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March 31, 2022 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

TurboX C7230 SOM integrates Qualcomm QCS7230 SoC for WiFi 6 & 5G 8K AI cameras

Thundercomm TurboX C7230 SOM is a system-on-module powered by the just-announced Qualcomm QCS7230 hexa-core processor with 7 TOPS of AI performance and designed for WiFi 6 and 5G connected smart cameras with up to 8K resolution. The TurboX C7230 module comes with 8GB LPDDR5 (PoP), 128GB UFS storage, six MIPI CSI camera interfaces, two MIPI DSI display interfaces, as well as a QCA6391 chip for WiFi 6 and Bluetooth 5.1 connectivity, plus optional 5G cellular connectivity through an optional Snapdragon X55 module that connects to the TurboX C7230 development kit. TurboX C7230 SOM system-on-module specifications: SoC – Qualcomm Snapdragon QCS7230 hexa-core processor with 1x Kryo 585 Gold (Cortex-A77) core @ 2.84 GHz, 3x Kryo 585 Gold cores @ 2.4 GHz, and two Kryo 585 Silver (Cortex-A55) cores @ 1.8 GHz, 4 MB L3 cache, Adreno 650 GPU, Adreno 665 VPU, Adreno 995 DPU, Hexagon DSP with dual-HVX, and Spectra 480 […]

March 21, 2022March 21, 2022 by Sponsored Post - 3 Comments

Ai-Thinker Ra-08 LoRaWAN module features ASR6601 chip (Sponsored)

Ai-Thinker Ra-08/08H are new LoRaWAN modules based on ASR Microelectronics ASR6601 module featuring a 48MHz ARM Cortex M4 microcontroller and Semtech SX1262 transceiver allowing long-range, low power communication for the Internet of Things. Both LoRaWAN modules share most of the same specifications, but the Ra-08 module operates in the 410-525MHz frequency band, while the Ra-08H module works in the widely used 803MHz to 930MHz band. Ai-Thinker also provides a development kit for each module. Ai-Thinker Ra-08/Rs-08H key features and specifications: Programmable embedded Arm Cortex-M4 MCU with 128 KB of Flash and 16 KB of SRAM LoRa radio Sensitivity – -138 dBm @ SF12/125KHz Tx power – Up to +22dBm Frequencies Ra-08 – 410 MHz to 525 MHz Ra-07H – 803 MHz to 930 MHz Spread spectrum factor – SF5, SF6, SF7, SF8, SF9, SF10, SF11, SF12 LoRa, (G)FSK, BPSK, and (G)MSK modulation Bit rate up to 62.5 Kbps in LoRa […]

March 2, 2022March 2, 2022 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

January 29, 2022January 31, 2022 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Arduino Portenta gets an LTE Cat. M1/NB IoT GNSS shield

Arduino Portenta LTE Cat-M1 NB-IoT GNSS shield

Arduino PRO Portenta family of industrial boards is getting a new LTE Cat. M1/NB-IoT GNSS shield that adds global connectivity and positioning capabilities through the Cinterion TX62-W LPWAN IoT module by Thales. The shield works with the Portenta H7 board as well as its lower-cost variants and Arduino MKR boards and will power industry 4.0 and edge computing solutions such as positioning, asset tracking, and remote monitoring applications at the factory, in agriculture, public utilities, and smart cities. Portenta CatM1 shield specifications: Cinterion TX62-W module with: 3GPP Rel.14 Cat.M1, Cat.NB1, Cat.NB2 Global coverage with a single SKU FDD-LTE Bands – 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 71, 85 LTE Cat. M1 – DL: max. 300 kbps, UL: max. 1.1 Mbps LTE Cat. NB1 – DL: max. 27 kbps, UL: max. 63 kbps LTE Cat. NB2 – DL: max. 124 kbps, […]

January 21, 2022January 21, 2022 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Bluetooth LE 5.0 module enables batteryless sensors thanks to Renesas RE01B MCU

