Android Category - CNX Software - Embedded Systems News

April 24, 2024April 24, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

STMicro LSM6DSV32X Edge AI motion sensor aims to extend battery life in wearables, trackers, and activity monitors

STMicro LSM6DSV32X is a new low-power 6-axis inertial module with the company’s machine-learning core (MLC) with AI algorithms based on decision trees, a 3-axis accelerometer with a full-scale range of 32g, and a 4000 degrees-per-second gyroscope designed to measure intensive movements, impacts, and freefall height (estimation). The features of the sensors enable it to lower the power consumption for functions such as gym-activity recognition to under 6µA, while 3D orientation tracking consumes just 30µA when using STMicro’s Sensor Fusion Low-Power (SFLP) algorithm. It will be found in a range of battery-powered devices such as consumer wearables, asset trackers, and impact and fall alarms for workers or the elderly. STMicro LSM6DSV32X specifications: Triple-channel architecture for UI (user interface), EIS, and OIS data processing Data storage – Smart FIFO up to 4.5 KB Sensors Accelerometer – ±4/±8/±16/±32 g full scale Gyroscope – ±125/±250/±500/±1000/±2000/±4000 dps full scale Embedded temperature sensor Host interfaces SPI, […]

April 17, 2024April 17, 2024 by Tomisin Olujinmi - No Comments

congatec conga-SA8 Amston Lake SMARC modules are targeted at industrial edge applications

Congatec’s new conga-SA8 SMARC modules are powered by the Intel Atom x7000RE “Amston Lake” processors. With twice the processing cores and similar power consumption to the previous generation, congatec’s new credit-card-sized modules are “intended for future-facing industrial edge computing and powerful virtualization.” An Intel Core i3‑N305 Alder Lake-N processor is also offered as an alternative to the Intel Atom x7000RE series for high-performance IoT edge applications. The conga-SA8 modules support up to 16GB LPDDR5 onboard memory, 256GB eMMC 5.1 onboard flash memory, and offer several high-bandwidth interfaces such as USB 3.2 Gen 2, PCIe Gen 3, and SATA Gen 3. The integrated Intel UHD Gen 12 graphics processing unit has up to 32 execution units and can power three independent 4K displays. The conga-SA8 is described as virtualization-ready and has a hypervisor (virtual machine monitor) integrated into the firmware. The RTS hypervisor takes complete advantage of the eight processing cores […]

April 15, 2024April 14, 2024 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Qualcomm RB3 Gen 2 Platform with Qualcomm QCS6490 AI SoC targets robotics, IoT and embedded applications

Qualcomm had two main announcements at Embedded World 2024: the ultra-low-power Qualcomm QCC730 WiFi microcontroller for battery-powered IoT devices and the Qualcomm RB3 Gen 2 Platform hardware and software solution designed for IoT and embedded applications based on the Qualcomm QCS6490 processor that we’re going to cover today. The kit is comprised of a QCS6490 octa-core Cortex-A78/A55 system-on-module with 12 TOPS of AI performance, 6GB RAM, and 128GB UFS flash connected to the 96Boards-compliant Qualcomm RBx development mainboard through interposer, as well as optional cameras, microphone array, and sensors. Qualcomm QCS6490/QCM6490 IoT processor Specifications: CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL ES 3.2, Open CL 2.0, Vulkan 1.x, DX FL 12 DSP – Hexagon […]

April 15, 2024April 14, 2024 by Tomisin Olujinmi - 1 Comment

GigaDevice announces GD32F5 Cortex-M33 microcontroller targeted at high-performance applications

GigaDevice GD32F5 Cortex-M33 microcontroller

GigaDevice has officially launched the GD32F5 microcontroller series based on the Arm Cortex-M33 core. The Arm Cortex-M33 core has a maximum operating frequency of 200MHz and a working performance of up to 3.31 CoreMark/MHz. It also comes with a digital signal processing extension and a single-precision floating-point unit to reduce the load on the core. The GD32F5 microcontrollers are designed for high-performance applications and come equipped with up to 7.5MB on-chip flash, 1MB static RAM (SRAM), and diverse connectivity peripherals. The on-chip flash includes a zero-wait execution area (code flash) to improve code processing efficiency and real-time performance, and sizable data flash space for storing backups and parameters. The products support seamless OTA updates with a maximum of 2MB for Read-While-Write (RWW) operations. According to GigaDevice, the GD32F5 series is expected to find applications in “energy and power management, photovoltaic energy storage, industrial automation, programmable logic controllers (PLC), network communication […]

April 12, 2024April 12, 2024 by Tomisin Olujinmi - 1 Comment

SolidRun Bedrock R8000 is the first Industrial PC to feature AMD Ryzen Embedded 8000 series

