Linux 5.17 release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 5.17 changelog

Linus Torvalds has just released Linux 5.17: So we had an extra week of at the end of this release cycle, and I’m happy to report that it was very calm indeed. We could probably have skipped it with not a lot of downside, but we did get a few last-minute reverts and fixes in and avoid some brown-paper bugs that would otherwise have been stable fodder, so it’s all good. And that calm last week can very much be seen from the appended shortlog – there really aren’t a lot of commits in here, and it’s all pretty small. Most of it is in drivers (net, usb, drm), with some core networking, and some tooling updates too. It really is small enough that you can just scroll through the details below, and the one-liner summaries will give a good flavor of what happened last week. Of course, this means […]

MediaTek Dimensity 8000/8100 Cortex-A78/A55 processor to power premium 5G smartphones

MediaTek Dimensity 8000 & 8100

MediaTek Dimensity 8000/8100 Arm Cortex-A78 processors for 5G premium smartphones bring many of the features of the flagship Dimensity 9000 Armv9 processor announced last December, but at a more affordable price point. Designed for gamers, the Dimensity 8100 integrates four Arm Cortex-A78 cores with speeds reaching 2.85GHz instead of 2.75GHz for the Dimenssity 8000, and boosts GPU and AI engine’s frequencies to 20% and 25% respectively. MediaTek Dimensity 8000/8100 specifications: Octa-core CPU subsystem 4x Arm Cortex-A78 up to 2.75 GHz (Dimensity 8000) / 2.85 GHz (Dimensity 8100) 4x Arm Cortex-A55 up to 2.0 GHz 4MB L3 cache GPU – Arm Mali-G610 MC6 GPU (Dimensity 8100 with 20% frequency boost) with MediaTek HyperEngine 5.0 gaming technologies AI Accelerator – 5th generation MediaTek APU 580  (Dimensity 8100 with 25% frequency boost) Memory I/IF – LPDDR5 6400 Mbps Storage I/F – UFS 3.1 Display Dimensity 8000 – 168Hz Full HD+ Dimensity 8100 – 120Hz […]

MediaTek Kompanio 1380 Cortex-A78/55 processor is designed for premium Chromebooks

MediaTek Kompanio 1380

MediaTek Kompanio 1380 is a 6nm octa-core Cortex-A78/A55 processor clocked at up to 3.0 GHz designed for premium Chromebooks such as the new Acer Chromebook Spin 513 (CP513-2H), which will compete against the company’s Snapdragon 7c based Chromebook Spin 513 (CP513-1H). The processor supports LPDDR4x memory, UFS and eMMC storage, up to three displays, for example, the main display plus two external HDMI displays, WiFI 6/6E, and offers high-performance interfaces such as PCIe Gen 3 and USB 3.2 Gen 1. MediaTek Kompanio 1380 (MT8195T) processor specifications: Octa-core CPU 4x Arm Cortex-A78 cores @ up to 3.0 GHz 4x Arm Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC5 AI accelerator – MediaTek APU 3.0 up to 4 TOPS VPU Video Playback – 4K HDR H.264, H.265 / HEVC, VP9, AV1 Video Encoding – 4K HDR H.264, H.265 / HEVC Memory – LPDDR4x @ 2133 MHz Storage – […]

WiFi 7 (802.11be) will support up to 40 Gbps links, real-time applications

Key features of WiFi 7 (802.11be)

I still don’t own a WiFi 6 router, but MediaTek has already started to demonstrate WiFi 7 (802.11be) to customers with solutions based on upcoming Filogic 802.11be processors which deliver “super-fast speeds and low latency transmission” and provide a “true wireline/Ethernet replacement for super high-bandwidth applications”. The company goes on to explain that Wi-Fi 7 relies on the same 2.4GHz, 5GHz, and 6GHz frequencies as WiFi 6/6E, but can still provide 2.4x higher speeds than Wi-Fi 6, even with the same number of antennas, since WiFi 7 can utilize 320Mhz channels and support 4K QAM (quadrature amplitude modulation) technology.   There’s limited information about MediaTek Filogic 802.11be WiFi 7 processors since it will take a few more years before becoming available, but we can find more details in a document entitled “Current Status and Directions of IEEE 802.11be, the Future Wi-Fi 7” from IEEE Xplore. Here are some of the […]

Dimensity 9000 – MediaTek’s 4nm, 3 GHz octa-core Armv9 processor for flagship 5G smartphones

