NXP Unveils A71CH Secure Element Chip for Secure Peer-to-Peer or Cloud Connections

The industry clearly has an issue at hand with the security of the Internet of Things, and the problem is complex as some devices are easily accessible due to bad configuration (e.g. default username/password), while others may have security flaws at various levels of the software stack from the low level bootloaders to the operating systems, and applications. Nowadays, devices also need to be upgradeable, and communicate with the cloud, and that introduces other attack vectors in case malignant firmware is installed instead, or a man-in-the-middle attack occurs. While some people may claim security can be achieved by software only, we are seeing security evolving towards combined software and hardware solutions, for example with Arm Trustzone built into SoCs, but some companies are also introducing Secure Element chip, which Samsung has already done and integrated into their ArtikĀ  modules to secure data from the hardware to the cloud. NXP has now also launched their own A71CH Secure Element (SE), described …

Qualcomm Centriq 2400 ARM SoC Launched for Datacenters, Benchmarked against Intel Xeon SoCs

Qualcomm Centriq 2400 ARM Server-on-Chip has been four years in the making. The company announced sampling in Q4 2016 using 10nm FinFET process technology with the SoC featuring up to 48 Qualcomm Falkor ARMv8 CPU cores optimized for datacenter workloads. More recently, Qualcomm provided a few more details about the Falkor core, fully customized with a 64-bit only micro-architecture based on ARMv8 / Aarch64. Finally, here it is as the SoC formally launched with the company announcing commercial shipments of Centriq 2400 SoCs. Qualcom Centriq 2400 key features and specifications: CPU – Up to 48 physical ARMv8 compliant 64-bit only Falkor cores @ 2.2 GHz (base frequency) / 2.6 GHz (peak frequency) Cache – 64 KB L1 instructions cache with 24 KB single-cycle L0 cache, 512 KB L2 cache per duplex; 60 MB unified L3 cache; Cache QoS Memory – 6 channels of DDR4 2667 MT/sĀ  for up to 768 GB RAM; 128 GB/s peak aggregate bandwidth; inline memory bandwidth …

Linaro 13.08 Release With Linux Kernel 3.11 and Android 4.3

Linaro 13.08 has been released with Linux Kernel 3.11-rc6 (stating), Kernel 3.10.9 (LSK – beta), and Android 4.3. This month is the first release based on Android 4.3, which was only pushed to AOSP at the end of last month. I can also see work on new SoCs/hardware this month with Texas Instruments Keystone II ARM Cortex A15+DSP SoC and Fujitsu AA9 board (Which processor?, I could not find out). A lot of work also appears to have gone in OpenEmbedded, further optimizations have gone into NEON optimized AES encryption in OpenSSL, and more. It’s also the first time I can see a Ubuntu Raring engineering build image for HighBank (Calxeda Energycore). Here are the highlights of this release: Android Engineering Android stack was tuned to achieve 100% CTS pass result on Android 4.3 Analyzing the UEFI EDK II boot loader for Android completed, implementation of fastboot application and USB drivers in progress. Builds and Baselines Linaro Stable Kernel (beta) …