F&S Elektronik ArmStone MXM8 Pico-ITX Board is Equipped with Up to 8GB RAM, NXP i.MX8M Processor

F&S Elektronik Systeme has been working on a new SBC part of their ArmStone family with ArmStone MXM8 single board computer, featuring NXP i.MX 8M quad core Cortex A53 processor, and supporting up to 8GB LPDDR4 RAM. The Pico-ITX board also comes with up to 32GB eMMC flash, integrate Gigabit Ethernet and wireless connectivity, DVI and dual-channel LVDS outputs, USB 3.0, PCIe and more interfaces. The layout is very similar to the company’s ArmStone A53SD pico-ITX board launched last year with a Qualcomm Snapdragon 410E processor. ArmStone MXM8 preliminary specifications: SoC – NXP i.MX 8M Dual or Quad Arm Cortex A53 processor @ up to 1.5 GHz, Arm Cortex-M4 real-time core, and Vivante GC7000Lite GPU with support for OpenGL/Es 3.1, OpenGL 3.0, Vulkan System Memory – Up to 8GB LPDDR4 Storage – Up to 32GB eMMC flash, up to 1GB SLC NAND flash, optional micro SD slot Video Output – Dual channel LVDS connector, analog resistive and PCAP touch via …

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VIA SOM-9X20 Module Powers Smart Recognition and Smart Machine Vision Platforms

At the end of last year, VIA launched SOM-9X20 system-on-module powered by Qualcomm Snapdragon 820 processor coupled with 4GB PoP LPDDR4 RAM, 64 GB eMMC flash, as well as WiFi + Bluetooth module, and a GNSS/GPS receiver. The company introduced two software platform for the SoM and development kit at embedded world 2018: a Smart Machine Vision Platform for manufacturing management and control systems, and a Smart Recognition Platform for facial recognition, object detection, people counting & tracking, etc… VIA SOM-9X20 module specifications: SoC – Qualcomm Snapdragon 820 quad- core processor with 2x high-performance Kryo cores up to 2.15GHz, 2x low power Kryo cores up to 1.593GHz, and Adreno 530 GPU supporting OpenGL ES 3.1/ GEP, GL4.4, DX11.3/ 4, OpenCL 2.0, Renderscript-Next System Memory – 4 GB POP LPDDR4 RAM Storage – 64 GB eMMC 5.1/ UFS 2.0 flash On-module Connectivity Wi-Fi 802.11 a/ b/ g/ n/ ac + Bluetooth 4.1 (QCA6174A -1) with two antenna connectors GNSS/GPS RF receiver …

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Amarula Vyasa is a $150 Pico-ITX Single Board Computer Powered by Rockchip RK3288 SoC

Yesterday, as I published Linux 4.15 changelog for Arm and MIPS, I discovered a new Rockchip RK3288 platform described as “Amarula Vyasa single board computer”, so that got me interested. The full name of the company is “Amarula Electronics Limited Sony UK”, which means Vyasa is the name of the board. Amarula Vyasa relies on a 2.5″ Pico-ITX form factor, and is available in either commercial and wide temperature (WiTAS) range. The board is equipped with 2GB RAM, 16GB eMMC flash, exposes ports and connectors such as HDMI 2.0, eDP, and LVDS, and plenty of network connectivity (WiFi, Ethernet, mPCIe modem…) that would make it suitable for a connected digital signage, or other applications requiring a (touchscreen) display and redundant Internet / network connectivity. Amarula Vyasa specifications: SoC – CPU Rockchip RK3288 (ARM CortexTM -A17 Quad-core 1.6GHz) System Memory – 2GB DDR3L  SDRAM Storage – 16GB eMMC flash, Micro SD card Video / Display I/F 1x HDMI 2.0 up to …

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Emcraft Releases Linux BSP for NXP i.MX RT1050 Cortex M7 Evaluation Board

NXP iMX RT series is a family of ARM Cortex M7 processors clocked at 600 MHz, making the solution a “crossover embedded processor” bridging the gap between real-time capabilities of micro-controllers and the performance of application processors. This week, NXP provided some benchmark numbers for i.MX RT1050 processor, which delivers a CoreMark score of 3020, DMIPS of 1284, and 20ns interrupt latency at 600 MHz, which means it could be a good candidate for embedded Linux, and Emcraft Systems has just released a uCLinux BSP for the NXP i.MX RT1050 EVK board. The BSP features U-Boot v2017.09-rc1, Linux Kernel 4.5 with relevant device drivers such as key I/O interfaces, Wi-Fi, SD card, LCD, etc…, and GNU development tools such as a GCC 4.7 toolchain, GDB, and so on. The company has made a demo with a GUI application designed with Crank Software’s Storyboard Suite, and running in Linux on the NXP i.MX RT1050 evaluation kit The binary files for the …

