Archive

Posts Tagged ‘development kit’

iWave Systems iW-RainboW-G25D is a SMARC 2.0 Compliant Snapdragon 820 Development Kit

October 15th, 2017 No comments

iWave Systems previously launched iW-RainboW-G25S single board board powered by Qualcomm Snapdragon 820 processor. The company is now back with a new Snapdragon 820 development kit called iW-RainboW-G25D that complies with SMARC 2.0 SoM specifications.

The kit include a SoM with 3GB RAM, 32GB storage, WiFi and Bluetooth connected to a SMARC compliant baseboard, and optionally features a 5.5″ AMOLED touch screen display.

Click to Enlarge

iWave Systems iW-RainboW-G25D development kit specifications:

  • APQ8096 SMARC iW-RainboW-G25M SoM:
    • SoC – Qualcomm Snapdragon 820 (APQ8096) quad core Kryo CPU with Adreno 530 GPU @ 624MHz, Hexagon 680 DSP @ 825 MHz (no  modem)
    • System Memory – 3GB LPDDR4 RAM
    • Storage – 32GB eMMC Flash, micro SD slot
    • Connectivity
      • PCIe to Gigabit Ethernet + PHY
      • 802.11a/b/g/n/ac Wi-Fi + BT4.1 Low Energy (BLE)
      • GPS/GNSS receiver
    • 314-pin MXM 3.0 edge connector as per SMARC 2.0 specifications
  • SMARC Carrier Board
    • Storage – M.2 slot (back), SATA, SD card slot (back), SPI flash
    • Display – 5.5″ HD AMOLED MIPI DSI display with capacitive touch
    • Video Output – HDMI
    • Audio – 3.5mm audio IN or OUT jacks
    • Camera – 8MP MIPI CSI camera connector
    • Connectivity – 1x Gigabit Ethernet (RJ45)
    • USB – 2x USB 3.0 host port, 2x USB 2.0 host ports, 1x micro USB OTG port, 1x USB 3.0 type C port
    • Expansion
      • 1x PCIe x1 slot
      • 1x MiniPCIe slot (multiplexed with PCIe slot and one USB 2.0 port; selectable with switch)
      • 1x UART port (full function)
      • 3x 80-pin I/O Expansion connectors with USB, GPIO, MIPI CSI, MIPI DSI,  SLIM BUS, I2C, UART, SPI, HAD/I2S, etc…
    • Misc – RTC with backup battery, DIP switch
    • Debugging – 1x micro USB Port
    • Power Supply – 12V DC
    • Dimensions – 120mmx120mm (Nano ITX form factor)
  • Operating Temperature – 0°C to +70°C

Block Diagram – Click to Enlarge

The company provides support for Android 6.x Marshmallow, and expects the kit and SoM to be used to develop various types of applications including augmented & virtual reality, 4K digital signage, media streaming, connected home & entertainment, high end wearables, drones, secure POS, video analytics.

iW-RainboW-G25D SMARC development kit appears to be available now with or without display. For further details and potentially inquire about pricing info, visit the product page.

Intrinsyc Launches Open-Q 660 HDK Snapdragon 660 Development Kit

October 7th, 2017 3 comments

For many years now, Intrinsyc has been releasing Qualcomm mobile development platforms that that are used by companies wanting to design and manufacture smartphones or other products based on Snapdragon processors. Those are usually full featured, including a smartphone display, and well suited to such product development.

Their latest development kit is the Open-Q 600 HDK (Hardware Development Kit) powered by Qualcomm Snapdragon 660 SoC, an upgrade to Snapdragon 653 with about 20 percent improvement in CPU performance, and 30 percent in GPU performance. The kit is also equipped with 6GB RAM, 64GB flash, a display, wireless modules, sensors, camera interfaces, expansion headers, and more.

