Thundercomm TurboX C7790 Development Kit
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Thundercomm TurboX C7790 Android and Linux development kit features Qualcomm Dragonwing Q-7790 Edge AI SoC

Thundercomm has launched the TurboX C7790 development kit, a compact edge AI platform built around the Qualcomm Dragonwing Q-7790 (CQ7790S) processor. The kit offers up to 24 TOPS of AI performance and support for both Android and Linux operating systems. The development kit pairs a TurboX C7790 system-on-module equipped with 12GB LPDDR5X RAM and 128GB flash with a carrier board featuring a wide range of interfaces from dual GbE to HDMI, USB-C, and MIPI DSI display interfaces. Target applications include AI cameras, video conferencing, robotics, and edge AI gateways. TurboX C7790 Development Kit specifications: System-on-Module – TurboX C7790 SoC – Qualcomm Dragonwing Q-7790 (CQ7790S) 4nm processor CPU – Octa-core Kryo processor up to 2.8 GHz 1x Gold+ core @ 2.8 GHz 4x Gold cores @ 2.4 GHz 3x Silver cores @ 1.8 GHz GPU – Qualcomm Adreno 722 GPU up to 1.15 GHz VPU Video Decode – 4K120 H.264/H.265/AV1 Video […]

Thundercomm CC6690 SoM
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Thundercomm TurboX C6690 SoM runs Android 15 on Qualcomm DragonWing QCS6690 SoC for terminal equipment

Unveiled at Embedded World 2025, Thundercomm’s TurboX C6690 is a SoM (System-on-Module) powered by a 4nm Qualcomm Dragonwing QCS6690 octa-core SoC, and designed for Android 15-based terminal equipment such as industrial handheld devices, industrial tablets, edge computing, and smart retail applications. The LGA system-on-module features a multi-chip package that combines 8GB LPDDR4x memory with 256GB UFS storage, and offers MIPI and DP (USB) display interfaces, four MIPI CSI camera interfaces, a USB 3.1 interface, a PCIe Gen2 interface, and various low-speed I/Os such GPIO, I2C, UART, and SPI. Thundercomm TurboX C6690 SoM specifications: SoC – Qualcomm Dragonwing QCS6690 CPU – Octa-core Qualcomm Kryo CPU 7-series (1x Kryo Prime core @ 2.9GHz, 3x Kryo Gold @ 2.7GHz, 4x Kryo Silver @ 2.0GHz) GPU – Qualcomm Adreno GPU 7-series DSP – Qualcomm Hexagon DSP with HVX and HMX ISP – Qualcomm Spectra ISP 665 image processing VPU Video Encode – Up to […]

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8K WiFi 6 AI camera development kit
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TurboX C7230 SOM integrates Qualcomm QCS7230 SoC for WiFi 6 & 5G 8K AI cameras

Thundercomm TurboX C7230 SOM is a system-on-module powered by the just-announced Qualcomm QCS7230 hexa-core processor with 7 TOPS of AI performance and designed for WiFi 6 and 5G connected smart cameras with up to 8K resolution. The TurboX C7230 module comes with 8GB LPDDR5 (PoP), 128GB UFS storage, six MIPI CSI camera interfaces, two MIPI DSI display interfaces, as well as a QCA6391 chip for WiFi 6 and Bluetooth 5.1 connectivity, plus optional 5G cellular connectivity through an optional Snapdragon X55 module that connects to the TurboX C7230 development kit. TurboX C7230 SOM system-on-module specifications: SoC – Qualcomm Snapdragon QCS7230 hexa-core processor with 1x Kryo 585 Gold (Cortex-A77) core @ 2.84 GHz, 3x Kryo 585 Gold cores @ 2.4 GHz, and two Kryo 585 Silver (Cortex-A55) cores @ 1.8 GHz, 4 MB L3 cache, Adreno 650 GPU, Adreno 665 VPU, Adreno 995 DPU, Hexagon DSP with dual-HVX,  and Spectra 480 […]

TurboX C865 96Boards development kit
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TurboX C865 CPU module and 96Boards devkit feature Qualcomm QCS8250 IoT processor

Thundercomm has unveiled another Qualcomm IoT module and development kit with the TurboX C865 SOM and development kit based on Qualcomm QCS8250, based on Snapdragon 865 but for IoT applications, which follows our coverage of the company’s TurboX CM2290 and C2290 SoM & devkit based on Qualcomm QCM2290/QCS2290 quad-core Cortex-A53 processor several days ago. The new TurboX C865 system-on-module is for higher-end IoT applications with a faster processor combines with 8GB LPDDR5 RAM, and 128G UFS storage, WiFI 6 & Bluetooth 5.1 connectivity, and the company also offers a 96Boards compliant development kit to help with the development of more advanced IoT products running Android 10. TurboX C865 SoM Specifications: SoC – Qualcomm QCS8250 octa-core Kryo 585 processor with Adreno 650 GPU, Adreno 665 VPU, Adreno 995 DPU, Hexagon DSP with quad HVX, Spectra 480 ISP; 15 TOPS AI processing power System Memory – 8GB LPDDR5 (PoP) Storage – 128G […]

