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Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Silicon Labs BG22E, MG22E, FG22E wireless MCUs target energy harvesting, battery-free IoT devices

Silicon Labs BG22E, MG22E, FG22E wireless MCUs target energy harvesting, battery-free IoT devices

BG22E MG22E FG22E energy harvesting wireless microcontroller

Silicon Labs xG22E is a family of wireless SoCs consisting of the BG22E, MG22E, and FG22E and designed to operate within an ultra-low power envelope required for battery-free, energy harvesting applications such as electronic shelf labels, Smart Home sensors, remote controls, and so on. Like the just-announced Silicon Labs MG26, BG26, and PG26, the new xG22E family features a Cortex-M33 core clocked up to 76.8MHz. As an evolution of the low-power BG22, the BG22E offers Bluetooth 5.4 LE connectivity with “Energy Conservation” to further enhance battery longevity and even support designs that eliminate the need for batteries. The MG22E is similar but embeds an 802.15.4 radio for Zigbee connectivity, and the FG22E provides a 2.4GHz proprietary plus the Cortex-M33 is clocked up to 38.4MHz. Silicon Labs BG22E, MG22E, FG22E specifications: MCU – Arm Cortex-M33 @ 76.8 MHz with DSP and FPU (38.4 MHz for FG22E) Memory – Up to 32 […]

Posted on by Debashis Das - 4 Comments on $4.99 ESP32-S3-Tiny board measures just 23.50 x 18 mm

$4.99 ESP32-S3-Tiny board measures just 23.50 x 18 mm

waveshare esp32 s3 tiny kit a mini development board

Waveshare has recently released the ESP32-S3-Tiny mini development board powered by ESP32-S3 wireless MCU and measuring just 23.50 x 18 mm. Due to its compact form factor, it does not include a USB-to-UART converter or a USB port. That is why, you will need an additional adapter board with an FPC cable to program it, which costs only $1. Despite its small size, the board is feature-rich. It includes 34 multi-function GPIO pins, along with Wi-Fi, BLE, SPI, I2C, UART, ADC, PWM, and more. The design of the board is very similar to the Raspberry Pi RP2040-powered Waveshare RP2040-Tiny board that we covered last year. However, what sets this board apart is its 34 I/O pins, compared to the 23 found on the RP2040-Tiny board, and wireless connectivity. We’ve also written about several other boards with compact form factors, such as the Unexpected Maker NANOS3 board (28 x 11 mm), […]

Posted on by Debashis Das - 12 Comments on Unexpected Maker NANOS3 might be the world’s tiniest ESP32-S3 module, yet fully-featured

Unexpected Maker NANOS3 might be the world’s tiniest ESP32-S3 module, yet fully-featured

Unexpected Maker NANOS3 A ESP32 S3 Powred Dev Board

Seon Rozenblum, better known as Unexpected Maker, has launched NANOS3  a development board that claims to be the world’s smallest, fully-featured ESP32-S3 module! This new module packs all the peripherals, and wireless connectivity features of an ESP32-S3 while being even smaller than the TinyPICO Nano. The module features two variants one with an onboard 3D antenna and the other with an u.FL connector. Previously we have written about TinyS3, FeatherS3, and ProS3 boards from Unexpected Maker we have also covered many unique ESP32-S3 boards like the ESP32-S3 PowerFeather Board with solar input, the Waveshare ESP32-S3-Relay-6CH, the ESP32-S3 4G dev boards and more feel free to check those out if you are interested in ESP32 boards with advanced features. Unexpected Maker NANOS3 Specifications ESP32-S3-WROOM-1-N8R2 MCU – ESP32-S3 dual-core Tensilica LX7 up to 240 MHz with 512KB SRAM, 16 KB RTC SRAM Memory – 2MB QSPI PSRAM Storage – 8MB QSPI flash Wireless – […]

Posted on by Debashis Das - 6 Comments on unPhone – An ESP32-S3 IoT development platform with LoRaWAN, touchscreen, open-source ecosystem

unPhone – An ESP32-S3 IoT development platform with LoRaWAN, touchscreen, open-source ecosystem

unPhone All in one LoRa, WiFi and BT dev device with touchscreen and LiPo battery

Pimoroni, in partnership with the University of Sheffield, introduced the unPhone – an open-source non-cellular IoT development platform built around the ESP32-S3 wireless microcontroller. The unPhone isn’t meant to replace phones but can simplify tasks and give you more control over your data. In addition to the ESP32-S3, it features a 3.5″ 320×480 touchscreen display, LoRaWAN, Wi-Fi, Bluetooth, a vibration motor, an accelerometer, and various other features. Designed with these capabilities, this module can be used for teaching and rapid prototyping, while also finding applications in aquaponics. unPhone key features and components Wireless module – ESP32-S3-WROOM-1U-N8 MCU – ESP32-S3 dual-core Tensilica LX7 up to 240 MHz with 512KB SRAM and 8MB PSRAM Storage – 8MB Quad SPI flash Wireless – 2.4 GHz WiFi 4 and Bluetooth LE 5 Hardware Features LCD touchscreen for debugging and UI creation. LoRaWAN for free radio communication Vibration motor for notifications. IR LEDs for remote control. […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 12 Comments on ESP32-H4 low-power dual-core RISC-V SoC supports 802.15.4 and Bluetooth 5.4 LE

