Amlogic S905Y2, S905X2, S922X Boards Running Android 9 Showcased at IBC 2018

Amlogic S922X Reference Design

At the very beginning of this year, we published an Amlogic roadmap showing Amlogic S922 next gen CPU/GPU, and S905X2 quad core Cortex A53 processors, but so far we still had limited information, and as per Amlogic own roadmap S922 was still at the definition stage, so exact specifications may have been expected to change at the time. The company showcased some exciting new solutions at IBC 2018 with three reference boards based on new Amlogic S905Y2, S905X2, and S922 processors all running Android TV 9 “Pie”. “Android TV Rumors” was apparently at the event and posted some photos on twitter. Amlogic S905Y2 Reference Board Amlogic S905Y2 processor is using the same old quad core Cortex A53 configuration, but features a more modern Arm Mali-G31 MP2 GPU. The reference board is designed for OTT 4K HDMI dongles, and comes with 16GB storage, 2GB RAM, USB 2.0 interface, as well WiFi 2T2R and Bluetooth 5.0 connectivity. Amlogic S905X2 Reference Board We …

Mediatek Helio P60 Cortex A73/A53 Mobile Processor Includes NeuroPilot AI technology

Neural Network Accelerators (NNA) may have become a must-have block in high-end mobile processors. Huawei Kirin 970, Samsung Exynos 9810, and Qualcomm Snapdragon 845 (via its Hexagon DSP) processors all come with NNA or NPU (Neural Processing Unit) to speed up tasks and comsume less power for tasks related to artificial intelligence / machine learning. Mediatek has also jumped on the bandwagon with Helio P60 chipset featuring four Cortex A73 cores, four Cortex A53 cores, an Arm Mali-G72MP3 GPU and a multi-core mobile APU (AI Processing Unit) leveraging the company’s NeuroPilot AI technology. Mediatek P60 key specifications: CPU – big.LITTLE Octa-core with four Arm Cortex-A73 up 2.0 GHz and four Arm Cortex-A53 up to 2.0 GHz GPU – Arm Mali-G72 MP3 at 800MHz Multi-core AI processing unit (Mobile APU) – 280 GMAC/s; offers deep learning facial recognition, object and scene identification, user behavior-informed performance and other AI and AR application enhancements. System Memory – Up to 8GB, dual-channel LPDDR4x @ …

Samsung Unveils Exynos 7872 Hexa-core Arm Cortex A73/A53 Mobile Processor

Samsung has introduced a new hexa-core Exynos 5 series processor with Exynos 7872 featuring two Cortex A73 cores, four Cortex A53 cores, a Mali-G71 MP1 GPU, and an LTE modem that supports Category 7 with 2CA for 300Mbps downlink speed and Category 13 with 2CA for 150Mbps. The new processor claims to bring premium performance to mid-tier device with a doubling of single core performance compared to its predecessor, which should be Exynos 5430 or Exynos 5422 octa-core Cortex A15A/7 processor. Samsung Exynos5 7872 processor specifications: CPU – Dual-core Cortex-A73 @ up to 2.0GHz, and Quad-core Cortex-A53 @ up to 1.6GHz GPU – Arm Mali-G71 MP1 Memory I/F – LPDDR3 Storage I/F – eMMC 5.1, SD 3.0 Display – Up to WUXGA (1920×1200) LTE Modem – LTE Cat.7 2CA 300Mbps (DL) / Cat.13 2CA 150Mbps (UL) Connectivity – Wi-Fi 802.11n Dual-band, Bluetooth 5, FM Radio GNSS –  GPS, GLONASS, BeiDou, Galileo Camera –  Rear 21.7MP, Front 21.7MP Video – Full HD …

Huawei Introduces Kirin 970 Mobile SoC with Built-in Neural Processing Unit for Artificial Intelligence Applications

Huawei has unveiled their latest Kirin 970 SoC for premium smartphone at IFA 2017. The processor features an 8-core CPU, and a new 12-core GPU, but what makes this new processor stands apart it a dedicated Neural Processing Unit (NPU) to accelerate tasks used for artificial intelligence, with the company claiming the NPU delivers 25 times the performance with 50x greater efficiency compared to a quad core Cortex A73 processor for AI computing tasks. In practical terms, Kirin 970 could process 2,000 images per minute in an unnamed benchmark image recognition test. The press release also mentions the processor will pack 5.5 billion transistors packed into 1 cm² and be manufactured using a 10nm “advanced processor”. But they did not go into much further details about the specs, so instead, I used info from Anandtech and the slide above to derive Kirin 970 technical specifications: CPU – 4x ARM Cortex A73 cores @ up to 2.4 GHz, 4x ARM Cortex …

HiKey 960 Development Board Powered by Hisilicon Kirin 960 Cortex A73/A53 Processor To Sell for $239

