Dimensity 9000 – MediaTek’s 4nm, 3 GHz octa-core Armv9 processor for flagship 5G smartphones

MediaTek Dimensity 9000

MediaTek is the top mobile SoC vendor in terms of unit shipped, well ahead of the competition, but the company’s processors were mostly found in entry-level, mid-range, and “premium” smartphones, while flagship smartphones usually feature application processors from  Qualcomm, Samsung, or Apple. But MediaTek has upped the ante with the introduction of the Dimensity 9000 smartphone processor featuring an octa-core Armv9 CPU subsystem, including one Cortex-X2 core clocked at up to 3.05 GHz, a Mali-G710 MC10 GPU, 5G connectivity, and manufactured with the bleeding edge 4nm TSMC manufacturing process. Dimensity 9000 specifications: Octa-core CPU subsystem 1x Arm Cortex-X2 “Ultra Core” at 3.05 GHz 3x Arm Cortex-A710 “Super Cores” at up to 2.85 GHz 4x Arm Cortex-A510 “Efficiency Cores” up to 1.80GHz 8MB L3 cache GPU – Mali-G710 MC10 @ 850 MHz with support for Vulkan, (software) raytracing AI Accelerator – 5th generation APU (AI processing unit) with up to 4x […]

MediaTek unveils Filogic 830 & Filogic 630 WiFi 6/6E chips

MediaTek Filogic 830

MediaTek has recently introduced the Filogic connectivity family with two parts, namely the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC), and the Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. The WiFi 6/6E tri-band (2.4, 5, and 6 GHz) chips are Wi-Fi Alliance EasyMesh certified, and designed for home, business, and enterprise router and repeater devices, home automation bridges, IoT gateways, as well as consumer devices such as laptops, TVs, IP cameras, etc… The MediaTek Filogic 830 is a complete 12nm SoC with a quad-core Cortex-A53 processor clocked at up to 2 GHz per core delivering over 18,000 DMIPs, hardware acceleration engines for Wi-Fi offloading and networking, dual 4×4 Wi-Fi 6/6E for up to 6Gbps connectivity, two 2.5Gbps Ethernet interfaces, and various other peripheral interfaces, but MediaTek did not provide any details about those. The company also says the chip includes FastPath low latency technology for gaming and AR/VR applications. […]

MediaTek Kompanio 1300T processor is made for 5G tablets

Mediatek Kompanio 1300T 5G Tablet processor

MediaTek has launched several 5G mobile SoCs for smartphones in recent years, but with Kompanio 1300T Cortex-A78/A55 processor the company is targetting 5G tablets specifically. As we’ll see below MediaTek Kompanio 1300T specifications are quite similar to the ones for Dimensity 1100 processor, except for support for slightly higher resolution displays up to 2560×1600 @ 120 Hz or 2560×1440 @ 144Hz, instead of 2520 x 1080 @ 144Hz. MediaTek Kompanio 1300T processor specifications: Octa-core CPU 4x Arm Cortex-A78 cores 4x Arm Cortex-A55 cores GPU – Arm Mali-G77 MC9 AI accelerator – MediaTek APU 3.0 VPU Video Playback – H.264, H.265 / HEVC, VP-9, AV1 Video Encoding – H.264, H.265 / HEVC MediaTek HyperEngine 3.0 gaming technologies Memory – Up to 16GB LPDDR4x @ 2133 MHz Storage – UFS 3.1 Display – Up to 2560 x 1440 up to 144 Hz, 2560×1600 up to 120 Hz Camera Up to 32MP + […]

Intel 5G Solution 5000 5G M.2 module developed with MediaTek, Fibocom

Fibocom FM350-GL

Qualcomm very recently unveiled Snapdragon X65 and X62 5G M.2 card reference designs to help OEM’s develop their own 5G modules for integration into PC’s and CPE’s. But as one should have expected, more options are coming, and Intel have now announced their own “5G Solution 5000” 5G M.2 card for laptops at Computex 2021 in collaboration with MediaTek and Fibocom. Fibocom FM350-GL (Intel 5G Solution 5000) specifications: Modem technologies – 5G NR, 4G LTE, 3D WCDMA Frequency bands – Sub 6GHz for global coverage Data throughput 5G NR – Up to 4.7 Gbps downlink; up to 1.25 Gbps uplink 4G LTE – Up to 1.6 Gbps Cat 19downlink; up to 150 Mbps uplink Built-in eSIM Host interface – PCIe Gen 3 Dimensions – 30 x 52  x2.3 mm (M.2 card) Temperature Range – -10 to +55°C The 5G module targets platforms built upon Intel Tiger Lake and Alder Lake […]

MediaTek Dimensity 900 6nm SoC brings UFS 3.1, LPDDR5 to mid-range 5G smartphones

