Qualcomm Dragonwing Category - CNX Software

June 8, 2026June 8, 2026 by Debashis Das - No Comments

Qualcomm Dragonwing Mobile Broadband Multimedia (MBM) MBM715 and MBM 415 SoCs combine 5G, Wi-Fi, multimedia, and Edge AI

Qualcomm Dragonwing MBM715 & MBM415 Mobile Broadband Multimedia SoC

Qualcomm has introduced the Dragonwing Mobile Broadband Multimedia (MBM) family, a new lineup of 4-nm SoCs that integrate 5G connectivity, Wi-Fi, multimedia processing, and on-device AI into a single platform for “interactive broadband” devices. The family currently features the top-tier Dragonwing MBM715 and the lower-cost Dragonwing MBM415, designed for smart displays, retail kiosks, service terminals, and other connected devices that require both high-speed connectivity and local processing. Unlike mobile broadband (MBB) or fixed wireless access (FWA) platforms, the MBM series combines connectivity, display, camera, and AI into one chip, so no separate processor is needed. Qualcomm Dragonwing MBM715 & MBM415 Specifications: The MBM415 has no dedicated on-device Generative AI engine, but Qualcomm officially brands the MBM415’s modem-side processing as “Qualcomm AI-Enhanced Signal Boost.” It is not for generative AI, but it is an AI feature listed in the specs. Also note that the MBM715 supports CBRS (3.5 GHz), which is […]

June 1, 2026June 2, 2026 by Jean-Luc Aufranc (CNXSoft) - 10 Comments

Radxa’s 2026 Qualcomm hardware: Dragon Q8B and Q5E SBCs, DragonStation and DragonBay NAS systems

Radxa started its partnership with Qualcomm last with the Dragon Q6A SBC, but it turns out it was just the start, and the company showcased more Qualcomm SBCs and NAS systems at a Radxa + Qualcomm developer day on May 30, 2026. The Radxa Q8B SBC will be based on a Qualcomm Snapdragon 8cx Gen3 octa-core SoC and the Q5E SBC on a Dragonwing QCS6690 octa-core Kryo SoC. The company also teased DragonStation and DragonBay NAS systems, and a 2026 roadmap features a total of 22 Qualcomm systems made by Radxa. Radxa Dragon Q8B Dragon Q8B specifications: SoC – Qualcomm Snapdragon 8cx Gen 3 compute platform Octa-core CPU – 4x 3.0 GHz Kryo Prime cores, 4x 2.4 GHz Kryo Efficiency Cores GPU – Adreno 690 GPU with DirectX 12 (DX12) API support DSP – Qualcomm Hexagon Processor, Qualcomm Sensing Hub AI – Qualcomm Neural Processing Engine SDK support for AI […]

March 3, 2026March 3, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Qualcomm Wi-Fi 8 solutions – FastConnect 8800 Mobile Client and Qualcomm Dragonwing Networking Platforms

Qualcomm has unveiled its Wi-Fi 8 (802.11bn) portfolio, which includes the FastConnect 8800 “Mobile Connectivity System”, also integrating Bluetooth 7 wireless technology, Ultra Wideband (UWB), and Thread, and five Dragonwing Networking platforms for access points and routers. The Dragonwing NPro A8 Elite features a 5×5 Wi-Fi 8 radio system for high-performance enterprise access points and premium home routers, the Dragonwing FiberPro A8 Elite offers similar features but adds 10G fiber access (PON) for fiber-to-the-home gateways, the Dragonwing FWA Gen 5 Elite is designed for fixed wireless access using the Qualcomm X85 5G Modem-RF System, and the Qualcomm Dragonwing N8 and F8 platforms offer mainstream tier options for Ethernet and fiber broadband CPEs. Qualcomm FastConnect 8800 Wi-Fi 8 mobile client Qualcomm FastConnect 8800 (WCN885x) specifications: Wi-Fi 8 with advanced features like UWB, including and RADAR Support for Snapdragon Sound™ Technology Suite, Bluetooth® High Data Throughput (HDT), and Qualcomm XPAN Proximity AI […]

February 23, 2026February 23, 2026 by Debashis Das - No Comments

OnLogic Factor 101 – A fanless industrial edge AI computer with Qualcomm QCS6490 SoC, 10GbE networking

