NXP i.MX 7ULP Enters Mass-Production, EVK and Systems-on-Module Announced

Last year, we wrote about F&S Elektronik Systeme PicoCORE MX7 system-on-module (SoM) powered by NXP i.MX 7ULP processor manufactured with a 28nm FD-SOI process, and that was announced a year earlier. The official launch of the module was planned for Q3 2018, but there have been some delays as LinuxGizmos reports NXP has only started mass production of their i.MX7 ULP this June. With the official launch of i.MX 7ULP, the company also introduced the official i.MX 7ULP Evaluation Board (MCIMX7ULP-EVK) as showcased on Element14’s community and several other companies announced i.MX 7ULP systems-on-modules. Benefits of NXP i.MX 7ULP Processor The i.MX7 ULP family of processors is an extremely power-efficient series, that is utilizing lower power for more functions. The SoC is being touted as the most power-efficient processor that can be obtained that also houses a 3D GPU.  Although like the i.MX7, the i.MX 7ULP combines both Cortex-A7 and Cortex-M4 cores but can effectively bring the power states even …

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NXP i.MX 8M Nano is a Power-optimized Arm Cortex-A53/M7 Processor

NXP i.MX 8M Nano

NXP introduced their first 14nm i.MX processor at Embedded World 2018 last year with i.MX 8 Mini processor equipped with up to four Cortex A53 cores clocked at 2.0 GHz and one real-time Cortex-M4 cores clocked at 400+ MHz, and optional 1080p video output and decoding/encoding. The company has now added another 14nm member to their i.MX 8M family with NXP i.MX 8M Nano family also featuring four Cortex-A53 cores at up to 1.5 GHz, but replacing the Cortex-M4 by a more powerful Cortex-M7 core clocked at up to 600 MHz. The processor is also power-optimized for less than 2W total dynamic power (TDP) and sub-watt in many IoT edge applications. NXP i.MX 8M Nano key features and specifications: Application cores – One to four Arm Cortex-A53 cores up to 1.5 GHz per core; 32KB L1-I Cache/ 32 KB L1-D Cache; 512 KB L2 Cache Real-time core – Arm Cortex-M7 at speeds of up to 600 MHz; 16 KB L1-I …

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NXP Immersiv3D Enables DSP-Free Dolby Atmos & DTS:X Audio Systems

NXP Immersiv3d audio reference design

High-fidelity audio systems such as soundbars, smart speakers, and AV receivers have traditionally relied on DSPs (Digital Signal Processors) to deliver low-latency audio processing, and enable audio and video synchronization. DSPs add to the cost of the overall design however, and with Immersiv3D technology, NXP has leveraged Arm Cortex-A53 and M4 cores in their NXP i.MX 8M Mini processor to completely remove the need for DSP in audio systems, shaving the BoM cost by up to 20%  according to an article on EETimes. Immersiv3D also enables immersive audio support with Dolby Atmos and DTS:X, advanced audio pre/post processing, advanced features like voice control for the smart home. Immersiv3D audio solution was designed to help OEMs to bring to market affordable consumer audio devices with Dolby Atmos and DTS:X, and beside the audio processing software, NXP is also offering an Immersiv3D audio reference design to help them delelop sound bars based on the solution. The press release further explains: The NXP …

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NXP i.MX 6ULZ Cost Efficient Processor Drops Ethernet, Display, & Camera Interfaces

NXP i.MX 6ULZ

Freescale i.MX 6 processor was first announced in January 2011, and in the first few years I covered many products and development boards based on the single to quad core Cortex A9 processor. Further down the road, the company became part of NXP, and launched Cortex A7 variant such as i.MX 6ULL providing both lower costs and power consumption. But now, I usually skip new products based on i.MX6 because they are often just more of the same, and not really new worthy. But yesterday while writing about Linux 4.20 release, I realized I missed the announcement of i.MX 6ULZ processor similar to i.MX 6UL (UltraLight), but cost optimized for applications that do not require Ethernet, display, nor camera interfaces. NXP i.MX 6ULZ key features and specifications with differences with i.MX 6UL highlighted in bold or stricken-through: CPU – ARM Cortex A7 core @ up to 900 MHz with 128KB L2 cache Memory I/F – 16-bit DDR3/DDR3L, LPDDR2 Storage I/F …

