automotive

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on NVIDIA Jetson AGX Orin Industrial offers ECC memory, extended temperature range, improved robustness

NVIDIA Jetson AGX Orin Industrial offers ECC memory, extended temperature range, improved robustness

NVIDIA Jetson AGX Orin Industrial

NVIDIA has recently introduced the Jetson AGX Orin Industrial module that comes with an extended temperature range, operating lifetime, shock and vibration specifications, as well as support for error correction code (ECC) memory, and delivers up to 248 TOPS of AI performance with power configurable between 15-75 W. The industrial-grade system-on-module is based on the Jetson AGX Orin 64GB module but with lower operating frequencies to enable a longer operating lifetime and improved endurance. It’s form-factor and pin-compatible with Jetson AGX Orin, and NVIDIA says it delivers more than eight times the AI performance of the 30 TOPS Jetson AGX Xavier Industrial introduced in 2021, but does not integrate Cortex-R5F cores. NVIDIA Jetson AGX Orin Industrial specifications: CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor @ 2.0 GHz with 2MB L2 + 4MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2,048 NVIDIA CUDA cores and 64 Tensor […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on NXP S32K344 evaluation board for mobile robots offers one 100BaseT1, six CAN-FD interfaces

NXP S32K344 evaluation board for mobile robots offers one 100BaseT1, six CAN-FD interfaces

NXP S32K344 evaluation board

MR-CANHUBK344 is an evaluation board based on NXP S32K344 Arm Cortex-M7 automotive general-purpose microcontroller designed for mobile robotics applications such as autonomous mobile robots (AMR) and automated guided vehicles (AGV) with a 100baseT1 Ethernet interface and six CAN-FD ports. The six CAN bus connectors come in three pairs of CAN-FD, CAN-SIC (signal improvement), and CAN-SCP (secure) interfaces using NXP chips. The board can notably be used for tunneling CAN over Ethernet using IEEE1722, plus the board is equipped with an SE050 Secure element with NFC for authentication, and various general-purpose peripheral interfaces via DroneCode standard JST-GH connectors. MR-CANHUBK344 evaluation board specifications: MCU – NXP S32K344 lockstep Cortex-M7 microcontroller @ up to 160 MHz with 4MB flash, 512KB SRAM, 6x CAN bus interfaces, up to 218 I/Os, AEC-Q100 compliant Ethernet – ASIL-B compliant 100BASE-T1 Ethernet PHY (TJA1103) 6x CAN-FD interfaces with 2x CAN Bus with flexible data rate through TJA144x automotive […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications

AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications

AMD Xilinx Versal AI Edge System-on-Module

iWave Systems iW-Rainbow-G57M is a system-on-module (SoM) based on the AMD (Xilinx) Versal AI Edge series of Cortex-A72/R5 SoC FPGAs designed to deliver AI acceleration at relatively low power for demanding applications such as ADAS, robotics, and medical imaging. The module comes with up to 8GB 64-bit LPDDR4, 16GB eMMC Flash, 256MB QSPI Flash, delivers up to 45 TOPS of AI performance, and features eight transceivers that can be used for high-speed Ethernet, PCIe, MIPI DSI/CSI interfaces, and/or others as required by the customer’s specific project. iW-Rainbow-G57M specifications: FPGA SoC – AMD Xilinx Versal AI Edge/Prime SFVA784 package (VE2302, VE2202, VE2102,  or VE2002) with Dual Arm Cortex-A72 core processor @ up to 1.6 GHz Dual-core Arm Cortex-R5F Up to 328K Logic cells & 150K LUTs Programmable Network on Chip (NoC) Up to 45 TOPS (INT4) AI compute 8x GTYP Transceivers @ 28.21 Gbps (VE2302 & VE2202 only) Memory – Up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on $14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

$14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

Allwinner T113-S3 CPU module

MYiR MYC-YT113X is a low-cost solderable CPU module powered by an Allwinner T113-S3 dual-core Cortex-A7 processor with 128MB on-chip DDR3 RAM, and fitted with either a 256MB NAND flash or a 4GB eMMC flash for storage. The industrial temperature grade module provides a lower-end alternative to the company’s earlier MYC-YT507H Allwinner T507-H Cortex-A53 CPU module, and offers various display, camera, audio, Ethernet, USB, and low-speed I/Os through a 140-pin stamp hole design. It is designed for HMI, industrial automation, as well as display and control terminals. MYiR MYC-YT113X specifications: SoC – Allwinner T113-S3 CPU – Dual-core Arm Cortex-A7 @ 1.2 GHz with 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2 cache DSP – Single-core HiFi4 VPU – H.265/H.264 video decoding up to 1080p60 and JPEG/MJPEG video encoding up to 1080p60 Memory – 128 MB DDR3 Storage – 4GB eMMC or 256MB NAND flash, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Embedded Open Source Summit 2023 schedule – Zephyr OS, Security, IoT, Embedded Linux, and more

Embedded Open Source Summit 2023 schedule – Zephyr OS, Security, IoT, Embedded Linux, and more

