Arm Techcon 2019 Schedule – Machine Learning, Security, Containers, and More

Arm Techcon 2019

Arm TechCon will take place on October 8-10, 2019 at San Jose Convention Center to showcase new solutions from Arm and third-parties, and the company has now published the agenda/schedule for the event. There are many sessions and even if you’re not going to happen it’s always useful to checkout what will be discussed to learn more about what’s going on currently and what will be the focus in the near future for Arm development. Several sessions normally occur at the same time, so as usual I’ll make my own virtual schedule with the ones I find most relevant. Tuesday, October 8  09:00 – 09:50 – Open Source ML is rapidly advancing. How can you benefit? by Markus Levy, Director of AI and Machine Learning Technologies, NXP Over the last two years and still continuing, machine learning applications have benefited tremendously from the growing number of open source frameworks, tools, and libraries to support edge inferencing. These include CMSIS-NN, ARM …

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AAEON Launches BOXER-8150AI Compact Embedded Box PC Features 8 USB 3.0 Ports

BOXER-8150AI

The new compact embedded solutions’ addition to the BOXER-8100AI family is specially designed for artificial intelligence (AI) support. According to its makers, AAEON, it has a configuration of eight USB 3.0 ports made available through four USB controllers chips. This makes it perfect for a wide range of computer vision applications, some of which are visual inspection, quality control, and facial recognition. Now, each USB chip controls a pair of USB 3.0 ports. By dedicating one chip to one pair of ports, each chip handles less data traffic overall.   This also improves bandwidth from connected devices and allows the BOXER-8150AI to maximize speeds and framerates of AI image processing. The product is currently in stock and available for purchase on AAEON online store for $1,142.00. Key Features of BOXER-8150AI Nvidia TX2 Module HMP Dual Denver 2 + Quad ARM A57 8GB LPDDR4 32GB eMMC 5.1 HDMI 2.0 8x USB 3.0 1x GbE LAN 1x COM Compact Size chassis The …

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ASRock 4×4 Box is a Compact Mini PC Based on AMD Ryzen Embedded R1000/V1000

The mini PC market has a new product from ASRock, a company, well known for its motherboards and Mini PCs. Following up on their iBOX-R1000 Ryzen Embedded R1000 mini PC, the ASRock 4×4 Box is now available with either the AMD Ryzen Embedded R1000 processor or the AMD Ryzen Embedded V1000 processor in a smaller form factor. Right now, the new mini PC targets the industrial sector, and not the consumer market. This addition to the industrial motherboards and rugged mini PCs line, the 4×4 Box R1000 and V1000 offers more features and are designed to fit in a smaller case, hence the 4×4 name which likely refers to the 4″x4″ dimensions of the motherboard. The AMD Ryzen Embedded is finding its way into all kinds of industrial and medical uses, because of its Radeon VEGA graphics capability and processing enhancements over the R or C series processors. The ASRock 4×4 Box takes full advantage of the Ryzen’s capability with …

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ModBerry M500 Industrial Computer Gets Upgraded to Raspberry Pi 4

Raspberry Pi 4 Industrial Computer

We first wrote about Modberry M500 industrial computer when it was upgraded from Raspberry Pi 3 to Raspberry Pi 3 B+, and added PoE support. With the launch of Raspberry Pi 4 model B, it should come as no surprise that Techbase has now announced Modberry M500 would be available with the latest board from the Raspberry Pi Foundation. Modberry M500 RPI 4 preliminary specifications: SoC – Broadcom BCM2711B0 quad-core Arm Cortex-A72 processor @ 1.5 GHz with VideoCore VI GPU System Memory – 1GB, 2GB or 4GB LPDDR4 Storage – 4GB eMMC flash (TBC), and/or 8GB micro SD card Video & Audio Output – HDMI 2.0 up to 4K @ 60Hz and 3.5mm jack for CVBS (composite + stereo audio) Connectivity True Gigabit Ethernet, up to 2x optional 10/100M Ethernet ports Dual band 802.11 b/g/n WiFi and Bluetooth 5.0 LE Optional Zigbee, LTE/3G, GPS, WiFi, and Bluetooth cards USB – 2x USB 2.0 host ports, 2x USB 3.0 host ports …