Intrinsyc Open-Q 600 specifications:

  • SoC – Qualcomm Snapdragon 660 octa-core processor with
    • Four Kryo 260 performance cores @ up to 2.2GHz, four Kryo 260 low power cores @ up to 1.8GHz
    • Adreno 512 GPU @ up to 650 MHz supporting OpenGL ES 3.0/3.2, Vulkan, DX12 FL 12, OpenCL 2.0 full profile
    • Hexagon 680 DSP with Hexagon Vector eXtensions (dual-HVX512) designed for 784 MHz
  • Memory – 6GB LPDDR4x
  • Storage – 64GB eMMC 5.1 flash (combined with LPDDR4x RAM in eMCP package), microSD slot
  • Display / Video Output
    • 2x 4-lane MIPI-DSI connector + touch panel support
    • Optional 5.7″  AMOLED display with 1920×1080 resolution, PCAP touch panel, via 4-lane MIPI DSI interface
    • DisplayPort 1.3 on USB 3.1 Type C port up to 2560×1600 (WQXGA) @ 60fps
  • Camera I/F
    • 3x 4-lane MIPI CSI interfaces with 3D camera support
    • Optional camera board with 2x rear-facing 13MP sensors (Samsung S5K3M2) and 1x front-facing 8MP sensor (OmniVision OV8856)
    • Dual 14-bit Qualcomm Spectra ISPwith support for: 16 + 16 MP, 540 MHz each; 24MP30 ZSL with dual ISP; 16 MP 30 ZSL with a single ISP
  • Video Support
    • Encode – 4K30 HEVC/H.264/VP8/MPEG4
    • Decode – 4K30 8-bit: H.264/VP8/VP9, 4K30 10-bit: HEVC
    • Concurrent – 1080p60 Decode + 1080p30 Encode
  • Audio – Qualcomm WCD9335 audio codec; audio expansion headers; 3.5mm ANC headset jack
  • Wireless Connectivity
    • Dual band (2.4/5GHz) 802.11 b/g/n/ac  1×1 MU-MIMO WiFi with MH4L antenna connector and PCB antenna
    • Bluetooth 5 BLE
    • GNSS  – GPS/GLONASS/COMPASS/Galileo via Qualcomm SDR660 GNSS receiver with PCB antenna and SMA connector option
    • 20-pin NFC expansion header
  • USB – 2x USB 2.0 host ports, 1x micro USB port (for debugging), 1x USB type C port
  • Expansion I/Os – I2S, SPI, GPIO, JTAG, 24-pin sensor I/O for optional STMicro sensor board
  • Battery – Optional 3,000 mAh Li-Ion battery
  • Power Supply – 12V/5A input from included wall adapter; Qualcomm Power and Battery Management (PM660 + PM660A + SMB1381)
  • Dimensions – 170 x 170mm (Mini-ITX form factor)

Click to Enlarge

The platform supports Android 7 Nougat, but there’s not too much public information about software support, except that “Users of the Open-Q 660 Development Kit will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc’s technical support services”.

The early adopter version of the kit can be pre-ordered for $999, not including optional display or camera board, which respectively add $210 and $250. The optional battery is not shown in the order page, all orders are subject to approval from the company, and kits should be shipped by the end of October. Visit the product page for additional information.

Via LinuxGizmos

WizziKit is a DASH7, LoRa and Sigfox Wireless Sensor & Actuator Network Kit

September 13th, 2017 2 comments

Over the last few years, I’ve written several article about LoRaWAN, Cellular IoT, and Sigfox based long range low power IoT solutions. DASH7 is another LPWAN (Low Power Wide Area Network) standard that operates on the same 868 and 915 MHz ISM bands as LoRa and Sigfox, but has much lower power consumption, and the cost of a shorter range up to 500 meters, instead of the 5+km associated with LoRa or SigFox.

The DASH7 Alliance Protocol (D7A) is an Open Standard, and if you want more details you can download version 1.1 of the specifications on DASH7 Alliance website. I’m writing about DASH7 today thanks to an article on ST blog about Wizzilab’s Wizzikit, an evaluation kit and framework for DASH7 with a gateway, and several nodes that can also optionally support LoRaWAN and Sigfox protocols.

