edge ai

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on UP WCL – A credit card-sized Wildcat Lake SBC with up to 24GB LPDDR5, 256GB UFS

UP WCL – A credit card-sized Wildcat Lake SBC with up to 24GB LPDDR5, 256GB UFS

UP WCL Wildcat Lake SBC

AAEON’s UP WCL is an upcoming credit card-sized single board computer (SBC) powered by an Intel Wildcat Lake processor up to the Core 7 350 hexa-core CPU paired with up to 24GB LPDDR5 and 256GB UFS storage. The board also features an HDMI 2.1 video output, a 2.5GbE RJ45 jack, an M.2 Key-E socket for optional WiFi and Bluetooth connectivity, three USB 3.2 ports, and a few wafers for I/O expansion. AAEON UP WCL specifications: Wildcat Lake SoC (one or the other) Intel Core 3 304 5-core CPU – 1x P-cores @ 1.5/4.3 GHz (Turbo) + 4x LPE-cores @ 1.4/3.3 GHz (Turbo) GPU – 1-core Intel Xe3 Graphics @ 2.3 GHz (9 TOPS) NPU – 15 TOPS Intel Core 5 320 6-core CPU – 2x P-cores @ 1.5/4.6 GHz (Turbo) + 4x LPE-cores @ 1.4/3.4 GHz (Turbo) GPU – 2-core Intel Xe3 Graphics @ 2.5 GHz (20 TOPS) NPU – […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 13 Comments on Zhihe A210 octa-core RISC-V SoC with 12 TOPS NPU powers SoM-based development board

Zhihe A210 octa-core RISC-V SoC with 12 TOPS NPU powers SoM-based development board

Zhihe A210 block diagram

Last year, we noted three upcoming high-performance RISC-V SoCs to watch out for: Zhihe A210, SpacemiT K3, and UltraRISC UR-DP1000. The K3 has already been launched, and I’ll work on the K3-Pico-ITX SBC/mini PC review this coming weekend, while the UR-DP1000 is (still?) expected on the Milk-V Titan motherboard. However, we did not have that many details about the Zhihe A210 so far. This has now changed since documentation has surfaced for the Zhihe A210 and a development kit (A210 SODIMM V2) based on a carrier board and a system-on-module itself powered by the octa-core RISC-V processor. Let’s have a look at both. Zhihe A210 octa-core RISC-V SoC Zhihe A210 specifications: CPU  – Octa-core RISC-V RV64GCV processor 4x 64-bit RISC-V C920 cores @ up to 2.3 GHz with 64 KB I Cache and 64 KB D Cache for each core, 1 MB L2 cache; note: 1.9 GHz is also shown […]

Posted on by Debashis Das - 6 Comments on Amlogic A311Y3 octa-core Edge AI SoC features Cortex-A78/A55 cores, 8 TOPS NPU, LPDDR5 support

Amlogic A311Y3 octa-core Edge AI SoC features Cortex-A78/A55 cores, 8 TOPS NPU, LPDDR5 support

Amlogic A311Y3 Octa Core Edge AI SoC

Amlogic has introduced the A311Y3 Edge AI SoC, which seems to be an upgrade over earlier designs such as the A311D and A311D2 used in boards like the Khadas VIM3 and Khadas VIM4. Although not listed on the official Amlogic website, documentation from vendors such as Shenzhen Tomato Technology indicates that the A311Y3 SoC is built around a 6nm process node and features a newer CPU architecture based on Arm Cortex-A78/A55 cores. The SoC integrates an NPU with up to 8 TOPS of compute performance and supports LPDDR5/LPDDR5X memory, which can be used in both processing and Edge AI, compared to earlier A311-series chips. Amlogic A311Y3 specifications CPU 2x Arm Cortex-A78 cores (64KB L1 I-cache, 64KB L1 D-cache, 256KB L2 cache) 6x Arm Cortex-A55 cores (32KB L1 I-cache, 32KB L1 D-cache, 128KB L2 cache) with a shared 2MB L3 cache Neon and Crypto extensions included Co-processors – RISC-V core for system control processing; Built-in […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on ADLINK COM-HPC-mPTL COM-HPC Mini computer-on-module features up to 180 TOPS Intel Core Ultra Series 3 CPU

ADLINK COM-HPC-mPTL COM-HPC Mini computer-on-module features up to 180 TOPS Intel Core Ultra Series 3 CPU

COM-HPC Mini module based on Intel Core Ultra Series 3 Panther Lake

ADLINK COM-HPC-mPTL is a COM-HPC R1.3 Mini computer-on-module powered by the Intel Core Ultra Processor Series 3 “Panther Lake” family, up to the 180 TOPS 16-core Core Ultra X7 358H processor. The module supports up to 64GB LPDDR5x and optional NVMe SSD BGA storage, and features two 2.5GbE controllers, optional MIPI CSI camera connectors,  and a 40-pin  debug connector. All I/Os are exposed through a standard 400-pin high-density board-to-board connector, including four display interfaces (HDMI, DP, USB4, eDP), and up to 16x PCIe Gen4/Gen5 lanes. COM-HPC-mPTL specifications: SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other) Intel Core Ultra 5 325 8-core (4P+0E+4LPE) processor up to 2.1 GHz / 4.5 GHz (Turbo) with 12MB cache, 4-core Xe3 graphics (40 TOPS), 47 TOPS NPU; PBP: 25W Intel Core Ultra 7 356H 16-core (4P+8E+4LPE) processor up to 1.9 GHz / 4.7 GHz (Turbo) with 18MB cache, 4-core […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Gateworks Catalina GW9200 NXP i.MX 95 SBC features Flexible Socket Adapter sockets for M.2 or mPCIe modules