Embedded Open Source Summit 2023

The Linux Foundation has just announced the full schedule for the Embedded Open Source Summit, which will take place on June 27-30, 2023 in Prague, Czech Republic, as well as virtually starting on June 26. Over 175 sessions, birds of a feather (BoF) tracks, and workshops related to embedded and open-source innovation will be presented at the event itself comprised of six micro conferences: Automotive Linux Summit Europe, Embedded IoT Summit, Embedded Linux Conference, LF Energy Embedded Summit, Safety-Critical Software Summit, and Zephyr Project Developer Summit. Even though I’m not going to attend personally, I’ve gone through the schedule to create my own little virtual schedule with some sessions relevant that should be interesting to me and hopefully to CNX Software readers. Monday, June 26 (Virtual sessions) The first day of the event will have a Yocto Dev training in the morning, and a bunch of virtual sessions that are […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Queclink WR300FG – A 5G industrial router with GbE, Wi-Fi 6, GNSS, RS232 and RS485 interfaces

Queclink WR300FG – A 5G industrial router with GbE, Wi-Fi 6, GNSS, RS232 and RS485 interfaces

5G industrial router

Queclink Wireless Solutions WR300FG is a dual SIM 5G industrial router with five Gigabit Ethernet ports, WiFi 6, GNSS, RS232 and RS485 interfaces designed for factory automation, smart energy infrastructure, and Internet of Vehicles (IoV). TheWR300FG is based on a Qualcomm IPQ8072 quad-core Arm Cortex-A53 networking processor running OpenWrt, supports both 5G SA/NSA modes, backward-compatibility with 4G/3G, and its dual SIM features enabled automatic switchover for interrupted 5G connectivity.   WR300FG specifications: SoC – Qualcomm IPQ8072 quad-core Arm Cortex-A53 @ 2.2 GHz part of Qualcomm Networking Pro 1200 Platform System Memory – TBD Storage – 1GB flash (described as “hard disk” in the press release!)  Connectivity Cellular 5G SA, 5G NSA, 4G LTE, 3G UMTS Operating bands 5G NR – n1/n2/n3/n5/n7/n8/n12/n20/n28/n38/n40/n41/n48/n66/n71/n77/n78/n79LTE-FDD: B1/B3/B5/B7/B8/B18/B19/B20/B26/B28/B32 LTE-TDD: B34/B38/39/B40/B41/B42/B43 WCDMA: B1/B2/B4/B5/B6/B8/B19 2G GSM: 850/900/1800/1900 MHz Data rates 5G SA: DL 2.1Gbps; UL 900Mbps 5G NSA: DL 2.5Gbps; UL 650Mbps LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL) […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on conga-STDA4 SMARC 2.1 module features TI TDA4VM/DRA829J Jacinto 7 processor

conga-STDA4 SMARC 2.1 module features TI TDA4VM/DRA829J Jacinto 7 processor

conga-STDA4 SMARC Module TI Jacinto 7 TDA4VM DRA829J

congatec conga-STDA4 is a SMARC Computer-on-Module (CoM) based on Texas Instruments TDA4VM or DRA829J Jacinto 7 processor with two Cortex-A72 cores, six real-time Cortex-R5 cores for functional safety, accelerated vision and AI processing capabilities, and plenty of interfaces. The first Texas Instruments-powered CoM from the company is designed for industrial mobile machinery requiring near-field analytics, such as automated guided vehicles and autonomous mobile robots, construction and agricultural machinery, as well as any industrial or medical solutions requiring energy-efficient computer vision at the edge. conga-STDA4 specifications: SoC – Texas Instruments Jacinto 7 TDA4VM/DRA829J with Dual-core Arm Cortex-A72 up to 2.0 GHz 6x Arm Cortex-R5F cores @ 1.0 GHz up to 8 MB of on-chip L3 RAM 1x C7x DSP up to 80 GFLOPs 2x C66 DSPs up to 40 GFLOPs Up to 8 TOPS MMA AI accelerator PowerVR Rogue 8XE GE8430 3D GPU with support for OpenGL ES 3.1, OpenVX, OpenCL […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 19 Comments on Rockchip RK3588M automotive-grade AI SoC supports up to 16 camera inputs

Rockchip RK3588M automotive-grade AI SoC supports up to 16 camera inputs

Rockchip RK3588M automotive SBC

Rockchip RK3588M is an automotive-grade variant of the Rockchip RK3588 octa-core Cortex-A76/A55 SoC that supports at least 6 Full HD displays and 16 camera inputs and can simultaneously run the car dashboard, in-vehicle infotainment, a digital rearview mirror, headrest monitors, ADAS system, and more. The frequency of the Cortex-A76 cores is limited to 2.1 GHz, and the Cortex-A55 cores to 1.7 GHz, against 2.4 and 1.8 GHz for RK3588, probably to operate in a larger temperature range required by the automotive market. I could not find any RK3588M datasheet yet, but we can find more details through the Firefly AIO-3588MQ automotive mainboard built around the RK3588M processor. Firefly AIO-3588MQ specifications: SoC – Rockchip RK3588M octa-core processor with CPU 4x Cortex-A76 cores @ up to 2.1 GHz, 4x Cortex-A55 cores @ up to 1.7 GHz Arm Mali-G610 MP4 GPU with OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.1 support 6 TOPS AI […]