Click to Enlarge

The kit is comprised of the following items:

  • WizziGate GW2120 Ethernet/Wifi/Dash7 gateway – based on GL-iNet AR150 router –  with antenna for the selected band (868/915 MHz) and USB power cable.
  • 2x Nucleo-L432KC STM32 development board compatible with Arduino. mbed, and ST morpho
  • 2x D7A SH2050 Nucleo Shield with a multimode Murata Lora Module supporting LoRa, DASH7, and Sigfox, as well as four sensor chips: light sensor,  magnetometer & accelerometer, humidity and temperature sensor, and a pressure sensor.
  • 2x mini USB cable to power up and program the Nucleo boards

DA7 SH2050 Shield

You’ll also need to add you own USB power adapter for the gateway. The kit also comes with access to the company’s DASH7Board cloud service. The Wiki includes some information, including a quick start guide explaining how to register the gateway, and start loading the demo code using mbed. Since DASH7 is much more power efficient than LoRaWAN it can either be used to prolong battery life, or to send more frequent messages for example to control actuators. With LoRaWAN, downlink access can only be initiated by the end node, but DASH7 is bi-directional allowing for OTA firmware upgrades. The solution was showcased a few months ago at ST Techday with two demos: sending a message to a single node, and OTA code upgrade (actually picture upload) to multiple boards with a broadcast message.

Wizzilab’s Wizzikit is sold for 299.00 Euros with either 868 and 915 MHz band. Further details on be found on Wizzilab website.

Particle E Series is a Family of 2G, 3G, 4G LTE Cellular IoT Modules Optimized for Mass Production

September 7th, 2017 9 comments

Cellular IoT has really taken off this year from the low cost Orange Pi 2G IoT board to 4G GPS Trackers, and global IoT SIM cards. Particle has been in this market for a couple of years, starting with their Electron boards, and the company has just announced the new Particle E series family of industrialized 2G, 3G, and LTE-enabled modules and a development kit.

Key features of Particles E series modules:

  • Cellular Connectivity
    • u-blox SARA modules for cellular connectivity
      • LTE: SARA-R410M
      • 3G: SARA-U201/U260/U270
      • 2G: SARA-G350 (2G)
    • Embedded SIM card, Particle MVNO support in 100+ countries
    • u.FL antenna connector
  • MCU – STM32F205RGT6 120MHz ARM Cortex M3 microcontroller with 1MB flash, 128KB RAM
  • Storage – • Expandable flash memory
  • I/Os – 63-pin surface mountable castellated module with up 30x GPIOs, 12x ADC, 2x DAC, 13x PWM, 3x UART, 2x SPI, 1x I2S, 2x CAN, 1x USB 2.0 (Some signals are multiplexed)
  • Power Supply – 3.88 to 12V input; BQ24195 power management unit and battery charger; MAX17043 fuel gauge
  • Power Consumption (@5V?)
    • Operating current (cellular ON): 180 mA to 250 mA
    • Operating current (cellular OFF): 47 mA to 50 mA
    • Peak current: 800mA (3G), 1800 mA (2G)
    • Sleep Current: 0.8 mA to 2 mA
  • Dimensions – 43 x 36 x 4.6 mm
  • Weight – < 10 grams
  • Temperature Range – -20 to +85°C (extended range)
  • Certifications – FCC, CE, IC wireless certifications, PTCRB (End-Product Certified) & GCF cellular certifications, RoHS

A total of 7 modules are planned to launch by mid 2018 with the naming convention using the first number reserved for the “G” number, the second for local (0) or global (1), and the third being an incremental number:

  • E210 – 2G only – Q4 2017 working worldwide (quad band)
  • E301 – 3G with 2G fallback – Q4 2017 for Americas/Australia (850/1900 MHz)
  • E302 – 3G with 2G fallback – Q4 2017 for Europe, Asia, and Africa (900/1800/2100 MHz)
  • E310 – 3G with 2G fallback – Q4 2017 working worldwide (850/900/1800/1900/2100 MHz)
  • E401 – LTE M1 – Early 2018 for US (LTE B13)
  • E402 – LTE M1 – Early 2018 for North America (LTE B2/4/5/12)
  • E410 – LTE M1/NB1 – Mid 2018 for the global market