Radxa Dragon Q8B
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Radxa’s 2026 Qualcomm hardware: Dragon Q8B and Q5E SBCs, DragonStation and DragonBay NAS systems

Radxa started its partnership with Qualcomm last with the Dragon Q6A SBC, but it turns out it was just the start, and the company showcased more Qualcomm SBCs and NAS systems at a Radxa + Qualcomm developer day on May 30, 2026. The Radxa Q8B SBC will be based on a Qualcomm Snapdragon 8cx Gen3 octa-core SoC and the Q5E SBC on a Dragonwing QCS6690 octa-core Kryo SoC. The company also teased DragonStation and DragonBay NAS systems, and a 2026 roadmap features a total of 22 Qualcomm systems made by Radxa. Radxa Dragon Q8B Dragon Q8B specifications: SoC – Qualcomm Snapdragon 8cx Gen 3 compute platform Octa-core CPU – 4x 3.0 GHz Kryo Prime cores, 4x 2.4 GHz Kryo Efficiency Cores GPU – Adreno 690 GPU with DirectX 12 (DX12) API support DSP – Qualcomm Hexagon Processor, Qualcomm Sensing Hub AI – Qualcomm Neural Processing Engine SDK support for AI […]

Tiny Snapdragon W5+ System-on-Module
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Beacon W5+ SoM – A tiny (27x15mm) Qualcomm Snapdragon W5+ System-on-Module for wearables

Beacon EmbeddedWorks’ W5+ SoM is an ultra-compact (27×15 mm) system-on-module powered by the Qualcomm Snapdragon W5+ platform for wearables with a quad-core Cortex-A53 processor, a co-processor with an Arm Cortex-M55 core and an Ethos U55 ML accelerator, and WiFi 4 and Bluetooth 5.3 connectivity. The Snapdragon W5/W5+ wearables platforms were introduced in the summer of 2022, but so far, all I could find was a $2,000 devkit (TurboX W5+) suitable for ODM/OEM manufacturers. The upcoming Beacon W5+ SoM will be one of the first hardware solutions based on the Snapdragon W5+ platform designed for commercial applications. Beacon W5+ specifications: Platform – Snapragon W5+ SW5100P-0 SoC CPU – Quad-core Cortex-A53 processor @ up to 1.7 GHz GPU – Qualcomm Adreno A702 @ up to 1,010 MHz with OpenGL ES 3.1, Vulkan 1.0, OpenCL 2.0 API support DSP – Dual Qualcomm Hexagon DSP V66K ISP – Dual ISP VPU 1080p30 Video Decode […]

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Qualcomm Robotics RB1 RB2 Vision Kit
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Qualcomm Robotics RB1 and RB2 development kits launched for $199 and up

We quickly mentioned the Qualcomm Robotics RB1 and RB2 development kits in our post about Lantronix Open-Q 2210RB and 4210RB SiPs mostly to complain about the lack of information at the time. But things have changed the Qualcomm Robotics RB1 and RB2 devkits for cheaper, smaller Linux-powered robots with lower power consumption are now available, and we have more details with three options: Core Kit, Vision Kit, and Full Kit. So let’s have a closer look. All kits are based on the Qualcomm Robotics RB1/RB2 Core Kit with the following (preliminary) specifications: System-on-module RB1 –  Thundercomm TurboX C2210 SoC – Qualcomm QRB2210 CPU – Quad-core Cortex-A53 processor at up to 2.0 GHz GPU – Adreno 702 GPU at 845 MHz with support for OpenGL ES 3.1, Vulkan 1.1, OpenCL 2.0 Hexagon QDSP6 v66 DSP 1080p 30 fps encode / 1080p 30fps decode System Memory – 1GB or 2GB LPDDR4 Storage […]

Open-Q RB1 RB2 Development Kit with Qualcomm QRB2210 or QRB4210
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Lantronix Open-Q 2210RB and 4210RB SiPs for robotics power RB1/RB2 development kit

What comes after Qualcomm Robotics RB3, RB5, and RB6 platforms? Apparently, it’s Qualcomm Robotics RB1 and RB2 platforms powered by Qualcomm QRB2210 and Qualcomm QRB4210 processors respectively and optimized for cheaper, smaller robots with lower power consumption. But Qualcomm is one of the lamest companies known to man, so they did not include any photos when announcing the Robotics RB1 and RB2 platforms, so I’ll focus this post on Lantronix Open-Q 2210RB and 4210RB system-in-packages (SiP) based on the same processors, as well as the Open-Q RB1/RB2 development kit. Open-Q 2210RB and 4210RB SiP The new system-in-packages are very similar to the earlier Open-Q 2290CS and 4290CS SIPs for industrial IoT and machine vision applications, with the only difference being the Qualcomm processor used, so I invite you to read the earlier post for the full details, and I’ll just provide summaries here. Open-Q 2210RB key features: SoC – Qualcomm […]

Boardcon MINI1126B-P AI vision system-on-module wit Rockchip RV1126B-P SoC