HiSilicon Unveils Kirin 980 Octa-core Cortex A76/A55 Processor with Mali-G76 GPU

Arm announced Cortex A76 CPU core and Mali-G76 GPU in June of this year, and in the past, we normally had to wait about a year between the announcement and the actual launch of SoC with the new IP core. But courtesy of HiSilicon (Huawei), we already know of one Cortex A76 processor with Kirin 980 processor featuring three clusters with two high performance Cortex A76 cores, two Cortex A76 cores clocked at a low frequency, and four Cortex A55 efficiency core. The company also added the new Mali-G76 GPU for good measure. Kirin 980 specifications and key features: CPU (DynamIQ clusters) 2x Cortex A76 cores @ up to 2.60 GHz with 512KB L2 cache 2x Cortex A76 cores @ up to 1.92 GHz with 512KB L2 cache 4x Cortex A55 cores  @ 1.80 GHz with 128KB L2 cache 4MB shared L3 cache GPU – ARM Mali-G76MP10 @ 720 MHz NPU – Dual NPU (Neural Processing Unit) with twice the …

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Hisilicon Hi3559A V100ES is an 8K Camera SoC with a Neural Network Accelerator

Earlier today, I published a review of JeVois-A33 machine vision camera, noting that processing is handled by the four Cortex A7 cores of Allwinner A33 processor, but in the future we can expect such type of camera to support acceleration with OpenCL/Vulkan capable GPUs, or better, Neural network accelerators (NNA) such Imagination Tech PowerVR Series 2NX. HiSilicon already launched Kirin 970 SoC with such similarIP, except they call it an NPU (Neural-network Processing Unit). However, while looking for camera SoC with NNA, I found a list of deep learning processors, including the ones that go into powerful servers and autonomous vehicles, that also included a 8K Camera SoC with a dual core CNN (Convolutional Neural Network) acceleration engine made by Hisilicon: Hi3559A V100ES. Hisilicon Hi3559A V100ES specifications: Processor Cores 2x ARM Cortex A73 @ 2 GHz, 32 KB I cache, 64KB D cache or 512 KB L2 cache 2x ARM Cortex A53 @ 1 GHz, 32 KB I cache, 32KB …

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HiSilicon Hi3796M V200 UHD DVB + H.265 STB SoC Showcased at Broadcast Asia 2017

Broadcast Asia international digital multimedia & entertaiment technology exhibition & conference is taking place in Singapore on May 23 – 25, and I’ve been informed that Hisilicon showcased their latest Hi3796M V200 Set-top box SoC with support for 4K DVB, H.265, and high dynamic range technology such as HDR10, HLG and Dolby Vision. Key features and specifications of Hi3796M V200 processor: CPU – Quad core ARM Cortex A53 GPU – ARM Mali-450MP Memory – DDR3, DDR3L, DDR4 Video Output – 1x HDMI 2.0a Tx with HDCP 2.2 Video format – HEVC, H.264, MPEG2, MPEG4, VC1, VP9, AVS 2.0 HDR – HDR10, HLG, Dolby Vision, HDR and SDR conversion HiVXE 2.0 VPU – Decoder – 4K60 10-bit; Encoder – HEVC/H.264 1080p30 or 2x 720p30 Ethernet – 1x Gigabit Ethernet, 1x Fast Ethernet USB 2.0 – 2x USB 2.0 ports SATA & PCIe & USB 3.0 – USB 3.0, SATA 3.0, PCIe 2.0 host interface (optional); cnxsoft’s note: all ports are likely …

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Qualcomm Snapdragon 845 Octa-core Processor To Feature ARM Cortex A75 Cores (Reports)

According to reports from China, Qualcomm’s next application processor (or rather mobile platform) will be Snapdragon 845, and if accurate, the comparison table below between the Snapdragon processor and Hisilicon Kirin 970 SoC shows the former will be powered by some customized (魔改) version of yet-to-be announced ARM Cortex 75 cores. Snapdragon 845 octa-core processor will be manufactured using Samsung 10nm LPE processor, come with four custom Cortex A75 cores, four Cortex A53 cores, an Adreno 630 GPU, and an LTE X20 modem supporting LTE Cat 18 for up to 1.2 Gbps download speed. Other features like 802.11ad (High bandwidth, short range WiFi), UFS 2.1, and LPDDR4X were already found on earlier model. I’ve been unable to find further details about ARM Cortex A75 right now, and we have to wait until ARM Techcon 2017 before getting more details. Mobile phones powered by Snapdragon 845 are supposed to start shipping in Q1 2018. Via Wccftech Support CNX Software – Donate …

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HiSilicon Kirin 960 Octa Core Application Processor Features ARM Cortex A73 & A53 Cores, Mali G71 MP8 GPU

