HiSilicon Hi3559A Board Enables Smart 8K Camera Development

Hi3559A 8K camera board

HiSilicon Hi3559A 5-core Arm Cortex A73/A53 camera processor was announced in 2017 with support for 8K 30fps or 4K 120fps video recording, as well as an integrated dual core neural network accelerator (NNA). It should not be confused with the earlier Hi3559 4K 30 fps processor, or the newer Hi3559C that looks to be the same as Hi3559A without the NNA. Nevertheless, today I was lead to check about Hi3559A processor once again, and I could not find any camera that you can just buy and use today. I still found some upcoming Hi3559A products with OBSBOT Tail AI camera offered for as low as $509 on Kickstarter (delivery scheduled for April 2019), one 4K  120fps OEM? camera from GKuvision, as well as an HiSilicon Hi3559A development board for 8K camera applications, which I’ll look into more details in this blog post. HI3559AV100DMEB specifications: SoC – Hisilicon Hi3559A V100 with 2x Arm Cortex A73 cores @ 1.8 GHz, 2x Arm …

HiSilicon Hi1620 Server SoC to Features up to 64 Arm “Ares” Cores

Huawei Hi1620

A few years ago we covered Hisilicon D02 server board powered by the company’s Hip05 SoC with 16 or 32 Arm Cortex A57 cores. I had not seen any updates since then myself, but HiSilicon has released new “TaiShan” Arm based server SoCs every year, and recently unveiled Hi1620, the world’s first 7nm datacenter Arm processor, featuring 24 to 64 Arm “Ares” cores clocked at up to 3.0 GHz. Ares cores are supposed to greatly improve single thread performance in order to compete with x86 server chips. HiSilicon Hi1620 processors specifications: CPU – 24 to 64 Ares ARMv8.2 cores clocked at 2.4 – 3.0 GHz Cache – L1: 64KB I-cache, 64KB D-cache; L2: 512KB private per core, L3: 24-64 shared among cores (1MB/core) Memory – 8x DDR4 channels up to 3200 MHz Interconnect – Coherent SMP interface for 2S & 4S, 3 ports up to 240 Gbit/s per port I/Os 40x PCIe Gen 4.0 lanes 2x 100 GbE, RoCEv2/RoCEv1, CCIX …

HiSilicon Unveils Kirin 980 Octa-core Cortex A76/A55 Processor with Mali-G76 GPU

Arm announced Cortex A76 CPU core and Mali-G76 GPU in June of this year, and in the past, we normally had to wait about a year between the announcement and the actual launch of SoC with the new IP core. But courtesy of HiSilicon (Huawei), we already know of one Cortex A76 processor with Kirin 980 processor featuring three clusters with two high performance Cortex A76 cores, two Cortex A76 cores clocked at a low frequency, and four Cortex A55 efficiency core. The company also added the new Mali-G76 GPU for good measure. Kirin 980 specifications and key features: CPU (DynamIQ clusters) 2x Cortex A76 cores @ up to 2.60 GHz with 512KB L2 cache 2x Cortex A76 cores @ up to 1.92 GHz with 512KB L2 cache 4x Cortex A55 cores  @ 1.80 GHz with 128KB L2 cache 4MB shared L3 cache GPU – ARM Mali-G76MP10 @ 720 MHz NPU – Dual NPU (Neural Processing Unit) with twice the …

Hisilicon Hi3559A V100ES is an 8K Camera SoC with a Neural Network Accelerator

Earlier today, I published a review of JeVois-A33 machine vision camera, noting that processing is handled by the four Cortex A7 cores of Allwinner A33 processor, but in the future we can expect such type of camera to support acceleration with OpenCL/Vulkan capable GPUs, or better, Neural network accelerators (NNA) such Imagination Tech PowerVR Series 2NX. HiSilicon already launched Kirin 970 SoC with such similarIP, except they call it an NPU (Neural-network Processing Unit). However, while looking for camera SoC with NNA, I found a list of deep learning processors, including the ones that go into powerful servers and autonomous vehicles, that also included a 8K Camera SoC with a dual core CNN (Convolutional Neural Network) acceleration engine made by Hisilicon: Hi3559A V100ES. Hisilicon Hi3559A V100ES specifications: Processor Cores 2x ARM Cortex A73 @ 2 GHz, 32 KB I cache, 64KB D cache or 512 KB L2 cache 2x ARM Cortex A53 @ 1 GHz, 32 KB I cache, 32KB …