Gateworks Catalina GW9200 NXP i.MX 95 SBC features Flexible Socket Adapter sockets for M.2 or mPCIe modules

Gateworks Catalina GW6200 SBC

Last March, Gateworks introduced the Catalina SBC family, starting with the GW9200 board, based on NXP i.MX 95 SoC for industrial Edge AI applications, and featuring Flexible Socket Adapter (FSA) sockets to accommodate either mini PCIe or M.2 module adapters, depending on requirements. We missed the original announcement, but the new SBC family was brought to our attention when Ezurio announced the acquisition of Gateworks last week. The GW9200 board comprises a system-on-module with the NXP i.MX 95 chip, 4GB LPDDR5 and 8GB eMMC flash by default, as well as a carrier board with 10GbE and GbE RJ45 ports, a MIPI DSI/CSI display/camera interface, two FSA sockets for M.2 or mini PCIe expansion, and a range of I/Os. Ezurio/Gateworks Catalina GW9200 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 […]

Posted on by Debashis Das - 3 Comments on $7.99 Seeed Studio Wio-S3 WiFi, Bluetooth LE, and LoRa IoT module combines ESP32-S3 and SX1262 RF transceiver

$7.99 Seeed Studio Wio-S3 WiFi, Bluetooth LE, and LoRa IoT module combines ESP32-S3 and SX1262 RF transceiver

Seeed Studio Wio S3 IoT module

Seeed Studio Wio-S3 is a compact (21.6 x 16.5 x 3.3 mm) wireless module that combines an ESP32-S3R8 dual-core WiFi 4 and Bluetooth LE MCU and a Semtech SX1262 LoRa transceiver. The module includes 16MB Flash and 8MB PSRAM, and supports LoRa (EU868/US915) with up to +20.9 dBm transmit power and -137 dBm sensitivity. It also supports Wi-Fi 4 and BLE 5.0, and comes with two IPEX connectors for external antennas. With interfaces such as UART, I2C, SPI, ADC, and USB, and support for -40°C to 85°C operation, it is designed for remote monitoring, industrial automation, smart agriculture, and IoT data logging. Seeed Studio Wio-S3 module specifications: SoC – Espressif ESP32-S3R8 CPU – Dual-core Tensilica LX7 microcontroller up to 240 MHz with vector instructions for AI acceleration Memory – 8MB PSRAM Wireless – 2.4 GHz 802.11b/g/n WiFi 4 and Bluetooth 5.0 LE + Mesh connectivity Storage – 16MB external SPI flash […]

Posted on by Debashis Das - 1 Comment on Synaptics Astra SRW1500 Cortex-M52 Edge AI MCU features Ethos-U55 NPU, Wi-Fi 6/7, Bluetooth 6.0, 802.15.4 connectivity

Synaptics Astra SRW1500 Cortex-M52 Edge AI MCU features Ethos-U55 NPU, Wi-Fi 6/7, Bluetooth 6.0, 802.15.4 connectivity

Synaptics SRW1500 Series AI MCU

Synaptics has introduced the Astra SRW1500 Series of AI-native Edge AI MCUs designed for smart IoT edge devices. The family features an Arm Cortex-M52 core, an optional Arm Ethos-U55 Neural Processing Unit (NPU), and tri-band Wi-Fi 7 or Wi-Fi 6, Bluetooth 6.0 LE, and 802.15.4 connectivity, in a single package. It targets low-latency on-device AI workloads such as voice-trigger detection, sound-event classification, and AI-enhanced Wi-Fi sensing. The series currently comes in four variants offering different wireless and USB options. Since sensing, AI processing, and wireless connectivity are integrated into a single chip, this approach helps reduce system costs, simplify PCB design, and lower power consumption in devices such as smart home hubs, building automation systems, and home appliances. Synaptics SRW1500 Series specifications: CPU Arm Cortex-M52 application core up to 200 MHz with Arm Helium (MVE) vector extensions for DSP and ML Arm Cortex-R4 WiFi core with 960 KB SRAM and 1408 […]

Posted on by Debashis Das - No Comments on Qualcomm Dragonwing Mobile Broadband Multimedia (MBM) MBM715 and MBM 415 SoCs combine 5G, Wi-Fi, multimedia, and Edge AI

Qualcomm Dragonwing Mobile Broadband Multimedia (MBM) MBM715 and MBM 415 SoCs combine 5G, Wi-Fi, multimedia, and Edge AI

Qualcomm Dragonwing MBM715 & MBM415 Mobile Broadband Multimedia SoC

Qualcomm has introduced the Dragonwing Mobile Broadband Multimedia (MBM) family, a new lineup of 4-nm SoCs that integrate 5G connectivity, Wi-Fi, multimedia processing, and on-device AI into a single platform for “interactive broadband” devices. The family currently features the top-tier Dragonwing MBM715 and the lower-cost Dragonwing MBM415, designed for smart displays, retail kiosks, service terminals, and other connected devices that require both high-speed connectivity and local processing. Unlike mobile broadband (MBB) or fixed wireless access (FWA) platforms, the MBM series combines connectivity, display, camera, and AI into one chip, so no separate processor is needed. Qualcomm Dragonwing MBM715 & MBM415 Specifications: The MBM415 has no dedicated on-device Generative AI engine, but Qualcomm officially brands the MBM415’s modem-side processing as “Qualcomm AI-Enhanced Signal Boost.” It is not for generative AI, but it is an AI feature listed in the specs. Also note that the MBM715 supports CBRS (3.5 GHz), which is […]

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