Following on Kirin 950 processor found in Huawei Mate 8, P9, P9 Max & Honor 8 smartphones, Hisilicon has now unveiled Kirin 960 octa-core processor with four ARM Cortex A73 cores, four Cortex A53 low power cores, a Mali G71 MP8 GPU, and an LTE Cat.12 modem. The table below from Anandtech compares features and specifications of Kirin 950 against the new Kirin 960 processor. SoC Kirin 950 Kirin 960 CPU 4x Cortex A72 (2.3 GHz) 4x Cortex A53 (1.8 GHz) 4x Cortex A73 (2.4 GHz) 4x Cortex A53 (1.8 GHz) Memory Controller LPDDR3-933 or LPDDR4-1333 (hybrid controller) LPDDR4-1800 GPU ARM Mali-T880MP4 @ 900 MHz ARM Mali-G71MP8 @ 900 MHz Interconnect ARM CCI-400 ARM CCI-550 Encode/ Decode 1080p H.264 Decode & Encode2160p30 HEVC Decode 2160p30 HEVC & H.264 Decode & Encode2160p60 HEVC Decode Camera/ISP Dual 14bit ISP 940MP/s Improved Dual 14bit ISP Sensor Hub i5 i6 Storage eMMC 5.0 UFS 2.1 Integrated Modem Balong Integrated UE Cat. 6 LTE Integrated UE Cat. 12 LTE 4x …

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HICAT.Livera Machine Vision Board and Robot Kit Feature HiSilicon Hi3518 SoC (Crowdfunding)

HiSilicon Hi3518 ARM9 processor is mostly being used in IP cameras, but Hicat startup decided to combined the camera processor with an Atmel MCU and a MT7601 WiFi module to create a wireless camera board to be used with OpenCV, and even provide a complete affordable robot kit with the board. Hicat.livera board specifications: Vision Core – Hisilicon Hi3518 ARM9 processor @ 440 MHz Storage – 16MB flash + micro SD card MCU – Atmel ATmega32U4 AVR micro-controller Connectivity – 802.11 b/g/n WiFi via Mediatek MT7601 module + u.FL antenna connector Camera interface with provided 140 deg. camera using Omnivision OV9712 720p (1280×720) sensor USB – 1x micro USB port for power and programming Audio – Built-in microphone, speaker header Sensors – MPU6050 accelerometer and gyro Expansion – 2x GPIO headers with GPIOs, I2C, SPI, serial, PWM, digital, analog and power signals. Misc – MCU reset and Linux reset buttons, Power Supply – 5V via USB or 3.3V LiPo battery …

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Hisilicon Hi3798M V200 SoC to Allow for Cheaper 4K TV Boxes with Gigabit Ethernet, SATA, and/or USB 3.0

One year after Hisilicon Hi3798C V200 processor was unveiled at IBC 2015, Hisilicon has now introduced a cost down version named Hisilicon Hi3798M V200 at IBC 2016 with a lower-end Mali-450 GPU, only 2 TS input interfaces, one less USB 3.0 interface, and only 1x GMAC (Gigabit Ethernet MAC) or 1x Fast Ethernet PHY, instead of two GMAC interfaces. The processor also adds 1080p30 H.265 video encoding. Hisilicon Hi3798M V200 key features: CPU – Quad core Cortex A53 processor (15K DMIPS) GPU – ARM Mali-450 + Hisilicon dual-core GPU Memory I/F – 32-bit DDR3/3L/4 Storage I/F – eMMC/NAND/SPI, 1x SATA 3.0, 2x SDIO Video Engine (VPU) HiVXE 2.0 video engine supporting 4Kp60 10-bit H.265 and VP9 decoding, 4Kp30 H.264, MPEG-2, MPEG-4, VC1, VP6/VP8, Real Media 8/9/10 Encoder – H.264/H.265 @ 1080p30 or dual 720p30 Imprex 2.0 processing engine with support for HDR10 & HLG high dynamic range, BT.709/BT.2020, etc.. Peripherals: Video Output – HDMI 2.0a TX with HDCP 2.2 up …

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ARM announces “premium IP” for VR and AR with Cortex-A73 Processor and Mali-G71 GPU

Today ARM has revealed the first details of its latest mobile processor and GPU, both said to be optimized for VR (Virtual Reality) and AR (Augmented Reality) applications. Starting with the ARM Cortex-A73, we’re looking at an evolution of the current Cortex-A72 with ARM claiming 30 percent “sustained” performance over the Cortex-A72 and over twice the performance over the Cortex-A57. ARM is already talking about clock speeds of up to 2.8GHz in mobile devices. Other improvements include an increase up to 64k L1 instruction and data cache, up from 48 and 32k respectively for the Cortex-A72, as well as up to 8MB of L2 cache. The Cortex-A73 continues to support ARM’s big.LITTLE CPU design in combination with the Cortex-A53 or the Cortex-A35. It’s also the first ARM core to have been designed to be built using 10nm FinFET technology and it should be an extremely small CPU at around 0.65 square millimeters per core, or a 46 percent shrink from …

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