HiSilicon Hi3796M V200 UHD DVB + H.265 STB SoC Showcased at Broadcast Asia 2017

Broadcast Asia international digital multimedia & entertaiment technology exhibition & conference is taking place in Singapore on May 23 – 25, and I’ve been informed that Hisilicon showcased their latest Hi3796M V200 Set-top box SoC with support for 4K DVB, H.265, and high dynamic range technology such as HDR10, HLG and Dolby Vision. Key features and specifications of Hi3796M V200 processor: CPU – Quad core ARM Cortex A53 GPU – ARM Mali-450MP Memory – DDR3, DDR3L, DDR4 Video Output – 1x HDMI 2.0a Tx with HDCP 2.2 Video format – HEVC, H.264, MPEG2, MPEG4, VC1, VP9, AVS 2.0 HDR – HDR10, HLG, Dolby Vision, HDR and SDR conversion HiVXE 2.0 VPU – Decoder – 4K60 10-bit; Encoder – HEVC/H.264 1080p30 or 2x 720p30 Ethernet – 1x Gigabit Ethernet, 1x Fast Ethernet USB 2.0 – 2x USB 2.0 ports SATA & PCIe & USB 3.0 – USB 3.0, SATA 3.0, PCIe 2.0 host interface (optional); cnxsoft’s note: all ports are likely …

Qualcomm Snapdragon 845 Octa-core Processor To Feature ARM Cortex A75 Cores (Reports)

According to reports from China, Qualcomm’s next application processor (or rather mobile platform) will be Snapdragon 845, and if accurate, the comparison table below between the Snapdragon processor and Hisilicon Kirin 970 SoC shows the former will be powered by some customized (魔改) version of yet-to-be announced ARM Cortex 75 cores. Snapdragon 845 octa-core processor will be manufactured using Samsung 10nm LPE processor, come with four custom Cortex A75 cores, four Cortex A53 cores, an Adreno 630 GPU, and an LTE X20 modem supporting LTE Cat 18 for up to 1.2 Gbps download speed. Other features like 802.11ad (High bandwidth, short range WiFi), UFS 2.1, and LPDDR4X were already found on earlier model. I’ve been unable to find further details about ARM Cortex A75 right now, and we have to wait until ARM Techcon 2017 before getting more details. Mobile phones powered by Snapdragon 845 are supposed to start shipping in Q1 2018. Via Wccftech

HiSilicon Kirin 960 Octa Core Application Processor Features ARM Cortex A73 & A53 Cores, Mali G71 MP8 GPU

Following on Kirin 950 processor found in Huawei Mate 8, P9, P9 Max & Honor 8 smartphones, Hisilicon has now unveiled Kirin 960 octa-core processor with four ARM Cortex A73 cores, four Cortex A53 low power cores, a Mali G71 MP8 GPU, and an LTE Cat.12 modem. The table below from Anandtech compares features and specifications of Kirin 950 against the new Kirin 960 processor. SoC Kirin 950 Kirin 960 CPU 4x Cortex A72 (2.3 GHz) 4x Cortex A53 (1.8 GHz) 4x Cortex A73 (2.4 GHz) 4x Cortex A53 (1.8 GHz) Memory Controller LPDDR3-933 or LPDDR4-1333 (hybrid controller) LPDDR4-1800 GPU ARM Mali-T880MP4 @ 900 MHz ARM Mali-G71MP8 @ 900 MHz Interconnect ARM CCI-400 ARM CCI-550 Encode/ Decode 1080p H.264 Decode & Encode2160p30 HEVC Decode 2160p30 HEVC & H.264 Decode & Encode2160p60 HEVC Decode Camera/ISP Dual 14bit ISP 940MP/s Improved Dual 14bit ISP Sensor Hub i5 i6 Storage eMMC 5.0 UFS 2.1 Integrated Modem Balong Integrated UE Cat. 6 LTE Integrated UE Cat. 12 LTE 4x …

HICAT.Livera Machine Vision Board and Robot Kit Feature HiSilicon Hi3518 SoC (Crowdfunding)

HiSilicon Hi3518 ARM9 processor is mostly being used in IP cameras, but Hicat startup decided to combined the camera processor with an Atmel MCU and a MT7601 WiFi module to create a wireless camera board to be used with OpenCV, and even provide a complete affordable robot kit with the board. Hicat.livera board specifications: Vision Core – Hisilicon Hi3518 ARM9 processor @ 440 MHz Storage – 16MB flash + micro SD card MCU – Atmel ATmega32U4 AVR micro-controller Connectivity – 802.11 b/g/n WiFi via Mediatek MT7601 module + u.FL antenna connector Camera interface with provided 140 deg. camera using Omnivision OV9712 720p (1280×720) sensor USB – 1x micro USB port for power and programming Audio – Built-in microphone, speaker header Sensors – MPU6050 accelerometer and gyro Expansion – 2x GPIO headers with GPIOs, I2C, SPI, serial, PWM, digital, analog and power signals. Misc – MCU reset and Linux reset buttons, Power Supply – 5V via USB or 3.3V LiPo battery …