RELOC RM-BE1 BLE 5.0 module energy harvesting

RELOC RM-BE1 Bluetooth 5.0 module with embedded energy harvesting capabilities for batteryless sensors adds to the list of energy harvesting news we’ve written about since the beginning of the year, with UEI chip for remote controls, a devkit with a smart coffee cup, and Atmosic ATM33 BLE 5.3 chip. The RM-BE1 module is powered by Renesas RE01B Arm Cortex-M0+ Bluetooth microcontroller that leverages Renesas’ SOTB (Silicon on Thin Buried Oxide) process technology enabling ultra-low power. We’ve been told the chip can run at 35uA/Mhz with internal LDOs and <20uA/Mhz with additional external DCDCs, as well as around 600nA in standby mode. RELOC RM-BE1 module key features and specifications: MCU – Renesas RE01B Arm Cortex-M0+ microcontroller @ 64 MHz with 1.5MB flash, 256KB SRAM Connectivity Bluetooth LE 5.0 with Long Range (up to 400 m) and high data throughput (2 Mbps) support RF output power – Up to +4 dBm Receiver […]

December 31, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

COM Express Type 10 Tiger Lake UP3 module targets embedded mobile applications

AAEON NanoCOM-TGU is a COM Express Type 10 module powered by the 11th generation Intel Tiger Lake UP3 designed for embedded mobile applications, potentially leveraging AI and Deep Learning acceleration engines from the processor with use cases ranging from telematics, Smart Cities, and industrial automation. The NanoCOM-TGU supports up to 16GB LPDDR4x memory with in-band ECC, up to 256GB PCIe NVMe SSD, and offers two SATA 3.0 interfaces, 2.5GbE networking, DDI and eDP video outputs, as well as ten USB ports and four PCI Express x1 interfaces. NanoCOM-TGU specifications: SoC – Intel Tiger Lake UP3 “E” or “GRE” processor with Intel UHD Graphics from Celeron 6305E up to Core i7-1185G7E/1185GRE @ 1.8 GHz /4.4 GHz; 15W TDP System Memory – Up to 16GB onboard LPDDR4x-4266 memory in-band ECC supported by SoC Storage – Up to 256GB onboard NVMe SSD Networking – Intel i225-LM 2.5GbE controller COM Express Type 10 […]

December 5, 2021 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Eigencomm EC616/EC616S SoC supports Cat-NB2 cellular IoT

Eigencomm EC616/EC616S are Cortex-M3 microcontrollers supporting the 3GPP R13/R14 NB-IoT standard, with 3GPP R14 notably introducing the newer LTE Cat-NB2 standard allowing higher bitrates up to 127 kbps downlink, and up to 159 kbps uplink, and OTDOA and E-CID positioning methods. Both EC616 and EC616S are virtually identical, but the EC616S comes with fewer GPIOs and is designed for the lowest possible BoM cost for modules as small as 10×10 mm. Both target similar IoT applications such as wireless meter reading, smoke detection, smart street lights, smart logistics, asset tracking, smart fire monitoring, smart parking, smart home, wearable devices, industry 4.0, smart agriculture, and others. Eigencomm EC616/EC616S specifications: MCU core – Arm Cortex-M3 @ up to 204 MHz Frequency band – 663 MHz to 2200 MHz Protocol version – 3GPP R13/R14 Built-in PA output power – 23dBm Receiver sensitivity – EC616: -118 dBm, EC616S: -117 dBm Peripherals EC616 – 2x […]

November 10, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

NXP i.MX 93 processor combines Cortex-A55 cores with Ethos U65 microNPU

NXP has unveiled the i.MX 93 processor family comprised of i.MX 935x, 933x, 932x, and 931x parts at this time with up to two Cortex-A55 cores, one Arm Cortex-M33 real-time core, as well as an Ethos U65 microNPU for machine learning (ML). We wrote about i.MX 9 family back in March with NXP telling us it would include an Arm Ethos U-65 microNPU and EdgeLock secure enclave, be manufactured with a 16/12nm FinFET class process, and includes the “Energy Flex” architecture to optimize power consumption by turning on/off specific blocks in the processor. The NXP i.MX 93 is the first family leveraging those new features, and we know have some more details. NXP i.MX 93 processor specifications: CPU 1x or 2x Arm Cortex-A55 @ 1.7 GHz with 32KB I-cache, 32KB D-cache, 64KB L2 cache, 256KB L3 cache with ECC 1x Arm Cortex-M33 @ 250 MHz low power microcontroller with 256KB […]