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June 9, 2025June 9, 2025

Calixto Systems introduces i.MX93 VERSA SO-DIMM SoM and EVK with NXP i.MX 93 Edge AI SoC

India-based Calixto Systems has unveiled the i.MX93 VERSA SO-DIMM system-on-module (SoM) powered by an NXP i.MX 93 Arm Cortex-A55/M33 SoC with Ethos-U65 micro NPU for Edge AI applications, as well as an evaluation kit (EVK). The system-on-module features up to 2GB LPDDR4x RAM, 16GB eMMC flash, a gigabit Ethernet PHY, and exposes various I/Os through a 200-pin SO-DIMM edge connector, such as MIPI DSI, LVDS, and parallel RGB display interfaces, MIPI CSI and Parallel camera interfaces, dual GbE (on PHY on-module, one on carrier), and more. The i.MX93 VERSA module targets smart industrial automation, healthcare, retail, and connected edge systems with specific size, performance, and power efficiency requirements. i.MX93 VERSA specifications: SoC – NXP i.MX 93 CPU Up to 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, color space conversion NPU – Arm Ethos-U65 NPU @ […]

April 25, 2024April 25, 2024

Ronetix launches NXP i.MX93 SoMs in SMARC and OSM-L form factors

Austrian embedded equipment manufacturer, Ronetix, has released two i.MX93 system-on-modules (SoMs): the RNX-iMX93-OSM that follows the Open Standard Module (OSM) form factor, and the RNX-iMX93-SMARC compliant with the SMARC 2.1 (smart mobility architecture) standard. Ronetix i.MX93 SoMs are powered by the NXP i.MX93 processor featuring a 64-bit dual-core Arm Cortex-A55 application processor running at 1.7GHz and a Cortex-M33 core running at 250MHz for low-latency and real-time tasks. The SoC supports up to 2GB LPDDR4 RAM and 512GB eMMC storage, and the integrated Arm Ethos-U65 microNPU offers up to 0.5 TOPS of computing power for machine vision applications and intelligent energy management (IEM). Applicable for industrial automation and IoT, the SoMs also feature two CAN and Ethernet interfaces to aid high-speed data transfer. Other hardware featuring the i.MX93 that we have covered recently include the ADLINK OSM-IMX93, MaaXBoard OSM93, and Ka-Ro Electronics’ QS93. The RNX-iMX93-SMARC system-on-module comes in 82 x 50mm […]

Linux 7.1 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linus Torvalds has just released Linux 7.1 on LKML: So it’s only Sunday morning back home, but it’s Sunday afternoon where I am right now, so I’m doing the 7.1 release at the regular time – just not in the regular timezone. This obviously means that the merge window opens tomorrow, but I’ll be in yet another timezone by then, so timing will all be a bit irregular. Normally I try to front-load the merge window and do as much as possible the first few days – this time I’m not sure that will work out with my laptop and a couple of long flights without internet, but I’ve made sure that I have fetched the early pull requests (thank you – you know who you are), so I will be able to do some of it off-line. Anyway, possible slight hiccups in the merge window aside, the news today […]

April 13, 2026

Linux 7.0 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linus Torvalds has just released Linux 7.0 on LKML: The last week of the release continued the same “lots of small fixes” trend, but it all really does seem pretty benign, so I’ve tagged the final 7.0 and pushed it out. I suspect it’s a lot of AI tool use that will keep finding corner cases for us for a while, so this may be the “new normal” at least for a while. Only time will tell. Anyway, this last week was a little bit of everything: networking (core and drivers), arch fixes, tooling and selftests, and various random fixes all over the place. Let’s keep testing, and obviously tomorrow the merge window for 7.1 opens. I already have four dozen pull requests pending – thank you to all the early people. Linus This follows the Linux 6.19 release about two months ago, which brought us PCIe link encryption and […]

Silex SX SDMAX6E tri band Wi Fi 6E + Bluetooth LE module LGA(Right) M.2(Left)

February 23, 2026February 23, 2026

Silex SX-SDMAX6E tri-band Wi-Fi 6E + Bluetooth LE module features NXP IW623 SoC, comes in M.2 or LGA package

Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card. The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP. Silex SX-SDMAX6E specifications: Wireless chipset – NXP IW623 tri-band SoC Connectivity Wi-Fi Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, 6 GHz) IEEE 802.11a/b/g/n/ac/ax […]

Quectel SRG091X and SRG093X NXP i.MX Smart AIoT module

January 9, 2026January 9, 2026

Quectel SRG091X and SRG093X NXP i.MX 9 industrial AIoT modules integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios

After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT modules based on NXP’s i.MX 9 series SoCs. The module integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios through the IW610G chipset, so it can simply be dropped into a PCB to create a fully compliant Matter Border Router without any RF design or coexistence concerns. While both modules share the same 46 x 41.5 mm form factor and wireless capabilities, they are different in terms of CPU power as the SRG091X is an entry-level solution built around a single-core NXP i.MX 91 processor, while the SRG093X features dual-core NXP i.MX 93 SoC, which includes a Cortex-M33 real-time core and a neural processing unit (NPU) for edge AI workloads. The module supports LPDDR4/LPDDR4X memory, eMMC storage, and various I/O options, including dual Gigabit Ethernet, USB 2.0, CAN-FD, SPI, UART, I²C/I³C, ADC, […]

December 1, 2025December 12, 2025

Linux 6.18 LTS release – Main changes, Arm, RISC-V, and MIPS architectures

Linus Torvalds has just announced the release of Linux 6.18 on the Linux Kernel Mailing List (LKML), which will likely become the next LTS kernel [update: it’s now official]: So I’ll have to admit that I’d have been happier with slightly less bugfixing noise in this last week of the release, but while there’s a few more fixes than I would hope for, there was nothing that made me feel like this needs more time to cook. So 6.18 is tagged and pushed out. Most of the last-minute fixes are minor fixes to drivers, with some random noise elsewhere (bluetooth, ceph, afs..). Nothing strikes me as standing out, but hey, there’s a shortlog appended if you want to see the details. And this obviously means that the merge window will open tomorrow, and I already have three dozen pull requests pending. Thanks. And as I already mentioned a couple of […]

July 28, 2025

Linux 6.16 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linus Torvalds has just announced the release of Linux 6.16 on LKML: It’s Sunday afternoon, and the release cycle has come to an end. Last week was nice and calm, and there were no big show-stopper surprises to keep us from the regular schedule, so I’ve tagged and pushed out 6.16 as planned. It’s worth noting that the upcoming merge window for 6.17 is going to be slightly chaotic for me: I have multiple family events this August (a wedding and a big birthday), and with said family being spread not only across the US, but in Finland too, I’m spending about half the month traveling. That means that I will try very hard to get most of the merge window done the first week before my travels start, and I already ended upgiving a heads-up on that to the people who tend to send me the most pull requests. […]