LeMaker is about to launch a successor to Hikey board with a new 96Boards compliant development board with HiKey 960 featuring the powerful Hisilicon Kirin 960 processor found in Huawei Mate 9 smartphone, as well as 3GB LPDDR4 memory, 32GB UFS storage, HDMI, USB 3.0 ports and so on. Hikey 960 board specifications: SoC – Kirin 960 octa-core big.LITTLE processor with 4x ARM Cortex A73 cores @ up to 2.4 GHz, 4x Cortex A53 cores @ up to 1.8 GHz, and a Mali-G71 MP8 GPU System Memory – 3GB LPDDR4 SDRAM Storage – 32GB UFS flash storage + micro SD card slot Video Output / Display Interface – 1 x HDMI 1.4 up to 1080p, 1x 4-lane MIPI DSI connector Connectivity – Dual band 802.11 b/g/n/ac? WiFi and Bluetooth 4.1 with two antennas USB – 2 x USB 3.0 type A host ports, 1x USB 2.0 type C OTG port Camera – 1x 4-lane MIPI CSI, 1x 2-lane MIPI CSI …

HiSilicon Kirin 960 Octa Core Application Processor Features ARM Cortex A73 & A53 Cores, Mali G71 MP8 GPU

Following on Kirin 950 processor found in Huawei Mate 8, P9, P9 Max & Honor 8 smartphones, Hisilicon has now unveiled Kirin 960 octa-core processor with four ARM Cortex A73 cores, four Cortex A53 low power cores, a Mali G71 MP8 GPU, and an LTE Cat.12 modem. The table below from Anandtech compares features and specifications of Kirin 950 against the new Kirin 960 processor. SoC Kirin 950 Kirin 960 CPU 4x Cortex A72 (2.3 GHz) 4x Cortex A53 (1.8 GHz) 4x Cortex A73 (2.4 GHz) 4x Cortex A53 (1.8 GHz) Memory Controller LPDDR3-933 or LPDDR4-1333 (hybrid controller) LPDDR4-1800 GPU ARM Mali-T880MP4 @ 900 MHz ARM Mali-G71MP8 @ 900 MHz Interconnect ARM CCI-400 ARM CCI-550 Encode/ Decode 1080p H.264 Decode & Encode2160p30 HEVC Decode 2160p30 HEVC & H.264 Decode & Encode2160p60 HEVC Decode Camera/ISP Dual 14bit ISP 940MP/s Improved Dual 14bit ISP Sensor Hub i5 i6 Storage eMMC 5.0 UFS 2.1 Integrated Modem Balong Integrated UE Cat. 6 LTE Integrated UE Cat. 12 LTE 4x …

Mediatek Helio X30 Deca-core SoC Features ARM Cortex-A73, Cortex A53, and Cortex A35 Processor Cores

Mediatek introduced Helio X20 last year with a tri-cluster architecture comprised of 2 powerful ARM Cortex A72 cores, 4 Cortex A53 cores, and 4 extra Cortex A53 cores operating at a lower frequency, and optimized for power consumption. But now that ARM has introduced ultra-low power Cortex A35 cores, and more powerful Cortex A73 cores,  the Taiwanese company has been able to improve its tri-cluster implementation for the upcoming Helio X30 deca-core processor with 2 Cortex A73 cores @ up to 2.8 GHz, 4 Cortex A53 cores @ up to 2.2 GHz, and 4 Cortex A35 cores @ up to 2.0 GHz. According to various sources on Weibo, the mobile processor also includes an Imagination PowerVR 7XT GPU, supports up to 8GB LPDDR4 RAM @ 1600 MHz (PoP – Package in Package), UFS 2.1 flash storage, up to 40MP camera sensors,  and its cellular modem will support LTE Cat.10 to Cat.12. Medaitek Helio X30 processor will be mass-produced using a …

ARM announces “premium IP” for VR and AR with Cortex-A73 Processor and Mali-G71 GPU

Today ARM has revealed the first details of its latest mobile processor and GPU, both said to be optimized for VR (Virtual Reality) and AR (Augmented Reality) applications. Starting with the ARM Cortex-A73, we’re looking at an evolution of the current Cortex-A72 with ARM claiming 30 percent “sustained” performance over the Cortex-A72 and over twice the performance over the Cortex-A57. ARM is already talking about clock speeds of up to 2.8GHz in mobile devices. Other improvements include an increase up to 64k L1 instruction and data cache, up from 48 and 32k respectively for the Cortex-A72, as well as up to 8MB of L2 cache. The Cortex-A73 continues to support ARM’s big.LITTLE CPU design in combination with the Cortex-A53 or the Cortex-A35. It’s also the first ARM core to have been designed to be built using 10nm FinFET technology and it should be an extremely small CPU at around 0.65 square millimeters per core, or a 46 percent shrink from …