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NXP Unveils i.MX RT600 Series Arm Cortex-M33 + Audio DSP Crossover Processor

NXP IMX RT600

A little over a year ago, NXP introduces their first crossover processor that blurs the line between real-time capabilities of microcontrollers and higher performance of application processors with NXP i.MX RT1050 processor equipped with a Cortex-M7 core clocked at up to 700 MHz. The company has now announced another model with lower power consumption. NXP i.MX RT600 series comes with a Cortex M33 core clocked at up to 300MHz, a Cadence Tensillica HiFi 4 audio DSP, and up to 4.5MB shared SRAM. Main features of NXP i.MX RT685 crossover processor: CPU Core – Arm  Cortex-M33 up to 300 MHz DSP – Tensilica Hi-Fi 4 up to 600 MHz Memory Up to 4.5 MB on-chip RAM 128KB DSP TCM, 128 KB DSP Cache Storage 96KB ROM on-chip 2x SDIO with 1x supporting eMMC5.0 w/ HS400 1x Octal/Quad SPI up to 100MB/s Peripherals 2x DMA Engines with 35 channels each 1x USB high speed host/device with PHY 1x SPI  up to 50 …

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Android Things 1.0 Released with Support for NXP i.MX 8M, Qualcomm SDA212/SDA624 and Mediatek MT8516 SoMs

Innocomm-WB10AT

Brillo Project was renamed to Android Things with the release of a developer preview back in December 2014, and the operating system enabling developers and companies to build and maintain Internet of Things devices at scale. The OS has now graduated so-to-speak with the release of Android Things 1.0 with long-term support for production devices, and this was to be expected as several Android Things devices were announced earlier this year. The new release adds supports for new system-on-modules (SoMs) based on the NXP i.MX8M, Qualcomm SDA212, Qualcomm SDA624, and MediaTek MT8516 SoCs. These modules are certified for production use with guaranteed long-term support for 3 years, and development hardware and reference designs for these SoMs will be available in the coming months. The Raspberry Pi 3 Model B and NXP i.MX7D boards and system-on-modules are still supported, but support for NXP i.MX6UL devices will be deprecated. Check out the hardware page for a full list of supported platforms. Google …

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NXP QorIQ LayerScape LX2160A is a 16-core Arm Cortex A72 Communication Processor with 100 Gbit/s Ethernet

NXP Semiconductors has been working  on a high-end communication processor with their QorIQ LayerScape LX2160A SoC equipped with 16 Arm Cortex A72 cores, 16 Ethernet ports supporting 1 to 100 Gbit/s, as well as 24 PCIe Gen4 lanes, and four SATA 3.0 ports. NXP LX2160A key specifications / features: Processor – 16x Arm Cortex-A72 CPU cores, running up to 2.2GHz with 8MB L2 cache, 8MB platform cache Memory I/F – 2 x DDR4 72b including ECC, up to 3200 MT/s, maximum capacity of 256 GB Storage – 4 x SATA3.0 Ethernet Up to 16 Ethernet ports Supported Ethernet speeds include 1, 2.5, 10, 25, 40, 50, and 100 gigabits per second 130Gbps Layer 2 Ethernet switch PCIe – Up to 24 PCIe Gen4 lanes, supporting ports as wide as x8 24 SerDes lanes, operating up to 28GHz Acceleration Engines – 50Gbps security accelerator, 100Gbps data compression/decompression engine Security – Secure boot and Arm TrustZone technology Peripherals – SD, eMMC, 2 …

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NXP Unveils A71CH Secure Element Chip for Secure Peer-to-Peer or Cloud Connections

The industry clearly has an issue at hand with the security of the Internet of Things, and the problem is complex as some devices are easily accessible due to bad configuration (e.g. default username/password), while others may have security flaws at various levels of the software stack from the low level bootloaders to the operating systems, and applications. Nowadays, devices also need to be upgradeable, and communicate with the cloud, and that introduces other attack vectors in case malignant firmware is installed instead, or a man-in-the-middle attack occurs. While some people may claim security can be achieved by software only, we are seeing security evolving towards combined software and hardware solutions, for example with Arm Trustzone built into SoCs, but some companies are also introducing Secure Element chip, which Samsung has already done and integrated into their Artik  modules to secure data from the hardware to the cloud. NXP has now also launched their own A71CH Secure Element (SE), described …

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