artificial intelligence News - Page 56 of 98 - CNX Software

January 31, 2021 by Jean-Luc Aufranc (CNXSoft) - 12 Comments

K210 AI Accelerator Raspberry Pi pHAT targets secure AIoT projects (Crowdfunding)

Kendryte K210 is a dual-core RISC-V AI processor that was launched in 2018 and found in several smart audio and computer vision solutions. We previously wrote a Getting Started Guide for Grove AI HAT for Raspberry Pi using Arduino and MicroPython, and XaLogic XAPIZ3500 offered an even more compact K210 solution as a Raspberry pi pHAT with Raspberry Pi Zero form factor. The company is now back with another revision of the board called “XaLogic K210 AI accelerator” designed to work with Raspberry Pi Zero and larger boards with the 40-pin connector. K210 AI Accelerator board specifications: SoC – Kendryte K210 dual-core 64-bit RISC-V processor @ 400 MHz with 8MB on-chip RAM, various low-power AI accelerators delivering up to 0.5 TOPS, Host Interface – 40-pin Raspberry Pi header using: SPI @ 40 MHz via Lattice iCE40 FPGA I2C, UART, JTAG, GPIOs signals Security Infineon Trust-M cloud security chip 128-bit AES […]

January 30, 2021September 15, 2021 by Jean-Luc Aufranc (CNXSoft) - 19 Comments

Snapdragon 888 Mobile Hardware Development Kit ships with 12GB RAM, 256GB UFS storage

Snapdragon 888 is the latest premium mobile SoC from Qualcomm with the octa-core processor combining one Cortex-X1 core, three Cortex-A78 cores, and four low-power Cortex-A55 cores, with Adreno 660 GPU and Snapdragon X60 5G modem. The processor will likely most be found in smartphones, but Qualcomm partnered with Lantronix to launch the Snapdragon 888 Mobile Hardware Development Kit designed for Android app developers, hardware vendors, and original equipment manufacturers (OEMs). Snapdragon 888 development board specifications: SoC – Qualcomm Snapdragon 888 (SM8350) octa-core Qualcomm Kryo 680 CPU with 1x Cortex-X1 core @ 2.84 GHz, 3x Cortex-A78 cores @ 2.42 GHz, and 4x Cortex-A55 cores @ 1.80 GHz, Adreno 660 GPU with support for OpenCL 2.0 FP, OpenGL ES 3.2, Vulkan 1.1, DX12, and up to 8K 360 VR video playback, Hexagon 780 DSP System Memory – 12GB LPDDR5 PoP memory Storage – 256GB UFS 3.0 flash, 1x MicroSD/UFS card Display HDMI […]

January 28, 2021January 29, 2021 by Jean-Luc Aufranc (CNXSoft) - 20 Comments

Cluster Server R2 2U rack cluster server ships with up to 72 Rockchip RK3399/RK3328 SoMs

Rockchip RK3399 and RK3328 are typically used in Chromebooks, single board computers, TV boxes, and all sort of AIoT devices, but if you ever wanted to create a cluster based on those processor, Firefly Cluster Server R2 leverages the company’s RK3399, RK3328, or even RK1808 NPU SoM to bring 72 modules to a 2U rack cluster server enclosure, for a total of up to 432 Arm Cortex-A72/A53 cores, 288 GB RAM, and two 3.5-inch hard drives. Firefly Cluster Server R2 specifications: Supported Modules Core-3399-JD4 with Rockchip RK3399 hexa-core Cortex-A72/A53 processor up to 1.5 GHz, up to 4GB RAM, and optional on-board 2.8 TOPS NPU (Gyrfalcon Lightspeeur SPR5801S) Core-3328-JD4 with Rockchip RK3328 quad-core Cortex-A53 processor up to 1.5 GHz, up to 4GB RAM Core-1808-JD4 with Rockchip RK1808 dual-core Cortex-A35 processor @ 1.6 GHz with integrated 3.0 TOPS NPU, up to 4GB RAM Configuration – Up to 9x blade nodes with 8x […]

January 28, 2021May 13, 2021 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Arduino Portenta H7 Gets Embedded Vision Shield with Ethernet or LoRa Connectivity

[Update January 28, 2021: The LoRa version of Portenta Vision Shield is now available] Announced last January at CES 2020, Arduino Portenta H7 is the first board part industrial-grade “Arduino Pro” Portenta family. The Arduino MKR-sized MCU board has plenty of processing power thanks to STMicro STM32H7 dual-core Arm Cortex-M7/M4 microcontroller. It was launched with a baseboard providing access to all I/Os and ports like Ethernet, USB, CAN bus, mPCIe socket (USB), etc… But as AI moves to the very edge, it makes perfect sense for Arduino to launch Portenta Vision Shield with a low-power camera, two microphones, and a choice of wired (Ethernet) or wireless (LoRA) connectivity for machine learning applications. Portenta Vision Shield key features and specifications: Storage – MicroSD card socket Camera – Himax HM-01B0 camera module with 324 x 324 active pixel resolution with support for QVGA Image sensor – High sensitivity 3.6μ BrightSense pixel technology […]