Electron Board (Left) and E-Series Eval Kit (Right)

The new modules share the same software development tools, Particle Cloud platform, code and peripherals as Electron prototyping board with the modules running FreeRTOS, supporting  CoAP encrypted messaging, TCP/IP and UDP/IP, GCC toolchain, and various firmware update methods including OTA. E series were created because while Electron board suitable for evaluation, pin-row headers, plastic SIM cards, and USB connectors made it less appropriate for integration into products and mass production.

The company has also introduced an E Series evaluation kit working globally with the following specifications:

  • Module – Particle E310 3G with 2G fallback
  • Breakout Board with
    • 2x micro USB port for flashing and serial communications
    • SMA antenna connector
    • 1x female expansion header, 2x Grove connectors
    • Misc – MODE and RESET buttons, Charge and status LEDs
    • Power – Li-Po battery connector,  power barrel jack
  • Battery –  2,000 mAh Li-Po battery
  • Antenna – Taoglas penta-band antenna (u.FL), SMA to u.FL adapter for connecting external SMA antennas
  • 1x Grove temperature sensor
  • 1x USB Micro cable
  • Pinout reference card

The kit will come with three months of Particle’s 1MB monthly data plan upon eSIM activation. Data plan pricing depends on the country of operation and number of nodes, but for reference, for up to 100 nodes in the US, you’d pay $2.99 per month/device including 1MB data, plus $0.99 per extra MB.

Pricing information has not been publicly disclosed for the module, but you can purchase E series development kit for $99.99, or $249 with 3 extra spare E310 modules. Visit Particle E-Series product page for further details.

SKATE-212 Snapdragon 212 Development Kit with 7″ Display is now available for $349

August 8th, 2017 4 comments

Last month, I wrote about two boards based on Snapdragon 212 processor that can be used for smart speakers, IoT applications, industrial automation, etc..: Intrinsyc Open-Q 212 SBC selling for $595 without LCD, and Kaynes Technology SKATE-212. We did not have that much information about the latter at the time, but the company has now published some photos, more details, and revealed pricing.

SKATE-212 single board computer specifications:

  • SoC –  Qualcomm Snapdragon 212 quad core Cortex A7 @up to  1.3GHz with Adreno 304 GPU supporting OpenGL ES 3.0, OpenCL, DirectX
  • System Memory – 1 GB LPDDR3 (Expandable upto 2GB)
  • Storage – 8 GB eMMC flash (Expandable up to 16GB) +  micro SD slot
  • Video Output / Display  – 7″ capacitive touchscreen, full size HDMI port (Only one or the other can be used at a given time)
  • Connectivity – 10/100M Ethernet, 802.11 b/g/n WiFi + Bluetooth 4.x LE, GPS with optional GLONASS support
  • USB – 2x USB 2.0 host ports, 1x micro USB device port (can not be used at the same time as Ethernet, and other USB host ports),  1x micro USB debug console
  • Camera –  8 MP primary camera; 2MP secondary camera
  • Audio
    • Mono loudspeaker output
    • 3.5mm stereo audio jack with mic
    • On board single (default)or dual microphone
  • Expansion – 40-pin expansion header with SPI, I2C, GPIO, etc.. signals
  • Sensors – 6-axis MEMS gyroscope & accelerometer; 3-axis magnetometer
  • Power supply – 12VDC power adapter, or optional 3.7V/2,500 mAh battery
  • Dimensions – 90 x 70 mm

Click to Enlarge

The company provides support for Android Nougat for the board, with Linux support available on request.

The development kit can be pre-ordered for $349 by companies interested in developing their products with the solution, and includes the board itself, a 7″ LCD capacitive touch display, a 12V power supply, a USB type A to Micro-B cable, an “Android delivery package”, and documents. Customers will also get 4 weeks free technical support from the date of kit is received. You may want to visit the product page for further information.