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Renesas RZ/G Linux Platform features CIP Super Long-Term Support (SLTS) Linux kernel

In the consumer space, some devices never get updated, and you can consider yourself lucky if the manufacturer provides updates for several years, often just two as Linux LTS (Long Term Support) kernels had been supported that long so far. Google and the Linux Foundation realized that was not enough, so they recently announced 6-year LTS kernels at Linaro Connect SFO 2017, starting with Linux 4.4 released on January 2016, meaning it will keeping being maintained until January 2022 with security patchsets and bug fixes. But in the industrial/embedded space, they need even longer periods of support due to the longer equipment’s lifespan. I first heard about the Linux Foundation’s  Civil Infrastructure Platform (CIP) project last year, when I covered the schedule for the Embedded Linux Conference Europe 2016. The project aims at providing a super long-term supported (STLS) open source “base layer” for industrial grade software. Several companies are partners of the project including Hitachi, Renesas, Siemens, Toshiba, and …

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Compulab’s Miniature “Bend & Fold” UCM-iMX7 System-on-Module Could Fit into a Watch

Many companies are still releasing NXP – soon to be Qualcomm – i.MX 6/7 system-on-modules, but I don’t cover all of them, since we have already many to choose from. But Compulab’s latest UCM-iMX7 SoM differentiates itself by it size, using the company’s “Ultra-compact Multilevel Module” (UCMM) technology, to pack NXP i.MX7 processor, 2GB RAM, 64 GB eMMC flash, and a wireless module into a 30 x 27 x 8 mm volume that could potentially fit into something as small as a watch. The picture above clearly shows how UCMM technology works with the module comprised of two rigid PCBs and one flexible layer routing signals between the two allowing to bend and fold the rigid parts together to form a vertical stack. The principle could be extended to more PCBs and flexible layers, sof for example you could have four PCBs with three flexible layers in future / custom designs. The rest of the specifications of UCM-iMX7 module are …

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FOSDEM 2017 Open Source Meeting Schedule

FOSDEM (Free and Open Source Software Developers’ European Meeting) is a 2-day free event for software developers to meet, share ideas and collaborate that happens on the first week-end of February, meaning it will take place on February 4 & 5, 2017 this year. FOSDEM 2017 will features 608 speakers, 653 events, and 54 tracks, with 6 main tracks namely: Architectures, Building, Cloud, Documentation, Miscellaneous, and Security & Encryption. I won’t be there, but it’s always interesting to look at the schedule, and I made my own virtual schedule focusing especially on talks from “Embedded, mobile and automotive” and “Internet of Things” devrooms. Saturday 4, 2017 11:00 – 11:25 – Does your coffee machine speaks Bocce; Teach your IoT thing to speak Modbus and it will not stop talking, by Yaacov Zamir There are many IoT dashboards out on the web, most will require network connection to a server far far away, and use non standard protocols. We will show …

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MYIR Tech Latest SoM and Development Board Feature Xilinx Zynq-7015 ARM + FPGA SoC with 4 High Speed Transceivers

MYIR Tech launched the low cost Z-Turn board powered by Xilinx Zynq-7010/7020 ARM+FPGA SoC last year, and the company has now introduced a new system-on-module powered by Xilinx Zynq-7015 SoC as well as a corresponding development kit. MYC-C7Z015 CPU Module specifications: SoC – Xilinx XC7Z015-1CLG485C (Zynq-7015) dual core ARM Cortex-A9 processor @ 667 MHz (up to 866MHz) with Artix-7 class FPGA subsystem with 74K logic cells, 46,200 LUTs, 160 DSP slices, 4x high-speed SerDes transceivers up to 6.25 Gbps, 4x four PCIe Gen2 hardened, integrated IP blocks System Memory – 1GB DDR3 SDRAM Storage – 4GB eMMC flash, 32MB QSPI Flash (16MB optional) Connectivity – 1x Ethernet PHY, 1x USB PHY I/Os and peripherals via 2x 140-pin board-to-board connectors: 1x Gigabit Ethernet 1x USB OTG 2.0 Up to 2x serial ports, up to 2x I2C, up to 2x CAN BUS, 1x SPI 1x independent differential ADC, 16-channel ADC 1x SDIO Bank 13  – PL I/O configurable as up to 18 …

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