Bedrock 8000 AMD Ryzen Embedded 8000 industrial PC

Israeli embedded systems manufacturer, SolidRun, has recently introduced the Bedrock R8000, a new fanless, Industrial PC targeted at edge AI applications. The Bedrock R8000 integrates the newly-announced AMD Ryzen Embedded 8000 series processors with 8 Zen 4 cores and 16 threads clocked at up to 5.1 GHz. The Ryzen Embedded 8000 Series has a 16 TOPS NPU for AI workloads and offers up to 10 years of guaranteed availability. Also, up to 3 AI accelerators (either Hailo-10 or Hailo 8) can be combined with the onboard NPU to achieve over 100 TOPS for generative or inferencing AI workloads. Apart from the Ryzen Embedded 8000 series, the Bedrock R8000 series also supports other Accelerated Processing Units (APU) in the “Hawk Point” family. The CPU power limit can be adjusted in the BIOS within a range of 8W to 54W. Memory goes up to 96GB DDR5 ECC/non-ECC and three NVME PCIe Gen4 […]

April 12, 2024April 12, 2024 by Jean-Luc Aufranc (CNXSoft) - 21 Comments

Orange Pi 5 Pro – A low-cost Rockchip RK3588S SBC with up to 16GB LPDDR5 RAM, dual HDMI video output

As mentioned in the Orange Pi Developer Conference 2024 article, the Orange Pi 5 Pro launch was just around the corner, and the latest Rockchip RK3588S SBC is now available on Amazon or Aliexpressfor $109 and up with 16GB LPDDR5 RAM, but cheaper 4GB ($60) and 8GB ($80) variants are coming soon. One would think the Orange Pi 5 Pro would be an evolution of the Orange Pi 5 SBC with LPDDR4 memory, and in some ways it is, but there are enough changes to display ports, storage, wireless, GPIO header, and even the form factor that make a direct comparison challenging. Orange Pi 5 Pro specifications: SoC – Rockchip RK3588S CPU – Octa-core processor with 4x Cortex-A76 cores @ up to 2.4 GHz, 4x Cortex-A55 cores @ up to 1.8 GHz GPU – Arm Mali-G610 MP4 GPU with OpenGL ES 3.2, OpenCL 2.2, and Vulkan 1.2 support VPU – […]

April 11, 2024April 12, 2024 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Radxa NIO 12L – A low-profile MediaTek Genio 1200 SBC with Ubuntu certification for at least 5 years of updates

Radxa NIO 12L is a low-profile single board computer (SBC) based on the MediaTek Genio 1200 octa-core Cortex-A78/A55 SoC with a 4 TOPS NPU that got Ubuntu certification with at least 5 years of software update, and up to 10 years for extra payment. The board comes with up to 16GB RAM, 512GB UFS storage, HDMI, USB-C (DisplayPort), and MIPI DSI video interfaces, a 4K-capable HDMI input port, two MIPI CSI camera interfaces, gigabit Ethernet and WiFi 6 connectivity, five USB ports, and a 40-pin GPIO header for expansion. Radxa NIO 12L specifications: SoC – Mediatek Genio 1200 (MT8395) CPU Quad-core Arm Cortex-A78 @ up to 2.2 to 2.4GHz Quad-core Arm Cortex-A55 @ up to 2.0GHz GPU Arm Mali-G57 MC5 GPU with support for OpenGL ES1.1, ES2.0, and ES3.2, OpenCL 1.1, 1.2 and 2.2, Vulkan 1.1 and 1.2 2D image acceleration module APU – Dual‑core AI Processor Unit (APU) Cadence […]

April 10, 2024April 10, 2024 by Debashis Das - 3 Comments

The New IoT Device Security Specification 1.0 unifies various standards into one

Connectivity Standards Alliance Launches the IoT Device Security Specification 1.0

The Connectivity Standards Alliance has recently introduced its IoT Device Security Specification 1.0, a way to defragment many security standards into one. This common scheme and certification standard will ensure that devices meet local requirements in each country. With this approach, a single test from the alliance ensures that the product can be sold globally without any compliance issues. IoT Device Security Specification 1.0 at a glance: Unified Security Standard – Integrates the major cybersecurity baselines from the United States, Singapore, and Europe into one comprehensive framework. Product Security Verified Mark – A new certification mark that indicates compliance with the IoT Device Security Specification, designed to enhance consumer trust and product marketability. No Hardcoded Default Passwords – Ensures all IoT devices utilize unique authentication credentials out of the box, improving initial security. Unique Identity for Each Device – Assigns a distinct identity to every device, crucial for traceability and secure […]