Intrynsic Open-Q 835 Development Kit Features Qualcomm Snapdragon 835 Processor, Support Android 7 and Windows 10

June 7th, 2017 1 comment

Intrinsyc has just launched one of the first development boards powered by Qualcomm Snapdragon 835 processor with their Open-Q 835 devkit equipped with 4GB LPDDR4x, 128GB UFS 2.1 flash, 802.11ad WiFi, dual camera support and more.

Open-Q 835 Devkit with Cooling Plate Underneath

Open-Q 835 development kit is comprised of a “processor board” and a baseboard with the following specifications:

  • Processor Board
    • SoC – Qualcomm Snapdragon 835 (APQ8098) octa-core processor with four high performance Kryo 280 cores @ 2.20 GHz/ 2.30 GHz (single core operation), four low power Kryo cores @ 1.9 GHz, Adreno 540 GPUwith  OpenGL ES 3.2, OpenCL 2.0 Full support, and Hexagon 682 DSP with Hexagon Vector eXtensions (dual-HVX512)
    • System Memory – 4GB LPDDR4x RAM
    • Storage – 128GB UFS2.1 Gear3 2 lane Flash
    • Connectivity
      • Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2
      • Bluetooth 5.0 + BLE
      • WiGig60 802.11ad with on-board antenna
    • Dimensions – 70 x 60 mm
  • Carrier Board
    • Display – 1x HDMI 2.0 out up to 4K Ultra HD, 2x 4 lane MIPI DSI + Touch Panel connector for optional LCD panel accessory
    • Audio
      • On-board Audio Codec; Audio in & out expansion headers, 1x ANC Headset Out
      • Optional SW features – Qualcomm Fluence HD with Noise Cancellation, high fidelity music playback 24-bit/192kHz, Dolby 5.1 support
    • Camera
      • 3x 4-lane MIPI CSI connectors
      • Dual Qualcomm Spectra 180 ISP
      • Optional SW Features – Qualcomm Clear Sight camera; Hybrid Autofocus, Optical Zoom; HW-accelerated Face Detection; HDR Video Record
    • Other Interfaces
      • GNSS daughter card with GPS, GLONASS, Beidou, and Galileo, PCB antenna and SMA connector option
      • 1x UART debug (USB micro-B)
      • 1x USB3.1 Type C
      • 1x uSD 3.0 UHS-1
      • I2S, SPI, GPIO, sensor header
    • Power Supply – 12V/3A DC; optional 3,000 Li-Ion battery
    • Dimensions  — 170mm x 170mm (mini-ITX form factor)

The company provides support for Android 7 Nougat, and Windows 10 should be feasible too but you are asked to “contact sales”. An optional WQHD AMOLED LCD is also available. Intrynsic explains the development kit is particularly suited for OEMS and device makers evaluating the processor and peripherals, and for premium mobile device development.

The “Early Adopter Version” of Open-Q 835 development kit can be purchased for $1,149, subject to an approval process. You may be able to find additional details on the product page.

Nordic Thingy:52 Bluetooth 5 IoT Sensor Development Kit Targets Mobile & Web App Developers

June 4th, 2017 No comments

Some developers may be interested in providing solutions for the Internet of Things, but they may not have the skills or interest in making their own hardware, and/or develop firmware, and just want to create demos or prototypes quickly, focusing on app development instead. Nordic Semiconductors has recently launched Thingy:52 IoT Sensor Kit with Bluetooth 5 & NFC connectivity, and various sensors for those developers.

