Snapdragon 888 Mobile Hardware Development Kit ships with 12GB RAM, 256GB UFS storage

Snapdragon 888 is the latest premium mobile SoC from Qualcomm with the octa-core processor combining one Cortex-X1 core, three Cortex-A78 cores, and four low-power Cortex-A55 cores, with Adreno 660 GPU and Snapdragon X60 5G modem. The processor will likely most be found in smartphones, but Qualcomm partnered with Lantronix to launch the Snapdragon 888 Mobile Hardware Development Kit designed for Android app developers, hardware vendors, and original equipment manufacturers (OEMs). Snapdragon 888 development board specifications: SoC – Qualcomm Snapdragon 888 (SM8350) octa-core Qualcomm Kryo 680 CPU with 1x Cortex-X1 core @ 2.84 GHz, 3x Cortex-A78 cores @ 2.42 GHz, and 4x Cortex-A55 cores @ 1.80 GHz, Adreno 660 GPU with support for OpenCL 2.0 FP, OpenGL ES 3.2, Vulkan 1.1, DX12, and up to 8K 360 VR video playback, Hexagon 780 DSP System Memory – 12GB LPDDR5 PoP memory Storage – 256GB UFS 3.0 flash, 1x MicroSD/UFS card Display HDMI […]

Lantronix Snapdragon 865 Development Kit to Support Android 11

If you ever wanted to develop applications for the latest Qualcomm Snapdragon processor, Intrinsyc is always the first company to provide Snapdragon hardware development kits and we’ve covered many over the years including Open-Q 845 HDK and Open-Q 855 HDK. The company has recently been bought by Lantronix, a provider of solutions for the Internet of Things (IoT) and Out of Band Management (OOBM), and we covered one of their products – an RJ45 connector running Linux – over 6 years ago. Lantronix Snapdragon 865 Mobile Hardware Development Kit is the first devkit announced since the acquisition. The board is powered by the latest Snapdragon 865 (SM8250) processor combined with 6GB LPDDR5 RAM,  128GB UFS 3.0 storage. The development kit currently supports Android 10, but it will be one of the first hardware to officially run Android 11 just previewed by Google. Snapdragon 865 Mobile HDK specifications: SoC – Qualcomm […]

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Intrinsyc Unveils Open-Q 845 µSOM and Snapdragon 845 Mini-ITX Development Kit

Intrinsyc introduced the first Qualcomm Snapdragon 845 hardware development platform last year with its Open-Q 845 HDK designed for OEMs and device makers. But the company has now just announced a solution for embedded systems and Internet of Things (IoT) products with Open-Q 845 micro system-on-module (µSOM) powered by the Snapdragon 845 octa-core processor, as well as a complete development kit featuring the module and a Mini-ITX baseboard. Open-Q845 µSOM Specifications: SoC – Qualcomm Snapdragon SDA845 octa-core processor with 4x Kryo 385 Gold cores @ 2.649GHz + 4x Kryo 385 Silver low-power cores @ 1.766GHz cores, Hexagon  685 DSP, Adreno 630 GPU with OpenGL ES 3.2 + AEP (Android Extension Pack),  DX next, Vulkan 2, OpenCL 2.0 full profile System Memory – 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz Storage – 32GB or 64GB UFS Flash Storage Connectivity Wi-Fi 5 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz […]

Intrinsyc Launches Open-Q 212A SoM & Qualcomm Home Hub 300 Development Kit

Intrinsyc has just announced the availability of the Open-Q 212A system-on-module and Home Hub Development Kit based on Qualcomm Home Hub 300 Platform powered by the Qualcomm APQ8009 SoC better known as Snapdragon 212. The module supports multi-mic beamforming, audio canceling, HiFi audio, as well as WiFi 5 and Bluetooth connectivity, which makes it suitable for integration into cost-sensitive home hub, home automation, and smart audio devices featuring voice control, AI, and wireless connectivity. Open-Q 212A system-on- module Open-Q 212A SoM, which should not be confused with the company’s Open-Q 212 SBC released two years ago, features for the following specifications: SoC – Qualcomm Snapdragon 212 processor (APQ8009) quad-core Arm Cortex-A7 @  1.267GHz with Adreno 304 GPU, Qualcomm QDSP6 DSP System Memory – 1GB LPDDR3 RAM Storage – 4GB eMMC Flash storage Video – [email protected] playback;  up to 720p playback with H.264 (AVC) and H.265 (HEVC); up to 720p H.264 […]