MediaTek Dimensity 9000

MediaTek is the top mobile SoC vendor in terms of unit shipped, well ahead of the competition, but the company’s processors were mostly found in entry-level, mid-range, and “premium” smartphones, while flagship smartphones usually feature application processors from  Qualcomm, Samsung, or Apple. But MediaTek has upped the ante with the introduction of the Dimensity 9000 smartphone processor featuring an octa-core Armv9 CPU subsystem, including one Cortex-X2 core clocked at up to 3.05 GHz, a Mali-G710 MC10 GPU, 5G connectivity, and manufactured with the bleeding edge 4nm TSMC manufacturing process. Dimensity 9000 specifications: Octa-core CPU subsystem 1x Arm Cortex-X2 “Ultra Core” at 3.05 GHz 3x Arm Cortex-A710 “Super Cores” at up to 2.85 GHz 4x Arm Cortex-A510 “Efficiency Cores” up to 1.80GHz 8MB L3 cache GPU – Mali-G710 MC10 @ 850 MHz with support for Vulkan, (software) raytracing AI Accelerator – 5th generation APU (AI processing unit) with up to 4x […]

MediaTek unveils Filogic 830 & Filogic 630 WiFi 6/6E chips

MediaTek Filogic 830

MediaTek has recently introduced the Filogic connectivity family with two parts, namely the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC), and the Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. The WiFi 6/6E tri-band (2.4, 5, and 6 GHz) chips are Wi-Fi Alliance EasyMesh certified, and designed for home, business, and enterprise router and repeater devices, home automation bridges, IoT gateways, as well as consumer devices such as laptops, TVs, IP cameras, etc… The MediaTek Filogic 830 is a complete 12nm SoC with a quad-core Cortex-A53 processor clocked at up to 2 GHz per core delivering over 18,000 DMIPs, hardware acceleration engines for Wi-Fi offloading and networking, dual 4×4 Wi-Fi 6/6E for up to 6Gbps connectivity, two 2.5Gbps Ethernet interfaces, and various other peripheral interfaces, but MediaTek did not provide any details about those. The company also says the chip includes FastPath low latency technology for gaming and AR/VR applications. […]

MediaTek Kompanio 1300T processor is made for 5G tablets

Mediatek Kompanio 1300T 5G Tablet processor

MediaTek has launched several 5G mobile SoCs for smartphones in recent years, but with Kompanio 1300T Cortex-A78/A55 processor the company is targetting 5G tablets specifically. As we’ll see below MediaTek Kompanio 1300T specifications are quite similar to the ones for Dimensity 1100 processor, except for support for slightly higher resolution displays up to 2560×1600 @ 120 Hz or 2560×1440 @ 144Hz, instead of 2520 x 1080 @ 144Hz. MediaTek Kompanio 1300T processor specifications: Octa-core CPU 4x Arm Cortex-A78 cores 4x Arm Cortex-A55 cores GPU – Arm Mali-G77 MC9 AI accelerator – MediaTek APU 3.0 VPU Video Playback – H.264, H.265 / HEVC, VP-9, AV1 Video Encoding – H.264, H.265 / HEVC MediaTek HyperEngine 3.0 gaming technologies Memory – Up to 16GB LPDDR4x @ 2133 MHz Storage – UFS 3.1 Display – Up to 2560 x 1440 up to 144 Hz, 2560×1600 up to 120 Hz Camera Up to 32MP + […]

Intel 5G Solution 5000 5G M.2 module developed with MediaTek, Fibocom

Fibocom FM350-GL

Qualcomm very recently unveiled Snapdragon X65 and X62 5G M.2 card reference designs to help OEM’s develop their own 5G modules for integration into PC’s and CPE’s. But as one should have expected, more options are coming, and Intel have now announced their own “5G Solution 5000” 5G M.2 card for laptops at Computex 2021 in collaboration with MediaTek and Fibocom. Fibocom FM350-GL (Intel 5G Solution 5000) specifications: Modem technologies – 5G NR, 4G LTE, 3D WCDMA Frequency bands – Sub 6GHz for global coverage Data throughput 5G NR – Up to 4.7 Gbps downlink; up to 1.25 Gbps uplink 4G LTE – Up to 1.6 Gbps Cat 19downlink; up to 150 Mbps uplink Built-in eSIM Host interface – PCIe Gen 3 Dimensions – 30 x 52  x2.3 mm (M.2 card) Temperature Range – -10 to +55°C The 5G module targets platforms built upon Intel Tiger Lake and Alder Lake […]

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