Nordic:52 IoT Sensor development kit (nRF6936) hardware specifications:

  • MCU – Nordic Semi nRF52832 ARM Cortex-M4F Bluetooth 5 System on Chip (SoC)
  • Connectivity – Bluetooth 5 LE and NFC
  • Sensors
    • Temperature,Humidity, Air pressure, Air quality (CO2 and TVOC), color and light intensity
    • 9-axis motion sensing – Tap detection, orientation, step counter, quaternions, euler angles, rotation matrix, gravity vector, compass heading, raw  accelerometer, gyroscope, and compass data
  • Audio
    • Speaker for playing prestored samples, tones, or sound streamed over BLE (8-bit 8 kHz LoFi)
    • Microphone streaming (ADPCM compressed 16-bit 16 kHz)
  • Expansion Headers (all unpopulated)
    • 20-pin header with GPIOs, I2C, Analog inputs
    • 2x 4-pin I2C headers
    • 4-pin analog/digital header (2 I/O)
    • 4-pin analog/digital header (1 I/O)
  • Misc – Configurable RGB LEDs and button; programming & debugging connector
  • Power Supply – 5V via micro USB port, LiPo battery connector (A battery is already included in the devkit)
  • Dimensions – 6×6 cm plastic & rubber case

Click to Enlarge

Nordic provides example apps for Android & iOS with cloud connectivity for the devkit, as well as a web application relying on Web Bluetooth API. Thingy:52 kit supports secure Over-the-Air device firmware upgrade (DFU). While the company promote the kit to app developers, the application firmware source code and hardware design files are also available for download. You’ll find all info on Nordic Semi’s Infocenter. A Node.js library is also available for the board on Github.

Nordic Thingy:52 can be purchased for around $40 via distributors such as Mouser, Digikey, and Arrow.

Thanks to Jan for the tip.

MYiR Tech MYC-JA5D2X System-on-Module is Powered by Microchip ATSAMA5D2 Cortex A5 Processor

March 16th, 2017 No comments

MYIR Tech has released MYC-JA5D2X system-on-module powered by a Microchip Atmel SAMA5D2 ARM Cortex A5 processor with 256MB flash, and 256 MB DDR3. The module relies on a SO-DIMM edge connector to expose the camera interface, Ethernet, USB, camera, and other I/O signals.

MYC-JA5D2X CPU module specifications:

  • SoC – Atmel SAMA5D26 or SAMA5D27 ARM Cortex A5 processor @ up to 500 MHz with 128KB L2 cache
  • System Memory – 256MB DDR3 SDRAM
  • Storage – 256MB NAND flash, 4MB data flash, 64KB EEPROM
  • Connectivity – On-board 10/100M Ethernet PHY
  • 200-pin SO-DIMM edge connector with:
    • 1x Ethernet
    • 1x USB Host, 1x USB Device, 1x USB HSIC (HSIC is only for SAMA5D27)
    • Up to 10x serial ports, up to 2 x CAN (only for SAMA5D27)
    • Up to 7 x I2C, up to 7 x SPI
    • Up to 2 x QSPI
    • 12 x 12-bit ADC (enhanced resolution up to 14 bits)
    • 4x PWM
    • 1x 4-bit SDIO
    • 1x 24-bit LCD
    • Up to 2x SSC, compatible with I2S
    • 1x 12-bit Camera Interface
    • 1x SMC (Supports parallel external memory interface)
    • Up to 97x GPIOs
  • Misc – Power and user LEDs
  • Power supply – 3.3V/0.5A
  • Dimensions – 67.6 mm x 45mm (8-layer PCB)
  • Temperature Range – -40 ~ 85 °C (industrial grade)

The company provides Linux 4.1 for the module. MYC-JA5D2X SoM is very similar to the company’s MYC-JAD5D4X module launched early las year, except it’s using the more power efficient SAMA5D2 processor instead of a SAMA5D4 processor clocked at 600 MHz, and they have reduced costs by lowering the default amount of storage and memory.

MYIR also offers MYD-JA5D2X development board combining a baseboard with MYC-JA5D2X CPU module, and bring out various interfaces, headers, and connectors such as serial ports, USB Host and Device ports, a CAN & RS485 terminals, an Ethernet port, RS485, audio in/out, LCD and camera connectors, etc…

MYC-JA5D2X system-on-module sells for $49 with ATSAMA5D27 processor, while MYD-JA5D2X development board goes for $129 as part of kit that also adds a power adapter and various cables. More information about both products can be found on MYiR Tech website.