Intrinsyc Open-Q 855 Snapdragon 855 Development Board Launched for $1,149

When we wrote about Qualcomm Snapdragon 855 Hardware Development Kit last month, and while it was not available at the time, we expected it to eventually be sold through Intrinsyc. And sure enough, the company is now taking orders for the very first Snapdragon 855 development board sold under the “Open-Q 855” name. Price tag: $1,149 for the board only. The expansion board and display pictured below are not included by default and sold separately We already had a pretty good idea of the technical details last month, but Intrinsyc has provided us with the missing bits of information for Snapdragon 855 HDK specifications: SoC –  Qualcomm Snapdragon 855 Octa-core processor with 1x Kryo 485 Gold Prime core at up to 2.7+ GHz, 3x Kryo 485 Gold cores at up to 2.4+ GHz, and 4x Kryo 485 Silver low-power cores at up to 1.7 GHz, Adreno 640 GPU, Hexagon 690 […]

Qualcomm Robotics RB3 Development Platform is Powered by Snapdragon 845 SoC

[Update: The board is now known as “Qualcomm Robotics RB3 Development Platform” instead of DragonBoard 845c”, the rest of the article is unchanged] Qualcomm Snapdragon 845 is one of the fastest Arm processors found in consumer devices, and if you ever wanted a development platform with access to various I/Os, you’d have to go with fairly expensive kits (>$1,000) such as Intrinsyc Open-Q 845 HDK. The good news is that there’s now a cheaper Snapdragon 845 development board, compliant with 96Boards CE specifications, thanks to Thundercomm’s Robotics DragonBoard 845c that combines with processor with 4GB RAM, 64GB UFS storage, and the usual 96boards ports and expansion headers. Robotics DragonBoard 845c specifications: SoC – Qualcomm Snapdragon 845 with 8x custom 64-bit ARMv8 CPUs up to 2.8 GHz Adreno 630 GPU  with support for OpenGL ES 3.2 + AEP, DX next, Vulkan 2, OpenCL 2.0 full profile, and RenderScript Hexagon 685 DSP […]

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Intrinsyc Qualcomm Flight Pro Development Kit Targets High-end Drones and Robotics

Intrinsyc is known for manufacturing and selling mobile  development platforms (MDP) & hardware development kits (HDK) for Qualcomm Snapdragon processors, but this time the company is taking pre-orders for a slightly different Qualcomm development platform: Qualcomm Flight Pro development kit / reference design that targets the development of high-end drones and robotics projects.   Qualcomm Flight Pro board specifications: SoC – Qualcomm Snapdragon 820 (APQ8096) with quad core Kryo processor @ up to 2.15GHz, Adreno 530 GPU, and Hexagon 680 DSP System Memory – 4GB LPDDR4 RAM Storage – 32GB UFS Flash storage, microSD card slot Wireless Connectivity – WiFi 5 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.2 via pre-certified QCA6174A module  + 2x Wi-Fi/BT antennas Location Technology Integrated GNSS solution based on WGR7640 (not recommended for flight applications) Support for U-blox MAX-M8Q-0-00 external GNSS module with high performance antenna and shielding Sensors – Dual IMU (2x Invensense MPU9250): […]

Top 5 Most Powerful Arm SBCs & Development Boards in 2017 / Early 2018

Raspberry Pi, Orange Pi, and NanoPi boards among others are all great and inexpensive Arm Linux development boards that do good enough job for many tasks, but they may not cut it if you have higher requirements either in terms of CPU power, GPU capabilities and performance, I/O bandwidth, and in some cases software and support. So I’ve decided to make a list of 5 single board computers or development boards that I consider to be the most powerful in 2017, early 2018. I have limited the price to $1,000 maximum, the board must be easy to purchase for most people (e.g. you don’t need to be a tier-1 automotive supplier, or operate your own datacenter), and in case the board is not quite available yet, the likeliness of actual launch must be reasonably high. Those criteria for example exclude Intrinsyc Open-Q 835 development kit since it costs $1.149 and […]

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