Onlogic Factor 101 Qualcomm QCS6490 powered industrial computer

The OnLogic Factor 101 (FR101) is an ultra-small form factor, fanless industrial computer built around the Qualcomm QCS6490 platform for edge AI and data gateway applications. Designed for space-constrained applications, it targets light machine vision, inspection, monitoring, and low-speed autonomous systems. The octa-core Qualcomm Kryo 670 (Cortex-A78/A55-class) processor is paired with 8GB LPDDR4x memory and 128GB UFS flash storage. The fanless system features 10GbE and Gigabit Ethernet ports, five USB ports, and HDMI and USB-C (DisplayPort) video output. Its compliance with various standards makes it suitable for general office and industrial edge deployments. OnLogic Factor 101 specifications: SoC – Qualcomm Dragonwing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL ES 3.2, Open CL 2.0, Vulkan […]

February 9, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Linux 6.19 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linus Torvalds has just released Linux 6.19 on the Linux Kernel Mailing List (LKML): No big surprises anywhere last week, so 6.19 is out as expected – just as the US prepares to come to a complete standstill later today watching the latest batch of televised commercials. The betting man would expect them all to be AI-generated, but maybe some enterprising company decides to buck the trend? Doubtful, but there’s always a slight chance. But for anybody outside the US, maybe taking the newest kernel out for a spin instead is an option? I have more than three dozen pull requests for when the merge window opens tomorrow – thank you to all the early maintainers. And as people have mostly figured out, I’m getting to the point where I’m being confused by large numbers (almost running out of fingers and toes again), so the next kernel is going to […]

February 4, 2026February 5, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Qualcomm IPQ5424 embedded router board supports 22 Gbps tri-band Wi-Fi 7 and dual 10GbE networking

Wallys Communications’ DR5424 is a new embedded router board powered by a Qualcomm IPQ5424 quad-core Cortex-A55 SoC (aka Dragonwing NPro A7 Platform) and offering tri-band Wi-Fi 7 connectivity up to around 22 Gbps, along with two 10 GbE RJ45 ports and four 2.5GbE RJ45 ports for wired networking. Based on Qualcomm AP.MI01.2 reference design, the board also features 4GB or 8GB DDR4 memory, 256MB NAND flash, and 32MB NOR flash, as well as a USB 3.0 port, a USB 2.0 port, and JTAG and serial debug ports. Target applications include Wi-Fi 7 (802.11be) access points, Internet of Things (IoT) gateways, and HD streaming and gaming. Qualcomm AP.MI01.2 specifications: SoC – Qualcomm IPQ5424 (Qualcomm Dragonwing NPro A7 Platform / NPA7) CPU – Quad-core Cortex-A55 “Marina” processor @ up to 1.5 GHz (Wallys) or 1.8 GHz (Qualcomm and Compex) Accelerator – Integrated accelerator designed for AI models specific to Wi-Fi and […]

January 26, 2026January 26, 2026 by Debashis Das - 1 Comment

Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

EXEC Q911 Qualcomm Solution COM HPC Mini Starter Kit

Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a Qualcomm Dragonwing IQ-9075 System-on-Chip (SoC), also known as the QCS9075, which delivers up to 200 TOPS of AI performance. The platform includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage, supports dual 2.5GbE, two 4-lane MIPI CSI-2 camera interfaces, DisplayPort 1.2 and eDP outputs, and multiple expansion options via M.2 (PCIe Gen4 x4/x2) slots. Designed for industrial applications, it operates in a wide -40°C to 85°C operating temperature range, accepts 9–36V DC input, integrates TPM 2.0 security, and offers various I/Os, USB 3.2 Gen 2, CAN FD, RS-232/422/485, GPIO, SPI, and I²C, with longevity guaranteed until 2038. Innodisk EXEC-Q911 specifications: Compute-on-Module – Innodisk EXMA-Q911 COM-HPC Mini module SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up […]

January 22, 2026January 22, 2026 by Debashis Das - No Comments

Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

MIO 5355 Qualcomm Dragonwing QCS6490 SBC

Advantech MIO-5355 is a 3.5-inch SBC based on Qualcomm QCS6490 or QCS5430 Edge AI processor. The board features up to 8GB of LPDDR5 memory, 128GB of UFS storage, and supports various operating systems, including Windows 11 IoT Enterprise, Ubuntu 24.04 LTS, and Yocto Linux. We have seen other QCS6490-based hardware in the past, such as the Radxa Dragon Q6A, the Quectel QSM560DR SBC, or the Rubik Pi 3, most of which come in compact form factors. The Advantech MIO-5355 takes a different approach, using a standard industrial 3.5-inch form factor (146 × 102 mm) and targeting industrial deployments with support for –20°C to 70°C operation and long-term availability. Advantech MIO-5355 specifications: SoC (one or the other) Qualcomm DragonWing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU […]