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August 22, 2017August 27, 2017 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

ESP32-PICO-D4 System-in-Package Combines ESP32, 4MB SPI Flash, a Crystal Oscillator, and Passive Components

Espressif Systems has revealed another ESP32 variant, but this time it’s not an SoC, but a 7x7mm system-in-package (SIP) that comes ESP32 dual core processor, a 4MB SPI flash, a crystal oscillator and various passive components, so that you don’t need to include those in your design, and create an ultra-compact PCB for wearables and other space-constrained applications. ESP32-PICO-D4 SiP specifications: SoC – ESP32 with two Tensilica LX6 cores, 448 KB ROM, 520 KB SRAM (inc. 8KB RTC memory), 1kbit eFuse On-module Flash – 4MB SPI flash Connectivity WiFi – 802.11 b/g/n/e/i (802.11n up to 150 Mbps) Bluetooth – Bluetooth V4.2 BR/EDR and BLE specification; ; class-1, class-2 and class-3 transmitter; Audio: CVSD and SBC SIP Interfaces SD card, UART, SPI, SDIO, LED PWM, Motor PWM, I2S, I2C, IR GPIO, capacitive touch sensor, ADC, DAC, LNA pre-amplifier Sensors – On-chip Hall sensor & temperature sensor Clock – On-module 40 MHz crystal […]

October 12, 2016October 12, 2016 by Jean-Luc Aufranc (CNXSoft) - 24 Comments

CHIP Pro is a $16 WiFi and Bluetooth 4.2 System-on-Module Powered by a $6 GR8 ARM Cortex A8 SIP

Next Thing CHIP board and corresponding PocketCHIP portable Linux computer have been relatively popular due to their inexpensive price for the feature set, as for $9, you’d get an Allwinner R8 ARM Cortex A8 processor, 512MB flash, 4GB NAND flash, WiFi & Bluetooth connectivity, and plenty of I/Os, which made it very attractive for IoT applications compared to other cheap boards such as Raspberry Pi Zero and Orange Pi One. The first board was mostly designed for hobbyists, but company has now designed a new lower profile system-on-module called CHIP Pro based on Next Thing GR8 SIP combining Allwinner R8 SoC with 256MB DDR3 RAM that can be used for easy integration into your own hardware project. While the original CHIP board exposed full USB ports and interface for video signal, the new CHIP Pro is specifically designed for IoT with the following specs: SIP – Allwinner R8 ARM Cortex […]

July 19, 2016July 19, 2016 by Jean-Luc Aufranc (CNXSoft) - 8 Comments

Setting a VoIP SIP user agent with Embedded Linux

This is a guest post by Leonardo Graboski Veiga, working for Toradex. Introduction This article’s main goals are: to cross-compile the PJSIP libraries and the PJSUA API reference implementation; deploy it to the target system; give an overview about the SIP protocol; and explore the reference implementation features, regarding audio only. For this purpose, a Computer on Module (CoM) from Toradex was chosen in the following configuration: Colibri iMX6DL* + Colibri Evaluation Board. The evaluation board and CoM are displayed in Figures 1 and 2, respectively. VOIP or Voice over IP, is a term designed to refer to a set of methods and technologies targeted for the implementation of telephony services over the Internet. For the purpose of this article, the scope will be limited to the use of a reference implementation built upon the SIP communication handling protocol by means of the PJSIP libraries and PJSUA2 API. If […]

May 10, 2016May 10, 2016 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

OSD3358 SiP Integrates TI Sitara AM3358 SoC, Memory, PMIC, LDO and Passive Components into a Single BGA System-in-Package

Octavo Systems has created a BeagleBone Black reference design that’s exactly like the original board, except for one detail: It’s based on the company’s OSD3358 system-in-package (SiP) that combine Texas Instruments AM3358 Cortex A8 processor with up to 1GB RAM, TI LDO and PMIC, and over 140 passive components into a single 400-ball BGA package. The only three other main components on the reference design are the eMMC flash, Ethernet transceiver and HDMI framer. Key specs of OSD3358 SiP: Texas Instruments AM335x (AM3358 or AM3352) Cortex A8 processor @ 1 GHz 256MB, 512 MB or 1GB DDR3 memory Texas Instruments TPS62217C PMIC Texas Instruments TL5209 LDO Over 140 passive components Package – 400 1.27mm pitch BGA – 27 x 27 mm package size Temperature Range – Base version: 0 to 85°C; Industrial version: -40° to 85° C Some of the advantages of a SiP package over using multiple chips include faster […]

January 5, 2016May 10, 2016 by Jean-Luc Aufranc (CNXSoft) - No Comments

Mediatek Unveils MT2523 SiP for GPS Enabled, Bluetooth LE Wearables

Silicon manufacturers are starting to launch ever more integrated solutions specifically designed for wearables, and after Samsung S3FBP5A bio-processor unveiled a few days ago, MediaTek has launched MT2623 ARM Cortex M4 System-in-Package (SiP) with GPS, Bluetooth LE, and a MIPI DSI interface. Other details are sparse but here’s what the company disclosed for MT2523: MCU core – ARM Cortex M4 GPU – 2D accelerator supporting true colors, per-pixel alpha channel, anti-aliasing fonts, and 1-bit index color to save memory. Connectivity – Dual-mode Bluetooth Low Energy and GPS Display – MIPI DSI and serial interfaces Integrated PMU Battery Life – More than a week (typical) The SiP’s printed circuit board area is said to be 41% percent smaller than competitors’ solutions. MT2523 will be available to manufacturers in H1 2016, and found in active and fitness smartwatches a little later. Thanks to Nanik for the tip. Jean-Luc Aufranc (CNXSoft)Jean-Luc started CNX Software […]

December 7, 2015May 10, 2016 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Renesas R-Car H3 Deca-Core Processor and Driverless Car Roadmap

Renesas has recently unveiled R-Car H3 deca-core processor for automotive applications with four Cortex A57 cores, four Cortex A5 cores, and two Cortex-R7 “dual-lock step” cores for real-time processor, and has part the releases showed the expected roadmap for the implementation of driverless / autonomous cars. Let’s start with the processor (R8A77950) and SiP module (R8J77950) specifications: CPU cores – quad core ARM Cortex-A57, quad core ARM Cortex-A53, and dual lock-step ARM Cortex-R7 cores with respectively 48KB/32KB, 32KB/32KB, and 32KB/32KB L1 instructions/operand cache. GPU – IMG PowerVR Series6XT GX6650 External memory – LPDDR4-SDRAM up to 1600 MHz, data bus width: 32 bits x 4 ch (12.8GB/s x 4) Expansion bus – 2 ch PCI Express2.0 (1 lane) Video Out – 3x display output Input / camera – 8x video inputs Video codec module (H.265, H.264/AVC, MPEG-4, VC-1, etc.) IP conversion module 2x TS Interfaces Stream and Security Processor Video image […]