ESP32-H4 low-power dual-core RISC-V SoC supports 802.15.4 and Bluetooth 5.4 LE

ESP32-H4 block diagram

Espressif Systems has formally announced the ESP32-H4 low-power dual-core 32-bit RISC-V wireless microcontroller with support for 802.15.4 and Bluetooth 5.4 LE portfolio after having unveiled it at CES 2024. It’s the first Espressif chip to support Bluetooth 5.4 LE with previous models such as ESP32-H2 or ESP32-C6 only supporting Bluetooth 5.0/5.2. Besides BLE 5.4 support, the new ESP32-H4 dual-core RISC-V WiSoC is an evolution of the ESP32-H2 single-core chip with PSRAM support (up to 4MB built-in), additional GPIOs (36 vs 24), touch sensing GPIOs, and some extra security features such as a power glitch detector also found in the recently announced ESP32-C61. ESP32-H4 specifications: CPU – Dual-core 32-bit RISC-V core (at up to 96 MHz) RAM – 320KB KB SRAM, optional PSRAM up to 4MB Storage – 128KB ROM, External flash support Wireless connectivity IEEE 802.15.4 radio with Zigbee and Thread support, Matter protocol Bluetooth 5.4 (LE) radio designed in-house, […]

Posted on by Debashis Das - 5 Comments on 8devices TobuFi SoM is designed for drones, robotics, and advanced audio systems

8devices TobuFi SoM is designed for drones, robotics, and advanced audio systems

8devices TobuFi SoM

8devices has recently introduced TobuFi, a Qualcomm QCS405-powered System-on-Module (SoM) featuring dual-band Wi-Fi 6 and Wi-Fi 5 capabilities. The device also features 1GB LPDDR3, 8GB of eMMC storage, and multiple display resolutions. It also offers various interfaces, including USB 3.0, HDMI, I2S, DMIC, SDC, UART, SPI, I2C, and GPIO. In previous posts, we covered 8devices product launches like the Noni M.2 WiFi 7 module, Rambutan and Rambutan-I modules, Habanero IPQ4019 SoM, Mango-DVK OpenWrt Devkit, and many more innovative products. If you’re interested in 8devices, feel free to check those out for more details. 8devices TobuFi SoM specifications: SoC – Qualcomm QCS405 CPU – Quad-core Arm Cortex-A53 at 1.4GHz; 64-bit GPU – Qualcomm Adreno 306 GPU at 600MHz; supports 64-bit addressing DSP – Qualcomm Hexagon QDSP6 v66 with Low Power Island and Voice accelerators Memory – 1GB LPDDR3 + 8GB eMMC Storage 8GB eMMC flash SD card – One 8-bit (SDC1, 1.8V) and one […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on SparkFun Thing Plus – RA6M5 board supports Bluetooth 5.1 LE through Renesas DA14531MOD module

SparkFun Thing Plus – RA6M5 board supports Bluetooth 5.1 LE through Renesas DA14531MOD module

Sparkfun Thing Plus - RA6M5

SparkFun Thing Plus – RA6M5 is a small MCU board based on a 200 MHz Renesas RA6M5 Cortex-M33 microcontroller and a Renesas DA14531MOD Bluetooth 5.1 LE module that follows Adafruit Feather/Sparkfun Thing Plus form factor. The module can transmit data over BLE with just 4mA (at 3.3V) power consumption and the company claims the board to be powered by a coin-cell battery. A LiPo battery can also be connected to the board through a 2-pin JST battery connector, and the Things Plus – RA6M5 board also features a single-cell charger and LiPo fuel gauge. Sparkfun Thing Plus – RA6M5 specifications: Microcontroller – Renesas R7FA6M5AH3CFP Core – Arm Cortex-M33 microcontroller @ up to 200 MHz Memory – 512KB SRAM Storage – 2MB Flash Security – Arm TrustZone, and Secure Crypto Engine 9 Wireless – Renesas DA14531MOD module for Bluetooth 5.1 LE connectivity with support for CodeLess AT command Datapump Radio Transmit […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Silicon Labs MG26, BG26, and PG26 Cortex-M33 AI microcontrollers offer up to 3200KB flash, 512KB RAM, 64 GPIO’s

Silicon Labs MG26, BG26, and PG26 Cortex-M33 AI microcontrollers offer up to 3200KB flash, 512KB RAM, 64 GPIO’s

Silicon Labs MG26 BG26 P26 Cortex M33 microcontrollers

Silicon Labs has announced the xG26 family of Cortex-M33 wireless SoCs and MCUs that consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 general-purpose MCU without wireless connectivity, and features double the flash and RAM of the Silicon Labs xG24 devices. The xG26 family also comes with double the number of general-purpose input/output (GPIO) pins as the xG24 to enable engineers to build more complex devices in combination with the larger flash and memory reaching up to 3200 KB and 512KB respectively and also integrates a Matrix Vector Processor (MVP) for AI/ML hardware acceleration and Math functions. Silicon Labs MG26 and BG26 wireless SoCs MG26 and BG26 key features and specifications: MCU core – Arm Cortex-M33 @ 78 MHz AI/ML accelerator – Matrix Vector Processor that is 8x faster and 6x lower power than Cortex-M33 processing, and supports an MVP Math Library for non-ML workloads […]

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