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iWave Systems Unveils iW-RainboW-G34M-SM i.MX 8M Mini/Nano System-on-Module

i.mx 8m nano system-on-module

NXP nomenclature for their i.MX 8M processors can be a little confusing. First discovered in 2016, the original i.MX 8M processor family comes with one to four Arm Cortex-A53 cores, a real-time Cortex M4 core, targets multimedia application with FullHD or  4K decoding/encoding support and is manufactured using a 28nm process. NXP then announced i.MX 8M Mini processor family in February 2018 with a 14-nm FinFET processor allowing a higher maximum CPU frequency of 2.0 GHz, less video output interfaces (no HDMI, nor DisplayPort), and optional Full HD video encoder and decoder, .e.g no 4K. Finally, earlier this year, the company unveiled NXP i.MX 8M Nano further power-optimized with the same 14nm manufacturing process, but a lower frequency of 1.5 GHz, and a Cortex-M7 core replacing the Cortex-M4 core found in previous i.MX 8M processors. This allows i.MX 8M Nano SoC to have a 2W TDP, and achieve sub-watt power consumption in IoT edge projects. We’ve already written about i.MX …

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Shuttle EN01J is a Tiny Apollo Lake Mini PC Topped with a Large Heatsink

Shuttle EN01 Mini PC

Many people don’t want heatsink, but in some case fanless designs do not allow for maximum sustained performance. This should not be a problem for Shuttle EN01J mini PC with a choice of 10W Apollo Lake processors, and a rugged design completed with a large heatsink topping the enclosure used to make sure the processor runs optimally for the target applications, which include digital signage, industrial automation, and visual recognition applications as reported by FanlessTech. Shuttle EN01J specifications: SoC (One or the other) – Intel Celeron J3355 dual core, Celeron J3455 quad core, or Pentium J4200 quad core processor with Intel HD graphic; 10W TDP System Memory – Up to 8GB LPDDR4 2,400 MHz Storage – Up to 64GB eMMC flash, microSD card slot Video Output – HDMI 1.4 up to 3840z2160 @ 30 Hz Connectivity – Gigabit Ethernet (Intel) with optional POE-PD or POE-PSE, nano SIM slot for M.2 modem USB – 2x USB 3.1 Gen 1 ports, 1x …

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Google Glass Enterprise Edition v2 Features Snapdragon XR1 Processor

Google Glass Enterprise Edition v2

To be honest, I was pretty happy when it was clear that smart glasses for the consumer market would not take off, and I would be living in a better, smart glasses-free, world. But I also reckoned that those could have use in professional settings, and Google Glass Enterprise edition was first spotted in 2015 with an Atom processor. The company has now launched an upgraded model with Google Glass Enterprise Edition v2 powered by Qualcomm Snapdragon XR1 eXtended reality (XR) platform. Google Glass Enterprise Edition v2 specifications: SoC – Qualcomm Snapdragon XR1 quad-core Kryo processor @ 1.7GHz with Adreno GPU, Qualcomm AI Engine for on-device processing; 10nm manufacturing process System Memory – 3GB LPDDR4 Storage – 32GB eMMC flash storage Display – 640×360 Optical Display Module Audio out – Mono Speaker, USB audio, BT audio Microphones – 3 beam-forming microphones Camera – 8MP, 80 DFOV Connectivity – Wi-Fi 5 802.11ac, dual-band, single antenna and Bluetooth 5.x AoA (Angle of …

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Espressif ESP32-S2 Secure WiFi MCU Comes with an Xtensa LX7 Core @ 240 MHz

ESP32-S2

Espressif Systems has unveiled a new ESP32 WiFi MCU based on Cadence (previously Tensilica) Xtensa LX7 core instead of the usual Xtensa LX6 core(s). ESP32-S2 is powered by a single Xtensa LX7 core clocked at 240 MHz, supports Wi-Fi HT40 @ 2.4 GHz, and provides up to 43 GPIOs. Espressif ESP32-S2 specifications: CPU – Cadence Xtensa single-core 32-bit LX7 microcontroller @ up to 240 MHz, and ultra-low-power co-processor System Memory – 320 kB SRAM, external SPIRAM support up to 128 MB in total, 16 KB RTC memory Storage –  128 kB ROM, up to 1 GB of external flash support Connectivity Wi-Fi 802.11 b/g/n 1×1 transmit and receive with HT40 support with data rate up to 150 Mbps Support for TCP/IP networking, ESP-MESH networking, TLS 1.0, 1.1 and 1.2 and other networking protocols over Wi-Fi Support Time-of-Flight (TOF) measurements with normal Wi-Fi packets I/O & peripherals 43x programmable GPIOs 14x capacitive touch sensing IOs SPI, I2C, I2S, UART, ADC/DAC, and …

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