January 26, 2021January 26, 2021 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Rockchip RV1109 SBC’s provide access control solutions with optional 4G LTE connectivity

We’ve been writing about Rockchip RV1109 and RV1126 AI camera SoC’s in recent days, as well as evaluation boards and modules, plus some complete solutions such as Firefly dual-lens AI camera modules. Shenzhen-based JWIPC, a company specifically in embedded PCs and motherboards, has designed three SBC’s powered by Rockchip RV1109 processor especially designed for access control, leverage the face detection capabilities of the Rockchip processor. The three access control boards are: R19S – Standard 100x72mm Pico-ITX board with industrial grade materials, support for wide temperature, hardware watchdog, and “rich peripheral interface”. R19F- Same as R19S, but with a mini PCIe socket for a 4G LTE module, plus a SIM card slot R19N – Similar to R19S with a narrower 100x60mm design JWIPC R19 boards share most of the same hardware key features and specifications: SoC – Rockchip RV1109 dual-core Arm Cortex-A7 @ 1.5 GHz, plus RISC-V MCU @ 400 MHz, […]

January 25, 2021January 25, 2021 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Firefly dual-lens AI camera module comes with Rockchip RV1109 or RV1126 processor

We’ve very recently written about Rockchip RV1126 quad-core Cortex-A7 processor designed AI cameras thanks to a 2.0 TOPS AI accelerator together with its little dual-core brother: RV1109. We’ve also found some RV1109 and RV1126 evaluation boards, but prices were in the hundreds of dollars. It was then brought to our attention than the upcoming MAIX-III board would feature RV1126 at a more affordable cost, but it turns out there’s no need to wait as Firefly has just launched a dual-lens AI camera module based on either Rockchip RV1109 or RV1126 for under $100 with respectively CAM-C1109S2U and CAM-C1126S2U models. Both version of the modules have the same specifications except for the processor: SoC (one or the other) RV1109 SoC with CPU – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU – 1.2 TOPS with support for INT8/ INT16 VPU Encoder […]

January 22, 2021 by Jean-Luc Aufranc (CNXSoft) - 19 Comments

Rockchip RV1126 AI Camera SoC features 2.0 TOPS NPU, promises 250ms fast boot

The Rockchip Developer Conference that took place at the end of November 2020 allowed us to learn more about RK3588, RK3566, and RK3568 64-bit Arm processors for AIoT applications. But the company also presented additional details about camera SoC’s, namely the dual-core RV1109 and quad-core RV1126, equipped with a 1.2 TOPS and 2.0 TOPS respectively, and both capable of delivering a 250ms fast boot. Rockchip RV1109 and RV1126 share many of the same specifications: CPU RV1109 – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz RV1126 – Quad-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU RV1109 – 1.2 TOPS with support for INT8/ INT16 RV1126 – 2.0 TOPS with support for INT8/ INT16 Memory – 32-bit DDR3/DDR3L/LPDDR2/LPDDR3/DDR4/LPDDR4 up to 4GB RAM Storage – eMMC 4.51, Serial SPI NOR Flash or NAND flash with fast booting support, […]

January 22, 2021June 22, 2022 by Abhishek Jadhav - No Comments

Zora P1 Amlogic A311D Development Board interfaces with Orbbec 3D Cameras

We have already seen the powerful Amlogic A311D powered Khadas VIM3 SBC, and Orbbec announced the Zora P1 development board for Orbbec 3D cameras, supporting robotics, gaming, smart homes, etc. Some of the other products showcased at the CES 2021 by Orbbec include its first 3D sensor with time-of-flight (TOF) technology, the latest Astra+ camera, and a real-time industrial 3D camera. “Innovations in 3D imaging, combined with broader advances like 5G, artificial intelligence, and ultra-fast processors, are transforming the application landscape for designers and engineers,” said David Chen, co-founder, and director of engineering at Orbbec. “Our new camera with time-of-flight (TOF) technology is a great example. Its high resolution and tracking capabilities make it perfect for all kinds of products including fall detection, security, even at-home yoga and exercise products.” Orbbec’s Zora P1 Development Board Zora P1 is a processing board for developers and enthusiasts to integrate 3D imaging and associated computing tasks for demanding industrial applications. Orbbec has specially designed this long-lasting solution to work with its 3D […]