Mediatek Dimensity 900

Arm Cortex-A78 and LPDDR5 would have been premium features not so long ago, but time flies, and the just-announced MediaTek Dimensity 900 5G SoC for mid-range smartphones includes two Cortex-A78 cores, six Cortex-A55 cores, support for LPDRR5/4 memory, UFS 3.1 storage, and of course 5G cellular connectivity up to 2.77Gbps. The mobile processor’s multimedia capabilities are pretty good as well with support for displays up to 2520 x 1080 resolution at 120 Hz, up to 108MP camera, 4Kp30 video with H.265, H.264, AV1, as well as an Arm Mali-G68 MC4 GPU and third-generation APU 3.0 AI accelerator. MediaTek Dimensity 900 specifications: CPU – Octa-core DynamIQ processor with 2x Arm Cortex-A78 @ Up to 2.4GHz, 6x Arm Cortex-A55 @ Up to 2GHz GPU – Arm Mali-G68 MC4 AI Accelerator – MediaTek APU 3.0 VPU Video Encoding – H.264, H.265 / HEVC up to 4K @ 30FPS Video Playback – H.264, H.265 […]

MediaTek Dimensity 1100 and 1200 5G mobile SoC’s reach up to 3GHz

Mediatek Dimensity MT1100 & MT1200

MediaTek has just unveiled not one, but two premium 5G SoC’s with Dimensity 1100 and Dimensity 1200 octa-core processors with the latter including an “Ultra” Arm Cortex-A78 clocked at up to 3GHz. Both chipsets are manufactured on TSMC’s advanced 6nm process technology, offer 5G connectivity up to 4.7Gbps download speed, and improvement in terms of performance, and camera compared to the earlier Dimensity 1000+ processor. MediaTek Dimensity 1100 and Dimensity 1200 share many of the same specifications: CPU DImensity 1100 4x Arm Cortex-A78 @ up to 2.6GHz 4x Arm Cortex-A55 @ up to 2GHz DImensity 1200 1x ultra-core Arm Cortex-A78 @ up to 3GHz 3x Arm Cortex-A78 cores 4x Arm Cortex-A55 cores @ up to 2GHz GPU – Arm Mali-G77 MC9 AI accelerator – Six-core MediaTek APU 3.0 VPU Video Playback – H.264, H.265 / HEVC, VP-9, AV1 Video Encoding – H.264, H.265 / HEVC Memory – Up to 16GB […]

Pumpkin i500 SBC uses MediaTek i500 AIoT SoC for computer vision and AI Edge computing

Pumpkin i500 SBC

MediaTek Rich IoT SDK v20.0 was released at the beginning of the year together with the announcement of Pumpkin i500 SBC with very few details except it would be powered by MediaTek i500 octa-core Cortex-A73/A55 processor and designed to support computer vision and AI Edge Computing. Pumpkin i500 hardware evaluation kit was initially scheduled to launch in February 2020, but it took much longer, and Seeed Studio has only just listed the board for $299.00. We also now know the full specifications for Pumpkin i500 SBC: SoC – MediaTek i500 octa-core processor with four Arm Cortex-A73 cores at up to 2.0 GHz and four Cortex-A53 cores, an Arm Mali-G72 MP3 GPU, and dual-core Tensilica Vision P6 DSP/AI accelerator @ 525 MHz System Memory – 2GB LPDDR4 Storage – 16GB eMMC flash Display – 4-lane MIPI DSI connector Camera – Up to 25MP via MIPI CSI connector Video Decoding – 1080p60 […]

MediaTek unveils Dimensity 700 5G processor, MT8192 & MT8195 SoCs for Chromebooks

Mediatek Dimensity 700

MediaTek announced three new 6nm and 7nm processors yesterday with Dimensity 700 5G processor for mainstream 5G mobile phones, and MT8192 & MT8195 SoCs for Chromebooks. MediaTek Dimensity 700 Key features and specifications with highlights showing differences against Dimensity 720: Octa-core Processor – 2x Arm Cortex-A76 @ up to 2.2 GHz, and 6x Arm Cortex-A55 @ up to 2GHz GPU – Arm Mali-G57 MC2 @ up to 950 MHz AI Accelerator – MediaTek APU System Memory – Up to 12GB LPDDR4x up to 2133MHz Storage – UFS 2.2 Display – Up to 2520 x 1080 resolution with 90Hz max refresh rate Camera ISP up to 16MP+16MP @ 30 fps dual camera, or 64MP @ 22 fps single camera Video Capture Resolution up to 3840 x 2160 Features – HDR-ISP, Multi-Frame NR, 3D Noise Reduction, Depth Engine, Warping Engine, AI-FD Video Encoding – H.264, H.265 / HEVC up to 2Kp30 Playback – […]