mwc 2026 News - CNX Software - Embedded Systems News

March 4, 2026 by Debashis Das - No Comments

Upgraded FGH200M Wi-Fi HaLow module features Morse Micro MM8108 SoC, handles up to 8,191 IoT devices

Introduced at MWC 2026, Quectel FGH200M Wi-Fi HaLow module, based on Morse Micro MM8108 SoC, is an upgraded version of the previous MM6108-based FGH100M module designed for long-range, low-power IoT connectivity. It operates in the sub-1-GHz band (850–950 MHz), with a range of up to 1 km, and is designed for applications such as smart homes, industrial automation, smart agriculture, smart cities, building automation, warehouses, campuses, and large-area IoT networks. The module operates on 1/2/4/8 MHz channels, with a maximum physical data rate of 43.3 Mbps and a transmit power of 26 dBm, allowing a single access point to theoretically connect up to 8,191 IoT devices. It connects to the host through USB 2.0, SDIO 2.0, or SPI interfaces. The ultra-compact (11.0 × 10.0 × 2.0 mm) LGA package operates in industrial environments with a temperature range of –40°C to +85°C. Quectel FGH200M Specifications: SoC – Morse Micro MM8108 32-bit […]

March 3, 2026March 3, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Qualcomm Snapdragon Wear Elite wearable platform offers 5G RedCap, WiFi 6, Bluetooth 6.0, built-in AI accelerator

Qualcomm Snapdragon Wear Elite is described as the “world’s first Personal AI wearable platform”, and features an NPU for on-device AI delivering up to 12 TOPS of performance at low power, supporting 2B parameter models. It delivers up to 5x single-core CPU improvement and up to 7x faster GPU compared to the previous-generation Snapdragon W5+ Gen 2 Wearable Platform while offering up to 30% more battery life for multi-day battery life, thanks to a 3nm architecture. The new Snapdragon Wear Elite platform also supports fast charging with up to 50% charge in under 10 minutes. Snapdragon Wear Elite specifications: CPU – Up to 2.1 GHz GPU Qualcomm Adreno 3D GPU supporting OpenGL ES 3.2, Vulkan 1.2, and OpenCL 2.0 APIs 2.5D GPU co-processor clocked at up to 500 MHz ISP – Qualcomm Spectra AI accelerator – Qualcomm Hexagon NPU; up to 12 TOPS of AI performance; support for up tp 2B […]

March 3, 2026March 3, 2026 by Jean-Luc Aufranc (CNXSoft) - 11 Comments

pureLiFi Bridge XC Flex delivers gigabit broadband internet through windows (made of glass)

pureLiFi Bridge XC Flex is a consumer-installable solution designed to be installed on windows (the ones made of glass, not Windows operating system!) in order to provide up to 1 Gbps broadband internet to the home. The solution leverages LiFi data transmission using invisible infrared light combined with up to 25W wireless power transfer for fast, cost-effective broadband deployment that does not require any cabling. It is comprised of indoor and outdoor units compatible with a wide range of window types, including single, double, and triple-glazed panes, as well as energy-efficient Low-E coatings. pureLiFi Bridge XC Flex highlights: Data Rates – Up to 1 Gbps, full-duplex, symmetrical Power – Up to 25W delivered from indoors to outdoors Installation – Self-install in minutes using weather-proof Gecko tape; high tolerance to misalignment CPE Compatibility – Accepts any Ethernet input from CPE: 4G/5G/mmWave FWA, fibre ONTs, private 5G, satellite, and more Security – […]

March 3, 2026March 3, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Qualcomm Wi-Fi 8 solutions – FastConnect 8800 Mobile Client and Qualcomm Dragonwing Networking Platforms

Qualcomm has unveiled its Wi-Fi 8 (802.11bn) portfolio, which includes the FastConnect 8800 “Mobile Connectivity System”, also integrating Bluetooth 7 wireless technology, Ultra Wideband (UWB), and Thread, and five Dragonwing Networking platforms for access points and routers. The Dragonwing NPro A8 Elite features a 5×5 Wi-Fi 8 radio system for high-performance enterprise access points and premium home routers, the Dragonwing FiberPro A8 Elite offers similar features but adds 10G fiber access (PON) for fiber-to-the-home gateways, the Dragonwing FWA Gen 5 Elite is designed for fixed wireless access using the Qualcomm X85 5G Modem-RF System, and the Qualcomm Dragonwing N8 and F8 platforms offer mainstream tier options for Ethernet and fiber broadband CPEs. Qualcomm FastConnect 8800 Wi-Fi 8 mobile client Qualcomm FastConnect 8800 (WCN885x) specifications: Wi-Fi 8 with advanced features like UWB, including and RADAR Support for Snapdragon Sound™ Technology Suite, Bluetooth® High Data Throughput (HDT), and Qualcomm XPAN Proximity AI […]

February 27, 2026February 27, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Lepton XDS dual-camera module combines 160 x 120 thermal imager with 5MP RGB camera

The Teledyne FLIR Lepton XDS dual-camera module combines a factory‑aligned radiometric 160 × 120 Lepton 3.5 thermal camera with a 5 MP visible camera. Its size, weight, and power (SWaP)‑optimized design makes it suitable for mobile devices, compact electronics, smart buildings, fire detection, occupancy analytics, and equipment‑condition‑monitoring applications. The company highlights that the Lepton XDS module is International Traffic in Arms Regulations (ITAR)-free, which reduces development risk and accelerates time‑to‑market, since it’s easier to export or integrate into products sold globally. Lepton XDS specifications: EO Camera Optics – EFL 1.57 mm, 98.2° HFOV, F/1/2.2 Sensor – 2592 x 1944 pixels (5 MP), 1.4 µm pitch Video – 640×480 @ 30Hz IR Camera Optics – 57° HFOV, f/1.1 Video – 8.7 Hz (commercial application exportable, since it’s below 9 FPS) Thermal Imaging Detector Lepton 3.5 160 x 120 pixels, 12 µm pitch Thermal Sensitivity – <50 mK (0.050 °C) Temperature Accuracy […]

February 26, 2026February 26, 2026 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

TECNO unveils thin modular smartphone concept with magnetic cameras, battery, and gamepad add-ons

The TECNO will showcase its modular smartphone concept at Mobile World Congress 2026. The company’s “Modular Magnetic Interconnection Technology” aims to enable thin modular smartphones with magnetic hardware expansion add-ons. This idea is not new. Motorola’s Project Ara open-source hardware platform attempted that in 2013, and Google (ATAP) took over the project in 2015, before the modular phone project died in 2016. The Fairphone is the closest we have to a modular smartphone nowadays, but while it’s repairable, its modularity is more limited. But maybe time was not just right for a full modular smartphone, and TECNO is giving it another try. Ten magnetic modules have been designed so far. Those include camera modules (ACTION CAMERA and TELEPHOTO LENS), a game pad module, an off-grid communication module (mmWave is mentioned, but maybe a LoRa/Meshtastic will also be provided), and a 4.5mm thick “POWER BANK” battery module to double usable power […]