3
The built-in FlexSPI interface features an on-the-fly decryption engine, allowing the MCU to securely execute code in place (XIP) from external flash memory.
To simplify development, the company also offers the FRDM-RW610FML development board, which provides access to the module’s GPIOs, serial interfaces, onboard flash memory, and an MCU-Link debug probe for evaluation and prototyping. No other details are available at this stage, but the image above, provided by NXP, looks very similar to the FRDM-RW612 development board.
The module runs FreeRTOS or Zephyr OS RTOS, and development can be done through the MCUXpresso IDE, MCUXpresso for Visual Studio Code, IAR Embedded Workbench, or Keil MDK.
The RW610FML module and the FRDM-RW610FML development board are currently listed as preproduction products, and at the time of writing, the company has not mentioned anything about pricing. More details, including the preliminary RW610FML fact sheet, can be found on the product page and in the press release.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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